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    • 1. 发明公开
    • Fluid treatment apparatus and method
    • 流体处理装置和方法
    • EP0547416A3
    • 1994-02-09
    • EP92120389.9
    • 1992-11-28
    • International Business Machines Corporation
    • Bard, Steven LindzJones, Jeffrey Donald
    • H03K3/00C23F1/08B05B13/02
    • H05K3/0085C23F1/08
    • A fluid treatment apparatus and method wherein uniform treatment of a substrate (e.g., a thin, metallic sheet) is treated (e.g., etched) during movement thereof. This treatment involves directing a plurality of fluid jets through a collected first fluid onto one of the substrate's surfaces in such a manner that the fluid of each fluid jet will engage (collide with) the fluid from the nearest fluid jet as a result of being maintained across the substrate's surface at a predetermined velocity prior to mixing of the jets with surrounding fluid. Prevention of such mixing prior to such engagement has proven to assure uniform treatment of the substrate. In one aspect of the invention, fluid is directed onto opposite surfaces of the substrate in this fashion, the fluid from the lower surface, however, being passed through air or similar ambient and thus prevented from mixing therewith prior to such engagement.
    • 一种流体处理装置和方法,其中在移动期间处理(例如,蚀刻)基体(例如,薄金属片)的均匀处理。 该处理涉及将多个流体射流通过收集的第一流体引导到基板的一个表面上,使得每个流体射流的流体将由于维持而与最近的流体射流接合(碰撞)流体 在喷射物与周围流体混合之前以预定速度穿过基底表面。 事实证明,在这种接合之前防止这种混合可以确保基材的均匀处理。 在本发明的一个方面中,流体以这种方式被引导到基底的相对表面上,然而,来自下表面的流体在这种接合之前穿过空气或类似的环境并因此被阻止与其混合。
    • 3. 发明公开
    • Fluid treatment apparatus
    • Vorrichtung zur Behandlung vonGegenständenmitFlüssigkeiten。
    • EP0622125A1
    • 1994-11-02
    • EP94105025.4
    • 1994-03-30
    • International Business Machines Corporation
    • Bard, Steven LindzBendz, Gerald AndreiCanestaro, Michael JamesChapura, John RobertFrankoski, Edward JayHoran, Michael ShawnJones, Jeffrey DonaldKamperman, James StevenKjelgaard, John Robert, Jr.McCreary, Jack Marlyn
    • B05B15/04H05K3/00
    • H05K3/0085B05B14/00Y02P70/36
    • A fluid treatment apparatus and method for applying first and second fluids (e.g., etchant and water) to an article (e.g., circuit board) passing through the apparatus at a predetermined rate. The first fluid is impinged on a surface of the article (11) and thereafter collected within the apparatus' common housing (13). The second fluid is impinged onto the surface of the article and collected within the same housing but at a location separate from the collected first fluid so as to at least partially prevent mixing thereof. The preferred means for effecting fluid impingement comprises separate fluid injectors, each including at least two rows of fluid jet injectors (27) therein. The collected fluids are each returned to the respective impingement means (23, 41). Replenishment of the second fluid is accomplished using a pump which supplies the second fluid, while the apparatus also includes means (e.g., a drain) to effectively remove the second fluid at a rate similar to the supply rate for the second fluid. The first fluid is also maintained at an established level above the article's surface using suitable means (e.g., dual rollers) located relative (e.g., on opposite sides of) the first fluid impingement means. Similar level retention for the second fluid is also possible. Cascading of the collected second fluid is also defined, this occuring within the same housing chamber which serves to collect the first fluid.
    • 一种用于将第一和第二流体(例如蚀刻剂和水)施加到以预定速率穿过设备的制品(例如电路板)的流体处理装置和方法。 第一流体冲击在物品(11)的表面上,然后收集在设备的公共壳体(13)内。 第二流体冲击到制品的表面上并收集在同一壳体内,但在与收集的第一流体分开的位置处,以至少部分地防止其混合。 用于实现流体冲击的优选方式包括单独的流体喷射器,每个液体喷射器在其中包括至少两排流体喷射喷射器(27)。 所收集的流体各自返回到相应的冲击装置(23,41)。 使用供应第二流体的泵来实现第二流体的补充,同时该装置还包括用于以与第二流体的供给速率相似的速率有效地去除第二流体的装置(例如排水管)。 使用位于第一流体冲击装置相对(例如,在相对侧)上的合适的装置(例如,双辊),第一流体也保持在制品表面上方的确定水平。 类似的第二流体的水平保持也是可能的。 也定义了所收集的第二流体的级联,这发生在用于收集第一流体的相同壳体室内。
    • 7. 发明公开
    • Fluid treatment apparatus and method
    • Vorrichtung und Verfahren zurFlüssigkeitsbehandlung。
    • EP0547416A2
    • 1993-06-23
    • EP92120389.9
    • 1992-11-28
    • International Business Machines Corporation
    • Bard, Steven LindzJones, Jeffrey Donald
    • H03K3/00C23F1/08B05B13/02
    • H05K3/0085C23F1/08
    • A fluid treatment apparatus and method wherein uniform treatment of a substrate (e.g., a thin, metallic sheet) is treated (e.g., etched) during movement thereof. This treatment involves directing a plurality of fluid jets through a collected first fluid onto one of the substrate's surfaces in such a manner that the fluid of each fluid jet will engage (collide with) the fluid from the nearest fluid jet as a result of being maintained across the substrate's surface at a predetermined velocity prior to mixing of the jets with surrounding fluid. Prevention of such mixing prior to such engagement has proven to assure uniform treatment of the substrate. In one aspect of the invention, fluid is directed onto opposite surfaces of the substrate in this fashion, the fluid from the lower surface, however, being passed through air or similar ambient and thus prevented from mixing therewith prior to such engagement.
    • 一种流体处理装置和方法,其中在其运动期间处理(例如,蚀刻)基底(例如,薄的金属片)的均匀处理。 这种处理包括将多个流体射流引导通过收集的第一流体通过这样一种方式使得每个流体射流的流体与来自最近的流体射流的流体相互接合(碰撞),这是由于被维持的 在将射流与周围流体混合之前,以预定速度穿过基底表面。 在这种接合之前防止这种混合被证明可以确保基材的均匀处理。 在本发明的一个方面,以这种方式将流体引导到基板的相对表面上,然而,来自下表面的流体通过空气或类似的环境,因此在这种接合之前被防止与其混合。