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    • 4. 发明授权
    • Semiconductor memory device and its test method as well as test circuit
    • 半导体存储器件及其测试方法以及测试电路
    • US07035154B2
    • 2006-04-25
    • US10362891
    • 2001-08-30
    • Hiroyuki TakahashiYoshiyuki KatouHideo InabaShouzou UchidaMasatoshi Sonoda
    • Hiroyuki TakahashiYoshiyuki KatouHideo InabaShouzou UchidaMasatoshi Sonoda
    • G11C29/00G11C7/00
    • G11C29/50016G11C11/401G11C29/12G11C29/46
    • The present invention provides a semiconductor memory device capable of checking operation in the worst case in address combinations, and its manufacturing method. Specific data for test are written into a memory cell array 30. Then, a test signal TE1 is set “1” to set a device in a test mode. Refresh addresses for test are then stored in a data store circuit 51. A first address for test is applied to an address terminal 21, whereby a normal read or write operation is accomplished based on the first address for test. A second address for test is applied to the address terminal 21, whereby a refresh operation is accomplished based on the address for test, and subsequently another normal read or write operation is accomplished based on the second address for test. Data of the memory cell array 30 are checked to decide the presence or absence of any abnormality.
    • 本发明提供一种能够在地址组合中的最坏情况下检查操作的半导体存储器件及其制造方法。 用于测试的具体数据被写入存储单元阵列30.然后,将测试信号TE 1设置为“1”以将设备设置在测试模式中。 然后将用于测试的刷新地址存储在数据存储电路51中。用于测试的第一地址被应用于地址终端21,由此基于用于测试的第一地址来完成正常的读取或写入操作。 用于测试的第二地址被应用于地址终端21,由此基于用于测试的地址来完成刷新操作,并且随后基于第二测试地址来完成另一个正常的读取或写入操作。 对存储单元阵列30的数据进行检查,判定有无异常。