专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2012153898A Thermosetting resin composition, prepreg, metal-clad laminate and printed wiring board 审中-公开
标题翻译：热固性树脂组合物，PREPREG，金属层压板和印刷线路板
公开(公告)号：JP2012153898A
公开(公告)日：2012-08-16
申请号：JP2012083808
申请日：2012-04-02
申请人： Hitachi Chemical Co Ltd , 日立化成工業株式会社
发明人： MIYATAKE MASATO , MURAI AKIRA , UCHIMURA RYOICHI
IPC分类号： C08L87/00 , B32B5/28 , B32B15/08 , C08J5/24 , C08K5/08 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which has a black external appearance, does not cause the lowering of the glass transition point (Tg) as a printed wiring board and does not decrease electrical insulating properties and reliability, and is suitable in producing a laminate enabling the examination of external appearance by the system of detecting fluorescence, a prepreg, a metal-clad laminate and a printed wiring board.SOLUTION: The black thermosetting resin composition including a dye comprises 0.05-5 mass% of an anthraquinone-based compound as the dye, and the prepreg, the metal-clad laminate and the printed wiring board are disclosed.
摘要翻译：要解决的问题：为了提供具有黑色外观的热固性树脂组合物，不会导致作为印刷线路板的玻璃化转变点（Tg）的降低，并且不降低电绝缘性和可靠性，并且适用于制造通过检测荧光体的系统检测外观的层压体，预浸料，覆金属层压板和印刷线路板。解决方案：包含染料的黑色热固性树脂组合物包含0.05-5质量％的作为染料的蒽醌类化合物，并且公开了预浸料坯，覆金属层压板和印刷线路板。版权所有（C）2012，JPO＆INPIT

2. 发明专利

JP2012246395A Prepreg, laminated plate, and printed wiring board using thermocurable resin composition 有权
标题翻译： PREPREG，层压板和使用可热固化树脂组合物的印刷线路板
公开(公告)号：JP2012246395A
公开(公告)日：2012-12-13
申请号：JP2011119505
申请日：2011-05-27
申请人： Hitachi Chemical Co Ltd , 日立化成工業株式会社
发明人： MIYATAKE MASATO , KOTAKE TOMOHIKO , NAGAI SHUNSUKE , TAKANEZAWA SHIN , MURAI AKIRA , UCHIMURA RYOICHI , TAKAHARA NAOKI
IPC分类号： C08J5/24 , C08G59/50 , C08K5/18 , C08K7/14 , C08K9/06 , C08L79/00 , C08L101/00 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a laminated plate and a printed wiring board which are excellent in heat resistance and insulation reliability and in which impregnating ability of a thermocurable resin and adhesion of a thermocurable resin with a glass cloth are good.SOLUTION: This prepreg for a printed wiring board is obtained by a method including: impregnating a glass cloth treated with (C) a silane coupling agent represented by General Formula (I) (where Rrepresents a 1-5C divalent hydrocarbon group, Rrepresents hydrogen or a 1-10C monovalent hydrocarbon group, X represents OCH, OCH, or OCH, m represents an integer of 0 to 5, and plural Xs and Rs when present in plurality may be the same as or different from each other) with a thermocurable resin composition containing (A) a compound containing an unsaturated maleimide group obtained by reacting (a) a maleimide compound having at least two N-substituted maleimide groups in the molecule with (b) an amine compound having at least two primary amino groups in the molecule and (B) a thermocurable resin; heating-drying the glass cloth; and converting the glass cloth into a B-stage.
摘要翻译：要解决的问题：提供耐热性和绝缘可靠性优异，并且其中耐热树脂的浸渍能力和耐热树脂与玻璃布的粘附性良好的层压板和印刷线路板。解决方案：用于印刷线路板的该预浸料通过以下方法获得：浸渍用（C）由通式（I）表示的硅烷偶联剂（其中R 1 表示1-5C的二价烃基，R表示氢或1-10C一价烃基，X表示OCH 3 ，OC 2 H 5 或OC 3 H 7 ，m表示0〜5的整数，多个X和R 2 相同或不同）与含有（A）含有不饱和马来酰亚胺基团的化合物的热固性树脂组合物通过使（a）在分子中具有至少两个N-取代马来酰亚胺基团的马来酰亚胺化合物与（b）分子中具有至少两个伯氨基的胺化合物和（B）热固性树脂; 加热干燥玻璃布; 并将玻璃布转换成B级。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2012153896A Flame retardant resin compound, thermosetting resin composition using the same, prepreg, and laminate 审中-公开
标题翻译：阻燃树脂化合物，使用它们的热固性树脂组合物，PREPREG和层压体
公开(公告)号：JP2012153896A
公开(公告)日：2012-08-16
申请号：JP2012069195
申请日：2012-03-26
申请人： Hitachi Chemical Co Ltd , 日立化成工業株式会社
发明人： UCHIMURA RYOICHI , TSUCHIKAWA SHINJI , MIYATAKE MASATO
IPC分类号： C08G59/18 , B32B15/08 , C08J5/24 , C08K3/00 , C08K5/3492 , C08L35/00 , C08L63/00 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide: a non-halogen flame retardant resin compound having a good balance between all of flame retardancy, metal foil adhesivity, heat resistance, moisture resistance and dielectric characteristics, and suitably usable for electronic parts or the like; a thermosetting resin composition and a prepreg and a laminate using the non-halogen flame retardant resin compound.SOLUTION: The flame retardant resin compound is produced by reacting a compound (a), which is obtained from an N-substituted maleimide compound and an amine compound having an acid substituent, with a phosphorus-containing epoxy resin (b) in an organic solvent. The thermosetting resin composition includes: a solution (A) of the flame retardant resin compound; a 6-substituted guanamine compound (B); a copolymer resin (C) from a styrene compound or a vinyl compound and a maleic anhydride; an epoxy resin (D); a hardener (E) for an epoxy resin having an acid substituent; and an inorganic filler (F). The prepreg and a laminate are produced using the thermosetting resin composition.
摘要翻译：要解决的问题：提供：阻燃性，金属箔粘合性，耐热性，耐湿性和介电特性之间具有良好平衡的非卤素阻燃树脂化合物，并且适用于电子部件或喜欢; 热固性树脂组合物和预浸料以及使用非卤素阻燃树脂化合物的层压体。解决方案：阻燃树脂化合物通过使由N-取代的马来酰亚胺化合物获得的化合物（a）和具有酸取代基的胺化合物与含磷环氧树脂（b）在有机溶剂。热固性树脂组合物包括：阻燃树脂化合物的溶液（A）; 6-取代胍胺化合物（B）; 来自苯乙烯化合物或乙烯基化合物的共聚物树脂（C）和马来酸酐; 环氧树脂（D）; 具有酸取代基的环氧树脂的固化剂（E）; 和无机填料（F）。使用热固性树脂组合物制备预浸料和层压材料。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2012111930A Thermocurable resin composition, prepreg using the thermocurable resin composition, laminated plate, and printed wiring board 审中-公开
标题翻译：可热固性树脂组合物，使用可热固化树脂组合物，层压板和印刷线路板
公开(公告)号：JP2012111930A
公开(公告)日：2012-06-14
申请号：JP2011117322
申请日：2011-05-25
申请人： Hitachi Chemical Co Ltd , 日立化成工業株式会社
发明人： TAKAHARA NAOKI , OSE MASAHISA , UCHIMURA RYOICHI , KATO IKUHIKO , MIYATAKE MASATO , KOTAKE TOMOHIKO
IPC分类号： C08G59/40 , C08J5/24 , C08K3/22 , C08L63/00 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a thermocurable resin composition satisfying moisture resistance and adhesion and imparting heat resistance relative to a temperature condition in a lead-free soldering or a reflow soldering and an advantageous thermal coefficient of linear expansion.SOLUTION: This thermocurable resin composition is a thermocurable resin composition containing: a compound (A) obtained by reacting a maleimide compound (a) having in one molecule thereof, at least two N-substituted maleimide group with an amine compound (b) having an acidic substituent represented by General Formula (1) (where, when Rexists in a plurality, Rs represent each independently any one of a hydroxy group, a carboxy group, and a sulfonic acid group which are an acidic substituent; when Rexists in a plurality, Rs represent independently any one of a hydrogen atom, a 1C-5C aliphatic hydrocarbon group, a halogen atom, a hydroxy group, a carboxy group, and a sulfonic acid group; and x and y are each an integer of 1 to 4) and having in the molecule structure thereof, an acidic substituent and an N-substituted maleimide group; an epoxy resin (B); a metal hydrate (C) having a thermal decomposition temperature of 300°C or higher; and a modified imidazole compound (D).
摘要翻译：要解决的问题：提供一种满足耐湿性和粘合性并且在无铅焊接或回流焊接中相对于温度条件赋予耐热性和有利的线性膨胀热系数的热固性树脂组合物。解决方案：该热固性树脂组合物是含有下列化合物的热固性树脂组合物：通过使具有1分子的马来酰亚胺化合物（a），至少2个N-取代马来酰亚胺基与胺化合物（b ）具有由通式（1）表示的酸性取代基（其中当R 1 存在于多个时，R 1 独立地表示作为酸性取代基的羟基，羧基和磺酸基中的任一个;当多个R 2 时，R SB SB = “POST”> 2 独立地表示氢原子，1C-5C脂族烃基，卤素原子，羟基，羧基和磺酸基中的任何一个; x和y分别为每个为1至4的整数），并且在其分子结构中具有酸性取代基和N-取代的马来酰亚胺基团; 环氧树脂（B）; 热分解温度为300℃以上的金属水合物（C）和改性咪唑化合物（D）。版权所有（C）2012，JPO＆INPIT

5. 发明专利

JP2011084431A High heat-resistant aluminum hydroxide particle, method for producing the same, resin composition containing the particle, and printed wiring board using the resin composition 有权
标题翻译：高耐热铝氢氧化物颗粒，其制造方法，含有颗粒的树脂组合物和使用树脂组合物的印刷线路板
公开(公告)号：JP2011084431A
公开(公告)日：2011-04-28
申请号：JP2009238289
申请日：2009-10-15
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： MIYATAKE MASATO , KAMIGATA YASUO , MURAI AKIRA , UCHIMURA RYOICHI
IPC分类号： C01F7/02 , B32B15/08 , B32B27/18 , C08K3/22 , C08L101/00
摘要： PROBLEM TO BE SOLVED: To provide high heat-resistant aluminum hydroxide particles having heat resistance and flame retardancy which can be suitably used for a printed wiring board substrate or the like adaptable to lead-free soldering, and to provide a method for producing the particles, a resin composition containing the particles, and a printed wiring board using the resin composition. SOLUTION: The high heat-resistant aluminum hydroxide particles have a specific surface area of 2.0 to 50.0 m 2 /g by BET method, a dehydration amount of 31.5 to 34.0 mass%, and a pyrolysis initiation temperature of higher than 260°C. A method for producing the particles, a resin composition containing the particles, and a printed wiring board using the resin composition are also disclosed. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供适用于适用于无铅焊接的印刷线路板基板等的耐热性和阻燃性的高耐热氢氧化铝颗粒，并提供一种方法制备颗粒，含有颗粒的树脂组合物和使用该树脂组合物的印刷线路板。解决方案：高耐热氢氧化铝颗粒的BET比表面积为2.0〜50.0m 2 / SP / g，脱水量为31.5〜34.0质量％，热分解起始温度高于260°C。还公开了制造颗粒的方法，含有颗粒的树脂组合物和使用该树脂组合物的印刷线路板。版权所有（C）2011，JPO＆INPIT

6. 发明专利

JP2011084430A Highly heat resistant aluminum hydroxide particle, preparation method therefor, resin composition containing the same and printed circuit board using the resin composition 有权
标题翻译：高耐热铝氢氧化物颗粒，其制备方法，含有其的树脂组合物和使用树脂组合物的印刷电路板
公开(公告)号：JP2011084430A
公开(公告)日：2011-04-28
申请号：JP2009238287
申请日：2009-10-15
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： KAMIGATA YASUO , TAKAHASHI YOSHIHIRO , MIYATAKE MASATO , UCHIMURA RYOICHI
IPC分类号： C01F7/02 , B32B15/08 , B32B27/18 , C01F7/44 , C08K3/22 , C08L101/00
摘要： PROBLEM TO BE SOLVED: To provide a preparation method for a highly heat resistant aluminum hydroxide particle having heat resistance and flame retardancy suitable to be used for a substrate for a printed circuit board and the like which has characteristics adaptable to lead free soldering. SOLUTION: In the highly heat resistance aluminum hydroxide particle, at least gibbsite type aluminum and boehmite type aluminum hydroxide are present in one aluminum hydroxide particle. The specific surface area by the BET method is 2.0-50.0 m 2 /g, while the amount of dehydration is 31.5-34.0 mass% and the temperature of starting heat decomposition is higher than 260°C. The method is for the preparation of the particle. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有耐热性和阻燃性的耐热氢氧化铝颗粒的制备方法，其适用于具有适合于无铅焊接的特性的印刷电路板等的基板。解决方案：在高耐热氢氧化铝颗粒中，在一种氢氧化铝颗粒中存在至少三水铝矿型铝和勃姆石型氢氧化铝。通过BET法的比表面积为2.0〜50.0m 2 / SP / g，脱水量为31.5〜34.0质量％，起始热分解温度高于260℃。该方法用于制备颗粒。版权所有（C）2011，JPO＆INPIT

7. 发明专利

JP2006297613A Metal foil clad laminated sheet and manufactured method of multilayered printed wiring board 有权
标题翻译：金属箔层压板和多层印刷线路板的制造方法
公开(公告)号：JP2006297613A
公开(公告)日：2006-11-02
申请号：JP2005118191
申请日：2005-04-15
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： NAKAMURA YUKIO , ISHIGAMI FUMIO , UCHIMURA RYOICHI
IPC分类号： B32B15/08 , B32B17/04 , H05K3/38 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a metal foil clad laminated sheet excellent in withstand voltage characteristics and heat resistance constituted by using a specific metal foil in the metal foil clad laminated sheet, and a multilayered printed wiring board. SOLUTION: In the metal foil clad laminated sheet, which has an insulating layer with a thickness of 0.06 mm or below, manufactured by laminating the metal foil on plain weave glass cloth impregnated with a thermosetting resin composition and subsequently heating and pressing the formed laminate, the untreated surface (glossy surface) of the metal foil is smoothed by plating treatment so that its surface roughness (Rz) becomes 2.0 μm or below. The manufacturing method of the metal foil clad laminated sheet is characterized by using the metal foil of which the surface is subjected to roughening treatment so as to have a surface roughness (Rz) of 2.0-3.5 mm. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种在金属箔包覆层压片中使用特定金属箔构成的耐电压特性和耐热性优异的金属箔复合层叠片和多层印刷线路板。解决方案：在通过将金属箔层压在浸渍有热固性树脂组合物的平纹玻璃织物上并随后加热和压制的情况下，将厚度为0.06mm或更小的绝缘层的金属箔包覆层压片通过电镀处理使金属箔的未处理面（光泽面）平滑化，使得其表面粗糙度（Rz）为2.0μm以下。金属箔复合层叠片的制造方法的特征在于，使用表面经过粗糙化处理的金属箔，使其表面粗糙度（Rz）为2.0〜3.5mm。版权所有（C）2007，JPO＆INPIT

8. 发明专利

JP2010260955A Resin composition, production method of resin composition, and prepreg and laminate each using the same 审中-公开
标题翻译：树脂组合物，树脂组合物的生产方法，以及使用它们的PREPREG和层压板
公开(公告)号：JP2010260955A
公开(公告)日：2010-11-18
申请号：JP2009112750
申请日：2009-05-07
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TAKAHASHI YOSHIHIRO , KAMIGATA YASUO , MIYATAKE MASATO , UCHIMURA RYOICHI
IPC分类号： C08L101/00 , C08J5/24 , C08K3/36 , C08K9/00
摘要： PROBLEM TO BE SOLVED: To provide a resin composition having good drillability, low heat expansibility, and excellent heat resistance and suited for semiconductor packages and printed wiring boards and to provide a prepreg and a laminate each using the same.
SOLUTION: What are provided are a resin composition comprising a thermosetting resin, a silica filler, and a core/shell resin particles having a primary particle diameter of 0.01-1 μm, wherein the secondary particle diameter of the core/shell resin particles is 0.01-1 μm and a method for producing a resin composition comprising the step of dispersing a silica filler in an organic solvent under agitation to prepare a silica filler dispersion, the step of adding core/shell resin particles to the silica filler dispersion and dispersing the particles in the dispersion under agitation till the secondary particle diameter of the core/shell resin particles reaches 0.01-1 μm, and the step of further adding a thermosetting resin to the resultant dispersion under agitation.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有良好的可钻性，低热膨胀性和优异的耐热性并且适用于半导体封装和印刷线路板的树脂组合物，并提供使用该树脂组合物的预浸料和层压材料。解决方案：提供一种包含热固性树脂，二氧化硅填料和一次粒径为0.01-1μm的核/壳树脂颗粒的树脂组合物，其中芯/壳树脂的二次粒径颗粒为0.01-1μm的树脂组合物的制造方法和包括在搅拌下将二氧化硅填料分散在有机溶剂中以制备二氧化硅填料分散体的步骤的方法，将核/壳树脂颗粒添加到二氧化硅填料分散体中的步骤和在搅拌下将颗粒分散在分散体中直到核/壳树脂颗粒的二次粒径达到0.01-1μm，并且在搅拌下向所得分散体中进一步加入热固性树脂的步骤。版权所有（C）2011，JPO＆INPIT

9. 发明专利

JP2008163305A Flame retardant resin compound, and thermosetting resin composition, prepreg and laminated plate using the same 有权
标题翻译：阻燃树脂化合物和热固性树脂组合物，使用它们的PREPREG和层压板
公开(公告)号：JP2008163305A
公开(公告)日：2008-07-17
申请号：JP2007205709
申请日：2007-08-07
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： UCHIMURA RYOICHI , TSUCHIKAWA SHINJI , MIYATAKE MASATO
IPC分类号： C08G59/14 , B32B15/08 , C08G59/58 , C08J5/24
摘要： PROBLEM TO BE SOLVED: To provide a non-halogen flame retardant resin compound that has a good balance between all of flame retargency, metal foil adhesion, heat resistance, moisture resistance and dielectric characteristics, and can be suitably used for electronic parts, and to provide a thermosetting resin composition using the resin compound as well as a prepreg and a laminated plate.
SOLUTION: The flame retardant resin compound is produced by reacting a compound (a) obtained from an N-substituted maleimide compound and an amine compound having an acidic substituent with a phosphorus-containing epoxy resin (b) in an organic solvent. The thermosetting resin composition comprises a solution (A) of the flame retardant resin compound, a 6-substituted guanamine compound (B), a copolymer resin (C) from a styrene compound or a vinyl compound and a maleic anhydride, an epoxy resin (D), and an acidic substituent-containing hardener (E) for the epoxy resin. The prepreg and the laminated plate using the composition are also disclosed.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供在所有的火焰恢复性，金属箔粘附性，耐热性，耐湿性和介电特性之间具有良好平衡的非卤素阻燃树脂化合物，并且可以适用于电子部件并且提供使用该树脂化合物的热固性树脂组合物以及预浸料和层压板。解决方案：通过使由N-取代的马来酰亚胺化合物获得的化合物（a）和具有酸性取代基的胺化合物与含磷环氧树脂（b）在有机溶剂中反应来制备阻燃树脂化合物。热固性树脂组合物包含阻燃树脂化合物的溶液（A），6-取代的胍胺化合物（B），来自苯乙烯化合物或乙烯基化合物的共聚物树脂（C）和马来酸酐，环氧树脂 D）和用于环氧树脂的酸性取代基的固化剂（E）。还公开了使用该组合物的预浸料坯和层压板。版权所有（C）2008，JPO＆INPIT

10. 发明专利

JP2008133412A Thermosetting resin composition, prepreg, metal-clad laminate and printed wiring board 审中-公开
标题翻译：热固性树脂组合物，PREPREG，金属层压板和印刷线路板
公开(公告)号：JP2008133412A
公开(公告)日：2008-06-12
申请号：JP2007039288
申请日：2007-02-20
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： MIYATAKE MASATO , MURAI AKIRA , UCHIMURA RYOICHI
IPC分类号： C08L101/00 , B32B15/08 , C08J5/24 , C08K3/00 , C08K5/08 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which has a black external appearance, does not cause the lowering of the glass transition point (Tg) as a printed wiring board and does not decrease electrical insulating properties and reliability, and is suitably in producing a laminate enabling the examination of external appearance by the system of detecting fluorescence, a prepreg, a metal-clad laminate and a printed wiring board.
SOLUTION: The black thermosetting resin composition comprising a dye comprises 0.05-5 mass% of an anthraquinone-based compound as the dye, and the prepreg, the metal clad laminate, and the printed wiring board are disclosed.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有黑色外观的热固性树脂组合物，不会导致作为印刷线路板的玻璃化转变点（Tg）的降低，并且不降低电绝缘性和可靠性，并且适用于制造能够通过检测荧光的系统检测外观的层压体，预浸料，覆金属层压板和印刷线路板。解决方案：包含染料的黑色热固性树脂组合物包含0.05-5质量％的作为染料的蒽醌类化合物，并且公开了预浸料坯，金属包覆层压板和印刷线路板。版权所有（C）2008，JPO＆INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式