专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2012236920A Thermosetting resin composition, and prepreg, laminate and printed-wiring board using the composition 审中-公开
标题翻译：热固性树脂组合物和使用组合物的PREPREG，层压板和印刷线路板
公开(公告)号：JP2012236920A
公开(公告)日：2012-12-06
申请号：JP2011107142
申请日：2011-05-12
申请人： Hitachi Chemical Co Ltd , 日立化成工業株式会社
发明人： HASHIMOTO SHINTARO , KOTAKE TOMOHIKO , MIYATAKE MASATO , NAGAI SHUNSUKE , INOUE YASUO , TAKANEZAWA SHIN , MURAI AKIRA
IPC分类号： C08G59/50 , C08J5/24 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a resin composition excellent in moisture resistance and low thermal expansibility while particularly maintaining heat resistance, and to provide a prepreg, laminate and printed wiring board using the composition.SOLUTION: A thermosetting resin composition is characterized by incorporating (a) a silicone compound having unsaturated double bonds in a molecular structure, (b) an amine compound having at least two primary amino groups in a molecular structure and (c) a maleimide compound having at least two N-substituted maleimide groups in a molecular structure. The prepreg, laminate and printed wiring board using the composition are also provided.
摘要翻译：要解决的问题：提供耐湿性优异和热膨胀性低的树脂组合物，同时特别保持耐热性，并提供使用该组合物的预浸料，层压板和印刷线路板。解决方案：热固性树脂组合物的特征在于：（a）分子结构中具有不饱和双键的硅氧烷化合物，（b）分子结构中具有至少两个伯氨基的胺化合物和（c）在分子结构中具有至少两个N-取代马来酰亚胺基团的马来酰亚胺化合物。还提供了使用该组合物的预浸料，层压板和印刷线路板。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2012236909A Thermosetting resin composition, and prepreg, laminate and printed wiring board using the same 审中-公开
标题翻译：热固性树脂组合物和PREPREG，层压板和印刷线路板
公开(公告)号：JP2012236909A
公开(公告)日：2012-12-06
申请号：JP2011106671
申请日：2011-05-11
申请人： Hitachi Chemical Co Ltd , 日立化成工業株式会社
发明人： NAGAI SHUNSUKE , MIYATAKE MASATO , KOTAKE TOMOHIKO , TAKANEZAWA SHIN , MURAI AKIRA
IPC分类号： C08G59/40 , B32B15/08 , B32B27/04 , B32B27/38 , C08G59/68 , C08J5/24 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a resin composition excellent in low thermal expansion, heat resistance, and adhesion, and a prepreg and a laminate and a printed wiring board excellent in warpage characteristics and resistance to desmearing, which use the resin composition.SOLUTION: A thermosetting resin composition includes: a compound (A) having an acidic substituent and an N-substituted maleimide group in molecular structure produced by the reaction of a maleimide compound (a) having at least two N-substituted maleimide groups in one molecule with an amine compound (b) having an acidic substituent represented by general formula (I); and a bisphenol F novolak type epoxy resin (B) having an average molecular weight of 500-10,000. The prepreg, the laminate, and the printed wiring board use the thermosetting resin composition. In formula, when a plurality of Rs are present, Rs are each independently an acidic substituent selected from a hydroxyl group, a carboxy group, and a sulfonic acid group; when a plurality of Rs are present, Rs are each independently a hydrogen atom, a 1-5C aliphatic hydrocarbon group, or a halogen atom; and x is an integer of 1-5, y is an integer of 0-4, and the sum of x and y is 5.
摘要翻译：要解决的问题：提供使用该树脂组合物的低热膨胀性，耐热性和粘合性优异的树脂组合物以及具有优异的翘曲特性和耐干燥性的预浸料和层压体以及印刷线路板。解决方案：热固性树脂组合物包括：具有酸性取代基的化合物（A）和通过具有至少两个N-取代的马来酰亚胺基团的马来酰亚胺化合物（a）的反应制备的分子结构中的N-取代的马来酰亚胺基团在具有由通式（I）表示的酸性取代基的胺化合物（b）的一个分子中; 和平均分子量为500〜10000的双酚F酚醛清漆型环氧树脂（B）。预浸料，层压体和印刷布线板使用热固性树脂组合物。在式中，当存在多个R 1 时，R“SB POS =”POST“> 1 各自独立地为选自羟基的酸性取代基基，羧基和磺酸基; 当存在多个R 2 时，R 2 各自独立地为氢原子，1-5C脂族烃基团或卤素原子; x为1〜5的整数，y为0〜4的整数，x与y的和为5.（C）2013，JPO＆INPIT

3. 发明专利

JP2012149155A Thermosetting resin composition, and prepreg, laminate and printed wiring board using the same 有权
标题翻译：热固性树脂组合物和PREPREG，层压板和印刷线路板
公开(公告)号：JP2012149155A
公开(公告)日：2012-08-09
申请号：JP2011008313
申请日：2011-01-18
申请人： Hitachi Chemical Co Ltd , 日立化成工業株式会社
发明人： KOTAKE TOMOHIKO , MIYATAKE MASATO , NAGAI SHUNSUKE , HASHIMOTO SHINTARO , INOUE YASUO , TAKANEZAWA SHIN , MURAI AKIRA
IPC分类号： C08L83/04 , C08J5/24 , C08K3/00 , C08K5/17 , C08K5/18 , C08K5/3415 , C08L101/12 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition excellent in low water absorbency and low thermal expansion property, and a prepreg, a laminate and a printed wiring board using the same.SOLUTION: The thermosetting resin composition contains (a) a maleimide compound having at least two N-substituted maleimide groups in one molecule, (b) a silicone compound having an acidic substituent in the molecular structure, and (c) a thermosetting resin.
摘要翻译：要解决的问题：提供一种低吸水性和低热膨胀性优异的热固性树脂组合物，以及预浸料，层压体和使用其的印刷线路板。解决方案：热固性树脂组合物包含（a）在一个分子中具有至少两个N-取代的马来酰亚胺基团的马来酰亚胺化合物，（b）在分子结构中具有酸性取代基的硅氧烷化合物，和（c）热固性树脂。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2012246395A Prepreg, laminated plate, and printed wiring board using thermocurable resin composition 有权
标题翻译： PREPREG，层压板和使用可热固化树脂组合物的印刷线路板
公开(公告)号：JP2012246395A
公开(公告)日：2012-12-13
申请号：JP2011119505
申请日：2011-05-27
申请人： Hitachi Chemical Co Ltd , 日立化成工業株式会社
发明人： MIYATAKE MASATO , KOTAKE TOMOHIKO , NAGAI SHUNSUKE , TAKANEZAWA SHIN , MURAI AKIRA , UCHIMURA RYOICHI , TAKAHARA NAOKI
IPC分类号： C08J5/24 , C08G59/50 , C08K5/18 , C08K7/14 , C08K9/06 , C08L79/00 , C08L101/00 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a laminated plate and a printed wiring board which are excellent in heat resistance and insulation reliability and in which impregnating ability of a thermocurable resin and adhesion of a thermocurable resin with a glass cloth are good.SOLUTION: This prepreg for a printed wiring board is obtained by a method including: impregnating a glass cloth treated with (C) a silane coupling agent represented by General Formula (I) (where Rrepresents a 1-5C divalent hydrocarbon group, Rrepresents hydrogen or a 1-10C monovalent hydrocarbon group, X represents OCH, OCH, or OCH, m represents an integer of 0 to 5, and plural Xs and Rs when present in plurality may be the same as or different from each other) with a thermocurable resin composition containing (A) a compound containing an unsaturated maleimide group obtained by reacting (a) a maleimide compound having at least two N-substituted maleimide groups in the molecule with (b) an amine compound having at least two primary amino groups in the molecule and (B) a thermocurable resin; heating-drying the glass cloth; and converting the glass cloth into a B-stage.
摘要翻译：要解决的问题：提供耐热性和绝缘可靠性优异，并且其中耐热树脂的浸渍能力和耐热树脂与玻璃布的粘附性良好的层压板和印刷线路板。解决方案：用于印刷线路板的该预浸料通过以下方法获得：浸渍用（C）由通式（I）表示的硅烷偶联剂（其中R 1 表示1-5C的二价烃基，R表示氢或1-10C一价烃基，X表示OCH 3 ，OC 2 H 5 或OC 3 H 7 ，m表示0〜5的整数，多个X和R 2 相同或不同）与含有（A）含有不饱和马来酰亚胺基团的化合物的热固性树脂组合物通过使（a）在分子中具有至少两个N-取代马来酰亚胺基团的马来酰亚胺化合物与（b）分子中具有至少两个伯氨基的胺化合物和（B）热固性树脂; 加热干燥玻璃布; 并将玻璃布转换成B级。版权所有（C）2013，JPO＆INPIT

5. 发明专利

JP2012149154A Thermosetting resin composition, and prepreg, laminate and multilayer printed wiring board using the same 有权
标题翻译：热固性树脂组合物，以及PREPREG，层压板和多层印刷线路板
公开(公告)号：JP2012149154A
公开(公告)日：2012-08-09
申请号：JP2011008308
申请日：2011-01-18
申请人： Hitachi Chemical Co Ltd , 日立化成工業株式会社
发明人： NAGAI SHUNSUKE , MURAI AKIRA , TAKANEZAWA SHIN , MIYATAKE MASATO , KOTAKE TOMOHIKO , INOUE YASUO , HASHIMOTO SHINTARO
IPC分类号： C08G59/20 , C08G59/56 , C08G59/62 , C08J5/24 , C08K3/00 , C08K5/3415 , C08L63/00 , C08L79/00 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which is excellent in heat resistance and low thermal expansion nature, and to provide a prepreg, a laminate, and a multilayer printed wiring board using the same.SOLUTION: The thermosetting resin composition includes: (a) a maleimide compound that has at least two N-substituted maleimide groups in one molecular structure; (b) a silicone compound that has an epoxy group in a molecular structure; and (c) a compound that has a phenolic hydroxyl group. The prepreg, the laminate, and the multilayer printed wiring board using the same are disclosed.
摘要翻译：要解决的问题：提供一种耐热性和低热膨胀性优异的热固性树脂组合物，并提供一种预浸料，层压体和使用其的多层印刷线路板。解决方案：热固性树脂组合物包括：（a）在一个分子结构中具有至少两个N-取代的马来酰亚胺基团的马来酰亚胺化合物; （b）分子结构中具有环氧基的硅氧烷化合物; 和（c）具有酚羟基的化合物。公开了预浸料，层压体和使用其的多层印刷布线板。版权所有（C）2012，JPO＆INPIT

6. 发明专利

JP2012021098A Thermosetting resin composition, prepreg using the same, and laminate using the prepreg 有权
标题翻译：热固性树脂组合物，使用相同的PREPREG和使用PREPREG的层压板
公开(公告)号：JP2012021098A
公开(公告)日：2012-02-02
申请号：JP2010160982
申请日：2010-07-15
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： MIYATAKE MASATO , KOTAKE TOMOHIKO , NAGAI SHUNSUKE , TAKANEZAWA SHIN , MURAI AKIRA
IPC分类号： C08G59/50 , C08J5/24 , C08K3/00 , C08L63/04 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a resin composition excellent in adhesiveness, heat resistance, moisture resistance, flame retardancy, dielectric property and the like, and particularly having a characteristic such that the warpage amount of the substrate thereof when heated is extremely small; and to provide a prepreg using the composition and also a laminate using the prepreg.SOLUTION: The thermosetting resin composition contains a setting agent (A) having the N-substituted maleimide groups and acidic substituent, produced by reacting a maleimide compound (a) having at least two N-substituted maleimide groups in one molecule with an amino compound (b) having the acidic substituent represented by general formula (I), and a bisphenol F type phenol novolac epoxy resin (B) (wherein Rs are each independently hydroxyl being an acidic substituent, carboxyl or sulfonic acid; Rs are each independently 1-5C aliphatic hydrocarbon or halogen; and x is an integer of 1 to 5, y is an integer of 0 to 4 and x+y=5). The invention further provides a prepreg using the composition and a laminate using the prepreg.
摘要翻译：要解决的问题：提供粘合性，耐热性，耐湿性，阻燃性，介电性等优异的树脂组合物，特别是具有使其加热时的基材的翘曲量极其特性的特性小; 并提供使用该组合物的预浸料，以及使用该预浸料的层压体。解决方案：热固性树脂组合物含有具有N-取代的马来酰亚胺基和酸性取代基的固化剂（A），其通过使一分子中具有至少两个N-取代的马来酰亚胺基团的马来酰亚胺化合物（a）与一具有由通式（I）表示的酸性取代基的氨基化合物（b）和双酚F型酚醛清漆环氧树脂（B）（其中R 1 作为酸性取代基，羧基或磺酸; R 2各自独立地为1-5C脂族烃或卤素; x为1〜5的整数，y为整数 0〜4，x + y = 5）。本发明还提供使用该组合物的预浸料坯和使用该预浸料的层压材料。版权所有（C）2012，JPO＆INPIT

7. 发明公开

KR20180023022A 수지 조성물 및 이것을 이용한 프리프레그, 적층판, 인쇄 배선판 审中-公开
标题翻译：树脂组合物和印刷线路板层压板和预浸料使用相同
公开(公告)号：KR20180023022A
公开(公告)日：2018-03-06
申请号：KR20187004994
申请日：2012-01-17
申请人： HITACHI CHEMICAL CO LTD
发明人： MIYATAKE MASATO , KOTAKE TOMOHIKO , NAGAI SHUNSUKE , HASHIMOTO SHINTARO , INOUE YASUO , TAKANEZAWA SHIN , MURAI HIKARI
IPC分类号： C08J5/24 , C08K3/013 , C08K3/36 , C08K5/3415 , C08K5/3445 , C08K5/5419 , C08L63/00 , C08L79/08 , C08L83/04 , H05K1/03
CPC分类号： C08J5/24 , C08J2379/04 , C08J2383/04 , C08K3/013 , C08K5/3415 , C08K5/3445 , C08K5/5419 , C08L63/00 , C08L79/085 , C08L83/04 , H05K1/0353 , H05K1/0366
摘要： 본발명은, (a) 1 분자구조중에적어도 2개의 N-치환말레이미드기를갖는말레이미드화합물과, (b) 1 분자구조중에적어도 1개의반응성유기기를갖는실리콘화합물을함유하는수지조성물및 이것을이용한프리프레그, 적층판및 인쇄배선판에관한것이다. 본발명은내열성, 저열팽창성이우수한수지조성물, 이것을이용한프리프레그, 적층판및 인쇄배선판을제공할수 있다.
摘要翻译：本发明公开了含有（a）在分子结构中具有至少两个N-取代的马来酰亚胺基团的马来酰亚胺化合物和（b）在其分子结构中具有至少一个反应性有机基团的有机硅化合物的树脂组合物; 以及使用其的预浸料坯，层压板和印刷线路板。一种具有优异的耐热性和低热膨胀性的树脂组合物; 并且可以提供预浸料坯，层压体和使用其的印刷线路板。

8. 发明公开

KR20180021825A 리튬 이온 이차 전지 审中-公开
标题翻译：锂离子二次电池
公开(公告)号：KR20180021825A
公开(公告)日：2018-03-05
申请号：KR20187002238
申请日：2016-07-20
申请人： HITACHI CHEMICAL CO LTD
发明人： HABA EISUKE , TAKAOKA KENJI , KUZUOKA HIROKI , NAGAI SHUNSUKE , NISHIMURA TAKUYA
IPC分类号： H01M2/16 , H01M4/13 , H01M4/62 , H01M10/0525 , H01M10/42
CPC分类号： H01M2/16 , H01M4/13 , H01M4/66 , H01M10/052 , H01M10/0566 , Y02E60/122 , Y02T10/7011
摘要： 리튬이온이차전지는정극, 부극및 세퍼레이터를구비하는리튬이온이차전지로서, 상기정극은, 집전체와상기집전체상에형성된도전층과상기도전층상에형성된정극활물질층을갖고, 상기도전층은, 도전성입자와중합체입자와수용성고분자를포함하고, 상기세퍼레이터는, 160℃에서의열 수축률이 30% 이하이거나, 다공질기재와무기물입자를포함하고, 상기다공질기재는폴리프로필렌및 폴리에틸렌이교대로적층된적층체이거나, 또는다공질기재로서폴리에틸렌테레프탈레이트의직포또는부직포및 무기물입자를포함하는것이다.
摘要翻译：作为正极，锂离子二次电池，其负电极和一个分离器，其是离子二次电池的锂，在正极中，具有形成的导电层和形成在所述集电体和集电体的导电层，上呼吸道导电层上的正电极活性材料层，包含导电性颗粒和聚合物颗粒和水溶性聚合物，并且其中所述分离器，或小于30％的热收缩eseoui 160℃，具有多孔性基材和所述无机粒子和多孔基材层压到聚丙烯和聚乙烯交替层叠或者作为多孔基材，聚对苯二甲酸乙二醇酯的织造或非织造织物和无机颗粒。

9. 发明公开

EP2666826A4 RESIN COMPOSITION, AND PRINTED WIRING BOARD, LAMINATED SHEET, AND PREPREG USING SAME 审中-公开
标题翻译：树脂组合物和填充板，复合薄膜等预浸
公开(公告)号：EP2666826A4
公开(公告)日：2014-07-02
申请号：EP12737159
申请日：2012-01-17
申请人： HITACHI CHEMICAL CO LTD
发明人： NAGAI SHUNSUKE , MIYATAKE MASATO , KOTAKE TOMOHIKO , HASHIMOTO SHINTARO , INOUE YASUO , TAKANEZAWA SHIN , MURAI HIKARI
IPC分类号： C08L83/08 , C08G59/40 , C08J5/24 , C08K3/00 , C08K5/13 , C08K5/18 , C08K5/3415 , C08K5/3445 , C08L63/00 , C08L79/00 , H05K1/03
CPC分类号： C08G77/14 , C08G73/0655 , C08G77/26 , C08G77/388 , C08J5/24 , C08J2379/08 , C08K5/13 , C08K5/18 , C08K5/3415 , C08K5/3445 , C08L79/085 , C08L83/06 , H05K1/0313 , H05K1/0353 , H05K1/0366 , H05K2201/0162 , C08L83/08 , C08L63/00 , C08L79/04

10. 发明专利

JP2014040584A Thermosetting resin composition and prepreg, laminate sheet, and print wire board using the same 有权
标题翻译：使用相同的热固性树脂组合物和PREPREG，层压板和打印线
公开(公告)号：JP2014040584A
公开(公告)日：2014-03-06
申请号：JP2013153613
申请日：2013-07-24
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： HASHIMOTO SHINTARO , MIYATAKE MASATO , KOTAKE TOMOHIKO , NAGAI SHUNSUKE , TAKANEZAWA SHIN , MURAI HIKARI , NAKAMURA SHINYA
IPC分类号： C08G59/56 , B32B15/08 , B32B15/088 , B32B15/092 , B32B27/34 , C08J5/24 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a resin composition excellent in terms of glass transition point (Tg), low thermal expansion tendency, and low curing shrinkage and a prepreg, a laminate sheet, and a print wire board using the same.SOLUTION: The provided thermosetting resin composition is obtained by blending (a) an adduct of a tertiary phosphine and a quinone, (b) an amine compound having at least two intramolecular primary amino groups, (c) an amine compound having an acidic substituent, and (d) a maleimide compound having at least two intramolecular N-substituted maleimide groups; a prepreg, a laminate sheet, and a print wire board using the same are also provided.
摘要翻译：要解决的问题：提供一种玻璃化转变点（Tg），低热膨胀倾向和低固化收缩率的树脂组合物，预浸料，层压片和使用其的印刷线板。解决方案：提供的热固性树脂组合物通过（a）叔膦和醌的加合物，（b）具有至少两个分子内的氨基的胺化合物，（c）具有酸性取代基的胺化合物和（d ）具有至少两个分子内N-取代的马来酰亚胺基团的马来酰亚胺化合物; 还提供了预浸料，层压片和使用其的印刷线板。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式