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    • 5. 发明专利
    • Semiconductor laser
    • 半导体激光器
    • JP2003046190A
    • 2003-02-14
    • JP2001228866
    • 2001-07-30
    • Hitachi Ltd株式会社日立製作所
    • AOKI MASAHIRO
    • G02B6/14G02B6/12G02B6/122H01S5/02H01S5/026H01S5/062H01S5/0625H01S5/10H01S5/125H01S5/22
    • H01S5/22H01S5/0203H01S5/0264H01S5/0265H01S5/06256H01S5/0655H01S5/1064H01S5/125H01S2301/185
    • PROBLEM TO BE SOLVED: To provide an element structure that can realize a short resonator laser which can be operated at a high speed with a low-threshold current or a wavelength tunable laser which is excellent in wavelength stability, and to provide a method of manufacturing the structure. SOLUTION: In a partial portion or the whole portion of the waveguide of the short resonator of the short resonator laser, the width of the waveguide is set to a lateral multi-mode permissible width. In this way, the element structure that can improve the gain of the short resonator laser and can reduce the electric resistance and thermal resistance of the laser while the characteristics of the laser are maintained is devised. In this case, the mode conversion loss in the laser resonator can be reduced by utilizing a self-image forming effect based on a multi-mode interference effect and, in addition, the light emitting edge of the laser becomes an ideal structure for the connection with an optical fiber, etc., because the light intensity distribution at the emitting edge becomes the lowest-order mode having a single peak. In addition, a method by which a laser resonator containing a multi-mode interference waveguide section can be manufactured with high dimensional accuracy by using both lithography and dry etching is also devised.
    • 要解决的问题:提供一种能够实现能够以波长稳定性优异的低阈值电流或波长可调谐激光器高速运转的短谐振器激光器的元件结构,并提供制造方法 结构。 解决方案:在短谐振器激光器的短谐振器的波导的局部或整个部分中,将波导的宽度设定为横向多模允许宽度。 以这种方式,设计了可以改善短谐振器激光器的增益并且可以在保持激光器的特性的同时降低激光器的电阻和热阻的元件结构。 在这种情况下,通过利用基于多模式干涉效应的自图像形成效果,可以降低激光谐振器中的模式转换损耗,另外,激光的发光边缘成为连接的理想结构 由于发射边缘处的光强分布变为具有单峰的最低阶模式,所以具有光纤等。 此外,还设计了通过使用光刻和干蚀刻二者均可以通过使用高尺寸精度制造包含多模干涉波导部分的激光谐振器的方法。
    • 6. 发明专利
    • OPTICAL TRANSMITTER
    • JP2000068983A
    • 2000-03-03
    • JP23524498
    • 1998-08-21
    • HITACHI LTD
    • AOKI MASAHIROSASAKI SHINYA
    • G02F1/025H01S3/10H01S5/00H01S5/026H01S5/30H04J14/00H04J14/02
    • PROBLEM TO BE SOLVED: To provide an optical transmitter to realize pre-emphasis in wavelength multiplex communication by an easy method and its simple realization method and to provide an optical transmitter with high reliability where a wavelength of a multiplexed signal light is unchanged even over aging in a semiconductor laser and its simple realization method. SOLUTION: The optical transmitter is obtained by a very simple method where a light intensity difference at a receiving end between channels caused by wavelength dependence of a guide path loss in a transmission line in a wavelength multiplex optical communication device 100 is corrected by adjusting an optical output of a transmitter of each channel through the use of an optical attenuator 108 integrated with a transmission light source. Furthermore, the optical transmitter is obtained where stability of each channel wavelength is easily realized by adjusting optical output fluctuation aver aging in the semiconductor laser through the use of the integrated optical attenuator 108.
    • 8. 发明专利
    • SEMICONDUCTOR LASER
    • JPH08340147A
    • 1996-12-24
    • JP14585695
    • 1995-06-13
    • HITACHI LTD
    • SAGAWA MISUZUHIRAMOTO KIYOHISATOYONAKA TAKASHISHINODA KAZUNORIUOMI KAZUHISAAOKI MASAHIROSATO HIROSHI
    • H01S5/00H01S5/042H01S5/223H01S3/18
    • PURPOSE: To obtain a semiconductor laser, which does not cause a mode loss in association with a mode conversion and is stable in a transverse mode, by a method wherein the width of a region of a high effective refractive index is changed along the direction of a resonator and the width is changed in a state that a primary differential in the direction of the resonator is continuous in the direction of the resonator and has no inflection point. CONSTITUTION: An N-type InGaP current constricting layer 9 is selectively grown by an MOVPE method. Then, a wafer is taken out from a growth furnace and an oxide film used as a selective growth mask is etched away. Then, a P-type GaAs contact layer 10 is formed by an MBE method or the like. After a P side electrode 11 and an N side electrode 12 are formed, a laser element having a resonator of a length of about 900μm is obtained by a cleavage method. Then, a low-reflective film, which has a thickness of λ/4 (λ: oscillation wavelength) and consists of an Al2 O3 film, is formed on the front surface (the side of a Ws (L)) of the element and a high reflective film, which consists of an SiO2 film and an a-Si film and is formed into a four-layer film, is formed on the rear surface [the side of a Ws (O)] of the element. Then, the element is bonded on a heat sink facing its bonding surface downward.