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1. 发明授权

US08318518B2 Light emitting device and manufacturing method thereof 有权
标题翻译：发光元件及其制造方法
公开(公告)号：US08318518B2
公开(公告)日：2012-11-27
申请号：US12952489
申请日：2010-11-23
申请人： Hitoshi Hoshino , Toshiyuki Tateishi
发明人： Hitoshi Hoshino , Toshiyuki Tateishi
IPC分类号： H01L21/00
CPC分类号： H01L33/20 , H01L33/007
摘要： A light emitting device including a sapphire layer and a light emitting layer formed on the sapphire layer. The sapphire layer has a polygonal sectional shape whose internal angle is an obtuse angle, such as a regular hexagonal shape. Light emitted from the light emitting layer is totally reflected on one side surface of the sapphire layer and next transmitted through another side surface of the sapphire layer.
摘要翻译：一种发光器件，包括形成在蓝宝石层上的蓝宝石层和发光层。蓝宝石层具有内角为正六边形的钝角的多边形截面形状。从发光层发射的光在蓝宝石层的一个侧表面上被全反射，然后透过蓝宝石层的另一侧表面。

2. 发明申请

US20110133235A1 LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：发光装置及其制造方法
公开(公告)号：US20110133235A1
公开(公告)日：2011-06-09
申请号：US12952489
申请日：2010-11-23
申请人： Hitoshi Hoshino , Toshiyuki Tateishi
发明人： Hitoshi Hoshino , Toshiyuki Tateishi
IPC分类号： H01L33/58 , H01L33/00
CPC分类号： H01L33/20 , H01L33/007
摘要： A light emitting device including a sapphire layer and a light emitting layer formed on the sapphire layer. The sapphire layer has a polygonal sectional shape whose internal angle is an obtuse angle, such as a regular hexagonal shape. Light emitted from the light emitting layer is totally reflected on one side surface of the sapphire layer and next transmitted through another side surface of the sapphire layer.
摘要翻译：一种发光器件，包括形成在蓝宝石层上的蓝宝石层和发光层。蓝宝石层具有内角为正六边形的钝角的多边形截面形状。从发光层发射的光在蓝宝石层的一个侧表面上被全反射，然后透过蓝宝石层的另一侧表面。

3. 发明授权

US07396780B2 Method for laser processing of wafer 有权
标题翻译：晶圆激光加工方法
公开(公告)号：US07396780B2
公开(公告)日：2008-07-08
申请号：US11261600
申请日：2005-10-31
申请人： Hitoshi Hoshino , Ryugo Oba , Kenji Furuta , Noburu Takeda , Nobuyasu Kitahara
发明人： Hitoshi Hoshino , Ryugo Oba , Kenji Furuta , Noburu Takeda , Nobuyasu Kitahara
IPC分类号： H01L21/324
CPC分类号： H01L21/67092 , B23K26/0853 , B23K26/702
摘要： A method of carrying out the laser processing of a wafer with a laser beam processing machine comprising a chuck table for holding a wafer, a laser beam application means for applying a laser beam to the wafer held on the chuck table and a processing-feed means for processing-feeding the chuck table and the laser beam application means relative to each other, comprising the steps of a wafer affixing step for putting the wafer on the surface of a protective tape mounted on an annular frame, a wafer holding step for holding the wafer put on the protective tape on the chuck table, and a laser beam application step for applying a laser beam having a predetermined wavelength from the laser beam application means to the wafer held on the chuck table and processing-feeding the wafer with the processing-feed means, wherein the protective tape is made of a material which transmits the laser beam having a predetermined wavelength applied from the laser beam application means.
摘要翻译：一种利用激光束处理机进行激光加工的方法，所述激光束处理机包括用于保持晶片的卡盘台，激光束施加装置，用于将激光束施加到保持在卡盘台上的晶片上，以及加工进给装置用于将夹盘和激光束施加装置相对于彼此进行加工，包括以下步骤：将晶片放置在安装在环形框架上的保护带的表面上的晶片固定步骤，用于保持晶片放在卡盘台上的保护带上，以及激光束施加步骤，用于将来自激光束施加装置的具有预定波长的激光束施加到保持在卡盘台上的晶片上，馈送装置，其中保护带由透射从激光束施加装置施加的具有预定波长的激光束的材料制成。

4. 发明申请

US20070156920A1 CONTROL APPARATUS AND ITS METHOD, AND CONTROL PROGRAM AND STORAGE MEDIUM HOLDING IT, WITH CHANGING OF TRANSMISSION SOURCE 审中-公开
标题翻译：控制装置及其方法，控制程序和存储介质，改变传输源
公开(公告)号：US20070156920A1
公开(公告)日：2007-07-05
申请号：US11539297
申请日：2006-10-06
申请人： Hitoshi Hoshino , Yutaka Tokura , Kiyoshi Tokashiki , Masahiro Takayanagi , Yoshinori Ito , Yuzo Harano
发明人： Hitoshi Hoshino , Yutaka Tokura , Kiyoshi Tokashiki , Masahiro Takayanagi , Yoshinori Ito , Yuzo Harano
IPC分类号： G06F15/173 , G06F15/16
CPC分类号： G06F3/1222 , G06F3/1238 , G06F3/1288 , H04N1/00127 , H04N1/00204 , H04N1/00244 , H04N1/00278 , H04N1/00973 , H04N2201/0082
摘要： A controller which exists between a client apparatus and an image processing apparatus and which controls access from the client apparatus such that the client apparatus can use a network server function of the image processing apparatus, its control method and control program and storage medium. To accomplish this, the controller which exists between a client terminal and an image processing apparatus and which controls data transmitted from the client terminal to the image processing apparatus comprises an information providing unit which provides setup information of the controller to the client terminal and a transfer unit which transfers setup information of the image processing apparatus to the client terminal.
摘要翻译：存在于客户机装置和图像处理装置之间并且控制从客户端装置的访问的控制器，使得客户端装置可以使用图像处理装置的网络服务器功能，其控制方法和控制程序以及存储介质。为了实现这一点，存在于客户终端和图像处理装置之间并且控制从客户终端发送到图像处理装置的数据的控制器包括信息提供单元，其向客户终端提供控制器的设置信息和传送将图像处理装置的设置信息传送到客户终端的单元。

5. 发明授权

US07134942B2 Wafer processing method 有权
标题翻译：晶圆加工方法
公开(公告)号：US07134942B2
公开(公告)日：2006-11-14
申请号：US10936678
申请日：2004-09-09
申请人： Yusuke Nagai , Masashi Aoki , Hitoshi Hoshino
发明人： Yusuke Nagai , Masashi Aoki , Hitoshi Hoshino
IPC分类号： B24B1/00 , H01L21/463
CPC分类号： B24B37/042 , B23K26/364 , B23K26/40 , B23K2101/40 , B23K2103/50 , H01L21/78
摘要： A wafer processing method for dividing a wafer having optical devices that are formed in a plurality of areas sectioned by dividing lines formed in a lattice pattern on the front surface, along the dividing lines, which comprises a laser beam application step of applying a laser beam to the wafer along the dividing lines from the side of the back surface thereof to form grooves having a predetermined depth in the back surface; a protective sheet affixing step of affixing a protective sheet to the front surface of the wafer having the grooves in the back surface; a dividing step of dividing the wafer having the protective sheet affixed to the front surface along the grooves; and a grinding step of grinding the back surface of the wafer divided along the grooves in a state of the protective sheet being affixed to the wafer, to remove the grooves.
摘要翻译：一种晶片处理方法，用于沿着分割线分割形成在由表面上形成为格子图案的分割线划分的多个区域中的光学器件的晶片，该分割线包括施加激光束的激光束施加步骤沿着分割线从其背面的一侧到晶片，以形成在后表面中具有预定深度的凹槽; 保护片固定步骤，将保护片固定在具有后表面的凹槽的晶片的前表面; 分割步骤，沿着所述凹槽分割具有固定在所述前表面上的所述保护片的所述晶片; 以及磨削步骤，在保护片固定在晶片上的状态下研磨沿着槽划分的晶片的背面，以去除凹槽。

6. 发明申请

US20060094260A1 Method for laser processing of wafer 有权
标题翻译：晶圆激光加工方法
公开(公告)号：US20060094260A1
公开(公告)日：2006-05-04
申请号：US11261600
申请日：2005-10-31
申请人： Hitoshi Hoshino , Ryugo Oba , Kenji Furuta , Noburu Takeda , Nobuyasu Kitahara
发明人： Hitoshi Hoshino , Ryugo Oba , Kenji Furuta , Noburu Takeda , Nobuyasu Kitahara
IPC分类号： H01L21/324
CPC分类号： H01L21/67092 , B23K26/0853 , B23K26/702
摘要： A method of carrying out the laser processing of a wafer with a laser beam processing machine comprising a chuck table for holding a wafer, a laser beam application means for applying a laser beam to the wafer held on the chuck table and a processing-feed means for processing-feeding the chuck table and the laser beam application means relative to each other, comprising the steps of a wafer affixing step for putting the wafer on the surface of a protective tape mounted on an annular frame, a wafer holding step for holding the wafer put on the protective tape on the chuck table, and a laser beam application step for applying a laser beam having a predetermined wavelength from the laser beam application means to the wafer held on the chuck table and processing-feeding the wafer with the processing-feed means, wherein the protective tape is made of a material which transmits the laser beam having a predetermined wavelength applied from the laser beam application means.
摘要翻译：一种利用激光束处理机进行激光加工的方法，所述激光束处理机包括用于保持晶片的卡盘台，激光束施加装置，用于将激光束施加到保持在卡盘台上的晶片上，以及加工进给装置用于将夹盘和激光束施加装置相对于彼此进行加工，包括以下步骤：将晶片放置在安装在环形框架上的保护带的表面上的晶片固定步骤，用于保持晶片放在卡盘台上的保护带上，以及激光束施加步骤，用于将来自激光束施加装置的具有预定波长的激光束施加到保持在卡盘台上的晶片上，馈送装置，其中保护带由透射从激光束施加装置施加的具有预定波长的激光束的材料制成。

7. 发明申请

US20120289026A1 SPLITTING METHOD FOR OPTICAL DEVICE WAFER 有权
标题翻译：光学器件波形分割方法
公开(公告)号：US20120289026A1
公开(公告)日：2012-11-15
申请号：US13465186
申请日：2012-05-07
申请人： Hiroumi Ueno , Hitoshi Hoshino
发明人： Hiroumi Ueno , Hitoshi Hoshino
IPC分类号： H01L21/78
CPC分类号： B23K26/38 , B23K26/0853 , B23K26/40 , B23K2103/50 , H01L33/0095
摘要： In a splitting method for an optical device wafer, the wafer having optical devices formed individually in regions partitioned by a plurality of crossing scheduled splitting lines provided on a front surface and having a reflective film formed on a reverse surface, a focal point of a laser beam is positioned to the inside of the optical device wafer and the laser beam is irradiated along the scheduled splitting lines from the reverse surface side of the wafer to form modification layers in the inside of the wafer. An external force is applied to the wafer to split the wafer along the scheduled splitting lines and form a plurality of optical device chips. The laser beam has a wavelength that produces transmittance through the reflective film equal to or higher than 80%.
摘要翻译：在用于光学器件晶片的分割方法中，具有光学器件的晶片分别形成在被设置在前表面上并具有形成在反面上的反射膜的多个交叉预定分割线分隔的区域中，激光焦点光束位于光学器件晶片的内部，并且激光束沿着来自晶片的反面侧的预定分割线照射，以在晶片内部形成改性层。将外力施加到晶片，以沿着调度的分割线分裂晶片并形成多个光学器件芯片。激光束具有通过反射膜的透射率等于或高于80％的波长。

8. 发明申请

US20100041210A1 METHOD OF PROCESSING OPTICAL DEVICE WAFER 有权
标题翻译：处理光学器件波形的方法
公开(公告)号：US20100041210A1
公开(公告)日：2010-02-18
申请号：US12497877
申请日：2009-07-06
申请人： Hitoshi Hoshino , Takashi Yamaguchi
发明人： Hitoshi Hoshino , Takashi Yamaguchi
IPC分类号： H01L21/302
CPC分类号： H01L21/67132 , B23K26/40 , B23K2103/50 , H01L21/67092 , H01L33/0095
摘要： A method of dividing an optical device wafer includes: a laser beam processing step of performing laser beam processing on the face side of an optical device wafer so as to form breakage starting points along streets; a protective plate bonding step of bonding the face side of the optical device wafer to a surface of a highly rigid protective plate with a bonding agent permitting peeling; a back side grinding step of grinding the back side of the optical device wafer so as to form the optical device wafer to a finished thickness of optical devices; a dicing tape adhering step of adhering the back-side surface of the optical device wafer to a dicing tape; a cut groove forming step of cutting the protective plate bonded to the optical device wafer along the streets so as to form cut grooves; and a wafer dividing step of exerting an external force on the optical device wafer through the protective plate, so as to break up the optical device wafer along the breakage starting points formed along the streets, thereby dividing the optical device wafer into the individual optical devices.
摘要翻译：光学元件晶片的分割方法包括：激光束处理步骤，在光学元件晶片的正面进行激光束处理，形成沿着街道的断裂起点; 保护板接合步骤，用粘合剂剥离光学器件晶片的表面与高度刚性的保护板的表面接合; 背面磨削步骤，研磨光学器件晶片的背面，以便将光学器件晶片形成为光学器件的成品厚度; 切割胶带粘合步骤，将光学装置晶片的背面粘接到切割胶带上; 切割槽形成步骤，沿着街道切割与光学器件晶片接合的保护板，以形成切割槽; 以及通过保护板在光学器件晶片上施加外力的晶片分割步骤，沿着沿着街道形成的断裂起点将光学器件晶片分裂，从而将光学器件晶片分成各个光学器件。

9. 发明申请

US20080290078A1 LASER PROCESSING MACHINE 有权
标题翻译：激光加工机
公开(公告)号：US20080290078A1
公开(公告)日：2008-11-27
申请号：US12110916
申请日：2008-04-28
申请人： Keiji Nomaru , Hitoshi Hoshino , Koji Yamaguchi
发明人： Keiji Nomaru , Hitoshi Hoshino , Koji Yamaguchi
IPC分类号： B23K26/00
CPC分类号： B23K26/0604 , B23K26/042 , B23K26/067 , B23K26/0676 , B23K26/0853 , B23K26/0884 , B23K26/38 , B23K26/40 , B23K2101/40 , B23K2103/50
摘要： A laser processing machine having a laser beam irradiation unit is provided. The laser beam irradiation unit includes: a laser beam oscillation section; a beam splitter adapted to split the laser beam emitted from the laser beam oscillation section into a first laser beam and a second laser beam; a condenser lens adapted to condense the first and second laser beams; a prism adapted to lead the first and second laser beams split by the beam splitter to the condenser lens; a first angle-changing mirror disposed on a first optical path adapted to lead the first laser beam split by the beam splitter; a second angle-changing mirror disposed on a second optical path adapted to lead the second laser beam split by the beam splitter to the prism; and a half-wave plate disposed in the first or second optical path to allow one of respective directions of the first and second polarization planes to be aligned with the other.
摘要翻译：提供具有激光束照射单元的激光加工机。激光束照射单元包括：激光束振荡部; 分束器，适于将从激光束振荡部分发射的激光束分成第一激光束和第二激光束; 聚光透镜，适于冷凝第一和第二激光束; 棱镜，适于将由分束器分裂的第一和第二激光束引导到聚光透镜; 第一角度改变镜，设置在适于引导由分束器分裂的第一激光束的第一光路上; 第二角度改变镜，设置在第二光路上，适于将由分束器分裂的第二激光束引导到棱镜; 以及设置在第一或第二光路中的半波片，以允许第一和第二偏振面的各个方向之一与另一个对准。

10. 发明授权

US07408661B2 Control apparatus and its method, and control program and storage medium holding it, with access designating second address being performed based on link to the second address included in display information 有权
标题翻译：控制装置及其方法，以及控制程序和存储介质，其中存储指定第二地址是基于与显示信息中包含的第二地址的链接来执行的
公开(公告)号：US07408661B2
公开(公告)日：2008-08-05
申请号：US10267645
申请日：2002-10-10
申请人： Hitoshi Hoshino , Yutaka Tokura , Kiyoshi Tokashiki , Masahiro Takayanagi , Yoshinori Ito , Yuzo Harano
发明人： Hitoshi Hoshino , Yutaka Tokura , Kiyoshi Tokashiki , Masahiro Takayanagi , Yoshinori Ito , Yuzo Harano
IPC分类号： G06F15/00 , G06F15/16
CPC分类号： G06F3/1222 , G06F3/1238 , G06F3/1288 , H04N1/00127 , H04N1/00204 , H04N1/00244 , H04N1/00278 , H04N1/00973 , H04N2201/0082
摘要： A controller which exists between a client apparatus and an image processing apparatus and which controls access from the client apparatus such that the client apparatus can use a network server function of the image processing apparatus, its control method and control program and storage medium. To accomplish this, the controller which exists between a client terminal and an image processing apparatus and which controls data transmitted from the client terminal to the image processing apparatus comprises an information providing unit which provides setup information of the controller to the client terminal and a transfer unit which transfers setup information of the image processing apparatus to the client terminal.
摘要翻译：存在于客户机装置和图像处理装置之间并且控制从客户端装置的访问的控制器，使得客户端装置可以使用图像处理装置的网络服务器功能，其控制方法和控制程序以及存储介质。为了实现这一点，存在于客户终端和图像处理装置之间并且控制从客户终端发送到图像处理装置的数据的控制器包括信息提供单元，其向客户终端提供控制器的设置信息和传送将图像处理装置的设置信息传送到客户终端的单元。

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