专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2012124498A Led module device and method of manufacturing the same 审中-公开
标题翻译： LED模块装置及其制造方法
公开(公告)号：JP2012124498A
公开(公告)日：2012-06-28
申请号：JP2011285457
申请日：2011-12-27
申请人： Hitachi Chem Co Ltd , Kyushu Institute Of Technology , 国立大学法人九州工業大学 , 日立化成工業株式会社
发明人： ISHIHARA MASAMICHI , TOYOSHIMA TSUTOMU , SUGIMURA YUKINOBU , NAKAMURA KUNIHIKO , YOKOZAWA SHUNYA , MATSUURA YOSHITSUGU
IPC分类号： H01L33/64 , H01L33/60
CPC分类号： H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To improve heat dissipation characteristics of an LED module device.SOLUTION: A wiring board comprises a glass epoxy substrate where wiring is formed. An LED package substrate is in a laminated configuration for which metal foil is attached holding an insulating layer comprising a polyimide resin having a film thickness in the range of 5 μm to 40 μm therebetween onto a metal plate bent to form a planar bottom part and wall parts respectively rising from both sides of the bottom part end. An LED package is constituted by mounting an LED chip on an upper surface of the planar bottom part and filling a transparent resin. The planar bottom part back surface of the LED package is fixed to a heat dissipation body, a wall upper part of the LED package is attached to the glass epoxy substrate, and an external connection electrode is connected with the wiring of the glass epoxy substrate on the attached part.
摘要翻译：要解决的问题：提高LED模块装置的散热特性。解决方案：布线板包括形成布线的玻璃环氧树脂基板。 LED封装基板为层叠结构，在该层叠结构中，金属箔被附着，该金属箔将包含膜厚度为5μm〜40μm的聚酰亚胺树脂的绝缘层固定在弯曲形成平坦的底部的金属板上，零件分别从底部两端开始上升。 LED封装通过将LED芯片安装在平面底部的上表面上并填充透明树脂来构成。 LED封装的平面底部背面固定在散热体上，将LED封装的上壁部分安装在玻璃环氧基板上，外部连接电极与玻璃环氧树脂基板的布线相连接附件。版权所有（C）2012，JPO＆INPIT

2. 发明专利

JP2012134204A Method for manufacturing led package 有权
标题翻译：制造LED封装的方法
公开(公告)号：JP2012134204A
公开(公告)日：2012-07-12
申请号：JP2010282705
申请日：2010-12-20
申请人： Hitachi Chem Co Ltd , Kyushu Institute Of Technology , 国立大学法人九州工業大学 , 日立化成工業株式会社
发明人： ISHIHARA MASAMICHI , TOYOSHIMA TSUTOMU , SUGIMURA YUKINOBU , NAKAMURA KUNIHIKO , YOKOZAWA SHUNYA , MATSUURA YOSHITSUGU
IPC分类号： H01L33/48
CPC分类号： H01L2224/48091 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To improve a thermal characteristic of an LED package and form a reflective surface capable of exhibiting reflective performance at low costs.SOLUTION: An LED package substrate is a laminated body in which metal foils are bonded each other on a flat metal plate with an insulating layer sandwiched therebetween and consisting of polyimide or polyamide-imide resin layer. In the metal foil, a pair of wiring enlarged parts insulated each other by a slit, a pair of external electrode connection parts, and a wiring part to interconnect therebetween are integrally formed, and the wiring enlarged part having a width in the slit direction being larger than that of the wiring part is configured that its width is wider than the length of the long side of an LED chip. A top part of the wiring enlarged part is subjected to a metallic surface treatment acting as a reflective member. Connection electrodes are connected to each of wiring enlarged parts by mounting LED chips. A transparent resin is filled so as to contain at least LED chips and their electrode connection parts.
摘要翻译：要解决的问题：为了提高LED封装的热特性并形成能够以低成本呈现反射性能的反射表面。解决方案：LED封装基板是层压体，其中金属箔彼此粘合在平坦的金属板上，绝缘层夹在其间并由聚酰亚胺或聚酰胺酰亚胺树脂层组成。在金属箔中，通过狭缝彼此绝缘的一对布线扩大部分，一对外部电极连接部分和互连的布线部分被一体地形成，并且沿狭缝方向具有宽度的布线扩大部分是大于布线部分的宽度被构造成其宽度比LED芯片的长边的长度宽。布线扩大部分的顶部经受用作反射构件的金属表面处理。连接电极通过安装LED芯片连接到每个布线扩大部分。填充透明树脂以便至少包含LED芯片及其电极连接部件。版权所有（C）2012，JPO＆INPIT

3. 发明专利

JP2012124453A Led module device and method of manufacturing the same 有权
标题翻译： LED模块装置及其制造方法
公开(公告)号：JP2012124453A
公开(公告)日：2012-06-28
申请号：JP2011109223
申请日：2011-05-16
申请人： Hitachi Chem Co Ltd , Kyushu Institute Of Technology , 国立大学法人九州工業大学 , 日立化成工業株式会社
发明人： ISHIHARA MASAMICHI , TOYOSHIMA TSUTOMU , SUGIMURA YUKINOBU , NAKAMURA KUNIHIKO , YOKOZAWA SHUNYA , MATSUURA YOSHITSUGU
IPC分类号： H01L33/64
CPC分类号： H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To improve heat dissipation characteristics of an LED module device.SOLUTION: An LED package substrate is in a laminated configuration for which metal foil is attached holding an insulating layer comprising a polyimide resin having a film thickness in the range of 5 μm to 40 μm therebetween onto a metal plate bent to form a planar bottom part having an area sufficient for forming an LED chip mounting part and a pair of the connection parts on its upper surface and wall parts respectively rising from both sides of the bottom part end. An LED package is constituted by mounting an LED chip and filling a transparent resin. The LED package is mounted on a wiring board, a pair of external connection electrodes are connected with wiring of the wiring board, and the planar bottom part back surface of the LED package is fixed to or brought into contact with a heat dissipation body.
摘要翻译：要解决的问题：提高LED模块装置的散热特性。解决方案：LED封装基板是层压结构，其上安装有金属箔，该金属箔保持绝缘层，该绝缘层包括膜厚度在5μm至40μm范围内的聚酰亚胺树脂到弯曲形成的金属板上平面底部具有足以形成LED芯片安装部分的面积和在其上表面上分别连接的一对连接部分和分别从底部端部的两侧起起的壁部分。 LED封装通过安装LED芯片并填充透明树脂构成。 LED封装安装在布线板上，一对外部连接电极与布线板的布线连接，LED封装的平面底部背面与散热体固定或接触。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2012025161A Metal foil with resin 审中-公开
标题翻译：金属箔与树脂
公开(公告)号：JP2012025161A
公开(公告)日：2012-02-09
申请号：JP2011170438
申请日：2011-08-03
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TAKANO MARE , OBATA KAZUHITO , MATSUURA YOSHITSUGU , TANAKA MASASHI
IPC分类号： B32B15/092 , B32B15/08 , C08G59/40 , C08J5/24 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board having sufficient adhesiveness between wiring and a substrate and sufficient heat resistance and to provide metal foil with a resin using a curable resin composition which can form a prepreg having sufficiently suppressed breakages or cracks.SOLUTION: The metal foil with the resin includes a resin film comprising the curable resin composition and the metal foil arranged on at least one surface of the resin film. The curable resin composition contains a component (a): an acrylic polymer having a monomer unit derived from glycidyl (meth)acrylate, a component (b): an epoxy resin, a component (c): a phenolic resin, a component (d): a curing promotor, and a component (e): one or more thiol compounds selected from the group comprising alkyl thiols, phenyl thiols and thiol-based coupling agents.
摘要翻译：要解决的问题：提供一种印刷线路板，其在布线和基板之间具有足够的粘合性并具有足够的耐热性，并且可以使用可以形成具有充分抑制断裂或裂纹的预浸料的可固化树脂组合物来提供金属箔的树脂。解决方案：具有树脂的金属箔包括包含可固化树脂组合物和布置在树脂膜的至少一个表面上的金属箔的树脂膜。固化性树脂组合物含有成分（a）：具有源自（甲基）丙烯酸缩水甘油酯的单体单元的丙烯酸类聚合物，成分（b）：环氧树脂，（c）成分：酚醛树脂，成分（d ）：固化促进剂和组分（e）：一种或多种选自包括烷基硫醇，苯基硫醇和硫醇基偶联剂的硫醇化合物。版权所有（C）2012，JPO＆INPIT

5. 发明专利

JP2011109122A Method for manufacturing multilayer printed wiring board 审中-公开
标题翻译：制造多层印刷线路板的方法
公开(公告)号：JP2011109122A
公开(公告)日：2011-06-02
申请号：JP2011002265
申请日：2011-01-07
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TAKANO MARE , TAKEUCHI KAZUMASA , MASUDA KATSUYUKI , TANAKA MASASHI , OBATA KAZUHITO , OYAMA YUJI , MATSUURA YOSHITSUGU
IPC分类号： H05K3/46 , H05K1/03
CPC分类号： B32B27/04 , B29K2105/0872 , H05K1/0366 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/53883
摘要： PROBLEM TO BE SOLVED: To provide a prepreg for a printed wiring board and a metal foil clad laminate that have a small water absorption rate and size variation rate, and exhibit superior bending characteristics when the printed wiring board is molded, and to provide a method for manufacturing a multilayer printed wiring board using them. SOLUTION: The method for manufacturing the multilayer printed wiring board in which the prepreg for the printed wiring board is arranged on a surface of the printed wiring board, a metal foil or a metal foil clad laminate is arranged on a surface of the prepreg for the printed wiring board, and heating and pressing are carried out is characterized in that at least one or more of printed wiring boards is larger than the prepreg for the printed wiring board, and the amount of a resin oozing from the prepreg for the printed wiring board is ≤3 mm under heating and pressing conditions of ≤250°C and ≤10 MPa. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种具有小的吸水率和尺寸变化率的印刷线路板和金属箔覆层压板的预浸料，并且当印刷线路板被模制时表现出优异的弯曲特性，并且提供一种使用它们制造多层印刷线路板的方法。解决方案：制造多层印刷线路板的方法，其中印刷线路板的预浸料布置在印刷线路板的表面上，金属箔或金属箔覆层压板布置在印刷电路板的预浸料坯和加热和压制的特征在于，至少一个或多个印刷电路板比印刷电路板的预浸料坯大，并且从预浸料坯渗出的树脂的量印刷线路板在≤250°C和≤10MPa的加热和压制条件下≤3mm。版权所有（C）2011，JPO＆INPIT

6. 发明专利

JP2003306651A Multilayer adhesive film 审中-公开
标题翻译：多层胶粘膜
公开(公告)号：JP2003306651A
公开(公告)日：2003-10-31
申请号：JP2002112124
申请日：2002-04-15
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： NAGAO KENICHI , OBATA KAZUHITO , MATSUURA YOSHITSUGU , NISHIKATA HIROMI , TANABE MARI
IPC分类号： C09J7/02
摘要： PROBLEM TO BE SOLVED: To obtain an adhesive tape which secures adhesivity reliability for each different kind of a substrate.
SOLUTION: The adhesive film is obtained by mutually overlapping adhesive films suitable for substrates so as to secure adhesivity reliability of the substrates to be bonded in an adhesive which is used in sticking different kinds of materials.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：获得确保每种不同种类的基材的粘合性可靠性的胶带。解决方案：通过相互重叠的适合于基材的粘合剂膜获得粘合剂膜，以便确保粘合的基材的粘合性可靠性用于粘贴不同种类的材料。版权所有（C）2004，JPO

7. 发明专利

JP2013012779A Method for manufacturing multilayer printed wiring board 审中-公开
标题翻译：制造多层印刷线路板的方法
公开(公告)号：JP2013012779A
公开(公告)日：2013-01-17
申请号：JP2012220552
申请日：2012-10-02
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TAKANO MARE , TAKEUCHI KAZUMASA , MASUDA KATSUYUKI , TANAKA MASASHI , OBATA KAZUHITO , OYAMA YUJI , MATSUURA YOSHITSUGU
IPC分类号： H05K3/46
CPC分类号： B32B27/04 , B29K2105/0872 , H05K1/0366 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/53883
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer printed wiring board using a prepreg for a printed wiring board in which the amount of a resin oozing from the prepreg to an inner layer board is small, in molding a multilayer printed wiring board having an inner layer board, such as a rigid-flexible board, protruding therefrom.SOLUTION: A method for manufacturing a multilayer printed wiring board includes the steps of: arranging a prepreg for a printed wiring board on a surface of the printed wiring board; and arranging a metal foil or a metal foil clad laminate on the surface of the prepreg for the printed wiring board, and heating and pressure molding the printed wiring board. At least one or more of the printed wiring boards are larger than the prepreg for the printed wiring board, and the amount of a resin oozing from the prepreg for the printed wiring board is 3 mm or less under heating and pressure molding conditions of 250°C or less and 10 MPa or less.
摘要翻译：要解决的问题：提供一种使用预浸料坯制备多层印刷线路板的方法，所述多层印刷线路板使用从预浸料坯向内层板渗出的树脂量小的印刷线路板的预浸料，具有从其突出的诸如刚性柔性板的内层板的印刷线路板。解决方案：一种制造多层印刷线路板的方法包括以下步骤：在印刷线路板的表面上布置用于印刷线路板的预浸料; 并且在印刷线路板的预浸料坯的表面上布置金属箔或覆盖金属箔的层叠体，并且对印刷线路板进行加热和加压成型。至少一个或多个印刷线路板比印刷线路板的预浸料坯大，并且在加热和加压成型条件为250°时，从印刷线路板的预浸料坯渗出的树脂的量为3mm以下 ℃以下，10MPa以下。版权所有（C）2013，JPO＆INPIT

8. 发明专利

JP2007146121A Viscoelastic resin composition, metal foil-clad laminate using same, prepreg, resin-coated metal foil, and resin film 审中-公开
标题翻译：粘胶树脂组合物，使用相同的金属箔层压板，PREPREG，树脂涂层金属箔和树脂膜
公开(公告)号：JP2007146121A
公开(公告)日：2007-06-14
申请号：JP2006256157
申请日：2006-09-21
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： MATSUURA YOSHITSUGU , TAKANO MARE , NISHIKATA HIROMI , TANAKA MASASHI
IPC分类号： C08L33/14 , B32B15/08 , B32B15/082 , C08J5/24 , C08K5/1515
CPC分类号： H05K3/386 , H05K2201/0154
摘要： PROBLEM TO BE SOLVED: To provide a viscoelastic resin composition capable of forming a material for a printed circuit board which satisfies fully excellent flexibility, heat resistance, and dimensional stability in combination.
SOLUTION: This viscoelastic resin composition contains an acrylic rubber polymer and has a Tg of -20°C-0°C, and the acrylic rubber polymer contains 1-15 mass% glycidyl(meth)acrylate relative to the total as a monomer unit, and its weight average molecular weight is 300,000 to 1,000,000.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够形成印刷电路板材料的粘弹性树脂组合物，该组合物具有充分优异的柔性，耐热性和尺寸稳定性。解决方案：该粘弹性树脂组合物含有丙烯酸橡胶聚合物，Tg为-20℃〜0℃，丙烯酸橡胶聚合物相对于总量为1-15质量％的（甲基）丙烯酸缩水甘油酯单体单元，其重均分子量为30万〜100万。版权所有（C）2007，JPO＆INPIT

9. 发明专利

JP2012164973A Laminate for forming wiring board, wiring board, and method for manufacturing semiconductor device 审中-公开
标题翻译：用于成型布线板，接线板的层压板及制造半导体器件的方法
公开(公告)号：JP2012164973A
公开(公告)日：2012-08-30
申请号：JP2012005539
申请日：2012-01-13
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： INADA TEIICHI , NISHIMURA MASATO , DOBASHI AKIHIKO , OYAMA YASUSHI , OBATA KAZUHITO , MATSUURA YOSHITSUGU , YASU KATSUHIKO
IPC分类号： H05K1/02 , B32B15/08
摘要： PROBLEM TO BE SOLVED: To provide a laminate for forming a wiring board, which allows a wiring board having excellent thermal conductivity to be formed and has excellent processability, and to provide a wiring board manufactured using the same, and a method for manufacturing a semiconductor device.SOLUTION: A laminate for forming a wiring board is configured to include: a wiring board material in which a first metal layer for circuit formation, an insulating layer, and a second metal layer are laminated in this order; an adhesive layer provided on the second metal layer of the wiring board material; and a separator provided on the adhesive layer and having a heat-resistant resin layer.
摘要翻译：要解决的问题：提供一种用于形成布线板的层压体，其允许形成具有优良导热性的布线板并且具有优异的加工性能，并提供使用该布线板制造的布线板制造半导体器件。＆lt; P＆gt;解决方案：一种用于形成布线板的层叠体，其特征在于，包括：依次层叠有电路形成用第1金属层，绝缘层和第2金属层的布线基板材料。设置在所述布线基板材料的所述第二金属层上的粘合层; 以及设置在粘合剂层上并具有耐热树脂层的隔膜。版权所有（C）2012，JPO＆INPIT

10. 发明专利

JP2006219669A Curable resin composition, prepreg, substrate, metal foil-clad laminated plate, metal foil with resin, and printed wiring board 审中-公开
标题翻译：可固化树脂组合物，PREPREG，基材，金属箔层压板，带树脂的金属箔和印刷线路板
公开(公告)号：JP2006219669A
公开(公告)日：2006-08-24
申请号：JP2006005265
申请日：2006-01-12
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TAKANO MARE , OBATA KAZUHITO , MATSUURA YOSHITSUGU , TANAKA MASASHI
IPC分类号： C08L63/00 , C08G59/62 , C08J5/24 , C08K5/21 , H01L23/14 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a curable resin composition capable of forming a printed wiring board exhibiting sufficiently excellent adhesion between wirings and a substrate and a prepreg sufficiently suppressed in breakage or cracks.
SOLUTION: The curable resin composition for a printed wiring board comprises a component (a): an acrylic polymer having a monomer unit derived from glycidyl (meth)acrylate, a component (b): an epoxy resin, a component (c): a phenolic resin, a component (d): a curing accelerator, and a component (e): urea and/or a derivative thereof.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供能够形成印刷线路板的固化性树脂组合物，该印刷线路板在布线和基板之间表现出充分优异的粘合性，并且预浸料被充分抑制破裂或裂纹。＆lt; P＆gt;解决方案：印刷线路板用固化性树脂组合物包含成分（a）：具有来自（甲基）丙烯酸缩水甘油酯的单体单元的丙烯酸类聚合物，（b）成分：环氧树脂，）：酚醛树脂，组分（d）：固化促进剂和组分（e）：脲和/或其衍生物。版权所有（C）2006，JPO＆NCIPI

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式