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    • 3. 发明授权
    • Manufacturing method for integrated circuit dielectric layer
    • 集成电路介质层的制造方法
    • US6001694A
    • 1999-12-14
    • US059752
    • 1998-04-14
    • Hsueh-Hao ShihJuan-Yuan WuWater Lur
    • Hsueh-Hao ShihJuan-Yuan WuWater Lur
    • H01L21/28H01L29/51H01L21/331H01L21/31H01L21/3205H01L21/469H01L21/4763
    • H01L21/28202H01L29/518
    • A method for adjusting the amount of doped nitride ions in a dielectric layer so that the nitride ions form bonds with silicon to increase the quality of an oxide layer. The method comprises the step of providing a silicon substrate. Next, a rapid thermal oxidation or furnace oxidation method is used to form an oxide layer over the silicon substrate. Gaseous mixtures having different ratios of nitrogen monoxide, nitrous oxide or ammonia to oxygen are concocted and then allowed to react at different reacting temperatures for controlling the nitride concentration level in the oxide layer. The nitride-doped oxide layer not only can stop the penetration of boron ions, but can also provide a stabilizing effect on the oxide layer/silicon substrate interface without degradation of electrical property, thereby improving the quality of a transistor.
    • 一种用于调节介电层中的掺杂氮化物离子的量使得氮化物离子与硅键合以提高氧化物层的质量的方法。 该方法包括提供硅衬底的步骤。 接下来,使用快速热氧化或炉氧化方法在硅衬底上形成氧化物层。 将具有不同比例的一氧化氮,一氧化二氮或氨与氧的气态混合物混合,然后在不同的反应温度下反应,以控制氧化物层中的氮化物浓度水平。 氮化物掺杂氧化物层不仅可以阻止硼离子的渗透,而且还可以在氧化物层/硅衬底界面上提供稳定效果,而不会降低电性能,从而提高晶体管的质量。
    • 6. 发明申请
    • CHEMICAL MECHANICAL POLISHING FOR FORMING A SHALLOW TRENCH ISOLATION STRUCTURE
    • 用于形成浅层隔离结构的化学机械抛光
    • US20060009005A1
    • 2006-01-12
    • US10984045
    • 2004-11-09
    • Coming ChenJuan-Yuan WuWater Lur
    • Coming ChenJuan-Yuan WuWater Lur
    • H01L21/76H01L21/302
    • H01L21/31144H01L21/31053H01L21/31056H01L21/76229Y10S438/942
    • A method of chemical-mechanical polishing for forming a shallow trench isolation is disclosed. A substrate having a number of active regions, including a number of relatively large active regions and a number of relatively small active regions, is provided. The method comprises the following steps. A silicon nitride layer on the substrate is first formed. A number of shallow trenches are formed between the active regions. An oxide layer is formed over the substrate, so that the shallow trenches are filled with the oxide layer. A partial reverse active mask is formed on the oxide layer. The partial reverse active mask has an opening at a central part of each relatively large active region. The opening exposes a portion of the oxide layer. The opening has at least a dummy pattern. The oxide layer on the central part of each large active region is removed to expose the silicon nitride layer. The partial reverse active mask is removed. The oxide layer is planarized to expose the silicon nitride layer.
    • 公开了用于形成浅沟槽隔离的化学机械抛光的方法。 提供具有多个有源区的基板,包括多个相对较大的有源区和多个相对小的有源区。 该方法包括以下步骤。 首先形成衬底上的氮化硅层。 在活性区域之间形成多个浅沟槽。 在衬底上形成氧化物层,使得浅沟槽被氧化物层填充。 在氧化物层上形成部分反向有源掩模。 部分反向有源掩模在每个相对大的有效区域的中心部分具有开口。 开口暴露氧化物层的一部分。 开口至少有一个虚拟图案。 去除每个大的有源区的中心部分的氧化物层,以露出氮化硅层。 去除部分反向主动掩模。 将氧化物层平坦化以暴露氮化硅层。
    • 7. 发明授权
    • Method of designing active region pattern with shift dummy pattern
    • 用移动虚拟图案设计有源区域图案的方法
    • US06810511B2
    • 2004-10-26
    • US10284683
    • 2002-10-30
    • Coming ChenJuan-Yuan WuWater Lur
    • Coming ChenJuan-Yuan WuWater Lur
    • G06F1750
    • H01L21/31053H01L21/76229H01L23/528H01L27/0207H01L2924/0002H01L2924/00
    • A method of designing an active region pattern with a shifted dummy pattern, wherein an integrated circuit having an original active region pattern thereon is provided. The original active region pattern is expanded with a first parameter of line width to obtain a first pattern. By subtracting the first pattern, a second pattern is obtained. A dummy pattern which comprises an array of a plurality of elements is provided. By shifting the elements, a shifted dummy pattern is obtained. The second pattern and the shifted dummy pattern are combined, so that an overlapped region thereof is extracted as a combined dummy pattern. The combined dummy pattern is expanded with a second parameter of line width, so that a resultant dummy pattern is obtained. The resultant dummy pattern is added to the first pattern, so that the active region pattern with a shifted dummy pattern is obtained.
    • 一种设计具有偏移的虚设图案的有源区域图案的方法,其中提供其上具有原始有源区域图案的集成电路。 原始活动区域图案用线宽的第一参数展开以获得第一图案。 通过减去第一图案,获得第二图案。 提供了包括多个元件的阵列的虚拟图案。 通过移动元件,获得移动的虚拟图案。 第二图案和移位的虚拟图案被组合,使得其重叠区域被提取为组合的虚拟图案。 组合的虚拟图案用线宽的第二参数扩展,从而获得合成的虚拟图案。 将所得到的虚拟图案添加到第一图案,从而获得具有偏移的虚设图案的有源区域图案。
    • 8. 发明授权
    • Chemical mechanical polishing in forming semiconductor device
    • 化学机械抛光成型半导体器件
    • US06790742B2
    • 2004-09-14
    • US10293243
    • 2002-11-13
    • Ming-Sheng YangJuan-Yuan WuWater Lur
    • Ming-Sheng YangJuan-Yuan WuWater Lur
    • H01L2176
    • H01L21/76229
    • A method of chemical-mechanical polishing for forming a shallow trench isolation is disclosed. A substrate having a number of active regions, including a number of relatively large active regions and a number of relative small active regions, is provided. The method comprises the following steps. A silicon nitride layer on the substrate is formed. A number of shallow trenches are formed between the active regions one or more of which may constitute an alignment mark. An oxide layer is formed over the substrate, so that the shallow trenches are filled with the oxide layer. A partial reverse active mask is formed on the oxide layer. The partial reverse active mask exposes a portion of the oxide layer over the large active area and over the alignment mark. The oxide layer of each large active region and the alignment mark is removed. The partial reverse active mask is removed. The oxide layer is planarized.
    • 公开了用于形成浅沟槽隔离的化学机械抛光的方法。 提供了具有多个有效区域的基板,包括多个相对较大的有源区域和多个相对小的有源区域。 该方法包括以下步骤。 形成衬底上的氮化硅层。 在有源区域之间形成多个浅沟槽,其中一个或多个可以构成对准标记。 在衬底上形成氧化物层,使得浅沟槽被氧化物层填充。 在氧化物层上形成部分反向有源掩模。 部分反向有源掩模将氧化物层的一部分暴露在大的有效区域上方和对准标记之上。 去除每个大活性区域的氧化物层和对准标记。 去除部分反向主动掩模。 氧化层平坦化。
    • 10. 发明授权
    • Method of manufacturing binary phase shift mask
    • 制造二元相移掩模的方法
    • US06255023B1
    • 2001-07-03
    • US09434046
    • 1999-11-04
    • Chien-Chao HuangMichael W C HuangJuan-Yuan Wu
    • Chien-Chao HuangMichael W C HuangJuan-Yuan Wu
    • G03F900
    • G03F1/32
    • A method of manufacturing a binary phase shift photomask. A phase shift layer and a mask layer are sequentially formed over a transparent substrate. The mask layer and the phase shift layer are patterned to form a plurality of first openings and a plurality of second openings that expose a portion of the transparent substrate. The mask layer is patterned to form a layer of mask material around the edges of the first openings. All first openings occupy an area greater than a preset minimum area while all second openings occupy an area greater than the preset minimum area. The mask layer only surrounds the first openings while the phase shift layer surrounds both the first and the second openings.
    • 一种制造二进制相移光掩模的方法。 在透明基板上依次形成相移层和掩模层。 图案化掩模层和相移层以形成多个第一开口和暴露透明基板的一部分的多个第二开口。 图案化掩模层以在第一开口的边缘周围形成掩模材料层。 所有第一开口占据大于预设最小面积的区域,而所有第二开口占据大于预设最小面积的区域。 掩模层仅围绕第一开口,而相移层围绕第一和第二开口。