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    • 1. 发明授权
    • Coating solution for forming silica coating and method of forming silica coating
    • 用于形成二氧化硅涂层的涂层溶液和形成二氧化硅涂层的方法
    • US06214104B1
    • 2001-04-10
    • US08692005
    • 1996-08-02
    • Hiroyuki IidaHiroki EndoHideya KobariYoshio HagiwaraToshimasa Nakayama
    • Hiroyuki IidaHiroki EndoHideya KobariYoshio HagiwaraToshimasa Nakayama
    • B05D712
    • C09D4/00C08G77/04
    • A substrate onto which a coating solution is dropped is rotated at a low speed in a first rotational mode and then after an interval of time at a high speed in a second rotational mode. At the end of the first rotational mode, the coating solution is coated to a thickness larger than a given thickness on irregularities on the substrate such as twin patterns and a global pattern, with the coating solution being coated to a thickness smaller than the given thickness between the twin patterns. Subsequently, at the start of the second rotational mode, the coating solution coated on the twin patterns and the global pattern flows into spaces between these patterns. At the end of the second rotational mode, the thickness of the coating solution on the twin patterns is almost nil, and the thickness of the coating solution on the global pattern is small in its entirety though it is somewhat large in the central area of the global pattern.
    • 在第一旋转模式中以低速旋转涂布溶液滴落到其上的基板,然后在第二旋转模式中以高速度在一段时间之后旋转。 在第一旋转模式结束时,将涂布溶液涂覆到基板上的不规则部分上的厚度大于给定厚度,例如双图案和全局图案,涂布溶液的涂布厚度小于给定厚度 在双胞胎之间。 随后,在第二旋转模式开始时,涂覆在双模式上的涂布溶液和全局图案流入这些图案之间的空间。 在第二旋转模式结束时,两个图案上的涂布溶液的厚度几乎为零,并且全局图案上的涂布溶液的厚度整体上小,但是其中心区域 全球格局。
    • 2. 发明授权
    • Solution applying apparatus
    • 解决方案应用设备
    • US5439519A
    • 1995-08-08
    • US176204
    • 1994-01-03
    • Hiroyoshi SagoHirotsugu KumazawaFutoshi ShimaiShigemi FujiyamaHiroki EndoHideya Kobari
    • Hiroyoshi SagoHirotsugu KumazawaFutoshi ShimaiShigemi FujiyamaHiroki EndoHideya Kobari
    • B05C11/08G03F7/16H01L21/00B05C11/02B05C5/00
    • H01L21/6715B05C11/08G03F7/162
    • A solution applying apparatus has inner and outer cups each having an upper opening, the inner cup being rotatably disposed in the outer cup. The inner cup houses a planar workpiece such as a glass substrate therein which is to be coated with a coating solution such as a resist solution. The solution applying apparatus also has a lid assembly having an outer cup lid for closing the upper opening of the outer cup and an inner cup lid for closing the upper opening of the inner cup, the inner cup lid being rotatable with respect to the outer cup lid. The inner cup has drain holes defined in an outer circumferential portion thereof for providing communication between a space within the inner cup and a space outside of the inner cup to drain an excessive coating solution from the inner cup. The outer cup has an annular collection passage defined therein along the outer circumferential portion of the inner cup, the drain holes opening into the annular collection passage. The lid assembly includes a self-centering valve body that can be vertically movable into and out of snugly fitting relation to a through hole defined in the inner cup lid and a lost motion mechanism for moving the valve body to an open position thereof while the first and second cup lids remain closed and for opening the outer cup lid while the inner cup lid remains closed. After the workpiece has been coated with the coating solution, the valve body is lifted out of the through hole to smoothly eliminate a vacuum developed in the inner cup, and then the inner cup is opened.
    • 溶液施加装置具有各自具有上开口的内杯和外杯,内杯可旋转地设置在外杯中。 内杯容纳有诸如抗蚀剂溶液等涂布溶液的平面状的工件,例如玻璃基板。 溶液施加装置还具有盖组件,其具有用于封闭外杯的上开口的外杯盖和用于封闭内杯的上开口的内杯盖,内杯盖可相对于外杯旋转 盖。 内杯具有限定在其外圆周部分中的排水孔,用于提供内杯内的空间和内杯外部的空间之间的连通,以从内杯排出过量的涂层溶液。 外杯具有沿着内杯的外圆周部分限定在其中的环形收集通道,排出孔通向环形收集通道。 盖组件包括自定心阀体,其可以垂直移动进入和离开与内杯盖中限定的通孔的紧密配合关系,以及用于将阀体移动到其打开位置的空动机构,而第一 并且第二杯盖保持关闭并且在内杯盖保持关闭时打开外杯盖。 在工件被涂布溶液之后,将阀体从通孔中提出,以平滑地消除在内杯中显影的真空,然后打开内杯。
    • 3. 发明授权
    • Method of forming coating film on a substrate
    • 在基材上形成涂膜的方法
    • US06277441B1
    • 2001-08-21
    • US08389119
    • 1995-02-15
    • Hiroki EndoHideya KobariKoji UedaHiroyoshi Sago
    • Hiroki EndoHideya KobariKoji UedaHiroyoshi Sago
    • B05D312
    • H01L21/6715B05D1/005C03C17/001C03C2218/116H01L21/02126H01L21/02282H01L21/31051H01L21/316
    • According to the invention disclosed, application liquid such as spin-on-glass (SOG) is dropped on the surface of a substrate such as a semiconductor wafer having irregularities thereon and is dispersed on the substrate surface using a centrifugal force generated by rotating the substrate. The rotation of the substrate is performed in a first rotational action at a low speed and a second rotational action at a high speed, the first and second rotational actions being separated by a time interval. The second rotation may be at a constant speed. Alternatively, the rotational speed of the second rotational action may comprise rotation at an intermediate speed continuously followed by rotation at a higher speed. The time interval between the first and second rotational actions is ten times the duration of the first rotational action or longer. The duration of the second rotational action is three times that of the first rotational action or longer. Such time interval and relative durations make the application liquid more conformable to the substrate surface and causes the application liquid to be sufficiently dispersed on the substrate to provide a film having the desired thickness on the substrate, even though the substrate has irregularities thereon.
    • 根据所公开的发明,将诸如旋涂玻璃(SOG)的涂布液滴落在其上具有不规则性的半导体晶片等基板的表面上,并使用通过旋转基板产生的离心力将其分散在基板表面上 。 基板的旋转以低速的第一旋转动作和高速的第二旋转动作进行,第一和第二旋转动作以时间间隔分开。 第二旋转可以是恒定的速度。 或者,第二旋转动作的旋转速度可以包括以中间速度连续地以较高速度旋转的旋转。 第一和第二旋转动作之间的时间间隔是第一旋转动作的持续时间的十倍或更长。 第二旋转动作的持续时间是第一旋转动作的持续时间的3倍以上。 这样的时间间隔和相对持续时间使得施加液体更适合于衬底表面,并且使得施加液体充分地分散在衬底上,以在衬底上提供具有期望厚度的膜,即使衬底在其上具有不规则性。
    • 10. 发明授权
    • Method for forming a coating film on a plate-like workpiece
    • 在板状工件上形成涂膜的方法
    • US07300889B2
    • 2007-11-27
    • US10914523
    • 2004-08-09
    • Hiroki EndoTaiichiro AokiAkihiko Nakamura
    • Hiroki EndoTaiichiro AokiAkihiko Nakamura
    • H01L
    • H01L21/02337H01L21/02282H01L21/316H01L21/76828
    • A method for forming a coating film, comprises the steps of: applying a raw material of a low dielectric constant onto a surface of a plate-like material; reducing oxygen concentration in the atmosphere surrounding the plate-like material to be less than or equal to 1% before a surface temperature of said plate-like material to be treated rises to 200° C.; thereafter heating said plate-like material to a temperature greater than or equal to 400° C.; and then maintaining the oxygen content in the atmosphere to be less than or equal to 1% until the surface temperature of said plate-like material to be treated lowers to 200° C. The raw material is an organic SOG obtained by hydrolyzing and condensing at least one alkoxysilane compound into an organic solvent under an acid catalyst.
    • 形成涂膜的方法包括以下步骤:将低介电常数的原料施加到板状材料的表面上; 在板状材料的表面温度升高到200℃之前,将板状材料周围的气氛中的氧浓度降低至1%以下。 然后将所述板状材料加热至大于或等于400℃的温度; 然后将大气中的氧含量保持在1%以下,直到所述板状材料的表面温度降低到200℃为止。原料是通过水解和缩合至少一种烷氧基硅烷得到的有机SOG 在酸催化剂下形成有机溶剂。