会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 9. 发明专利
    • ELECTRONIC CIRCUIT DEVICE AND ITS MANUFACTURE
    • JPH09283909A
    • 1997-10-31
    • JP9803196
    • 1996-04-19
    • HITACHI LTD
    • IJUIN MASAHITOYAMADA OSAMUIWATO TAISUKEKUROIWA TSUTOMUTSUJI SHINJIKIKUCHI SATORU
    • H05K3/34
    • PROBLEM TO BE SOLVED: To realize excellent height accuracy of an electronic component with a solder film and a circuit board by a method wherein the circuit board is aligned with the electronic component on which a solder film is former, the solder film is melted at a prescribed temperature and the electronic component is mounted on the circuit board. SOLUTION: When an Au and Sn vapor-deposited film is formed on an electrode 2 at a bonding part, a film 3c is formed by dispersing Sn into an Au vapor-deposited film, or Au vapor-deposited films 3a and Sn vapor-deposited films 3b are laminated alternately so as to form a solder film, and an electronic component is constituted and manufactured by using the solder film. Concretly, the solder film 3c in which Sn is dispersed into Au is formed at the part of the electrode 3 at the electronic component 1, a circuit board is aligned with the electronic component 1 on which the solder film 3c is formed, the solder film 3c is melted at a prescribed temperature, and the electronic component 1 is mounted on the circuit board. Thereby, the wettability of the electronic component is enhanced, it is possible to prevent the Au-Sn solder film from being not melted and to prevent a connection defect due to a wettability shortage or the like, and it is possible to perform a bonding operation in which an irregularity in a height is small thanks to a unfirom wetting spread.