会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • Method for forming a coating film on a plate-like workpiece
    • 在板状工件上形成涂膜的方法
    • US07300889B2
    • 2007-11-27
    • US10914523
    • 2004-08-09
    • Hiroki EndoTaiichiro AokiAkihiko Nakamura
    • Hiroki EndoTaiichiro AokiAkihiko Nakamura
    • H01L
    • H01L21/02337H01L21/02282H01L21/316H01L21/76828
    • A method for forming a coating film, comprises the steps of: applying a raw material of a low dielectric constant onto a surface of a plate-like material; reducing oxygen concentration in the atmosphere surrounding the plate-like material to be less than or equal to 1% before a surface temperature of said plate-like material to be treated rises to 200° C.; thereafter heating said plate-like material to a temperature greater than or equal to 400° C.; and then maintaining the oxygen content in the atmosphere to be less than or equal to 1% until the surface temperature of said plate-like material to be treated lowers to 200° C. The raw material is an organic SOG obtained by hydrolyzing and condensing at least one alkoxysilane compound into an organic solvent under an acid catalyst.
    • 形成涂膜的方法包括以下步骤:将低介电常数的原料施加到板状材料的表面上; 在板状材料的表面温度升高到200℃之前,将板状材料周围的气氛中的氧浓度降低至1%以下。 然后将所述板状材料加热至大于或等于400℃的温度; 然后将大气中的氧含量保持在1%以下,直到所述板状材料的表面温度降低到200℃为止。原料是通过水解和缩合至少一种烷氧基硅烷得到的有机SOG 在酸催化剂下形成有机溶剂。
    • 2. 发明申请
    • Method for forming a coating film on a plate-like workpiece
    • 在板状工件上形成涂膜的方法
    • US20050009363A1
    • 2005-01-13
    • US10914523
    • 2004-08-09
    • Hiroki EndoTaiichiro AokiAkihiko Nakamura
    • Hiroki EndoTaiichiro AokiAkihiko Nakamura
    • H01L21/20H01L21/31H01L21/312H01L21/314H01L21/316H01L21/768C23F3/00B23P9/00H01L21/469
    • H01L21/02337H01L21/02282H01L21/316H01L21/76828
    • A method for forming a coating film, comprises the steps of: applying a raw material of a low dielectric constant onto a surface of a plate-like material to be treated; reducing oxygen concentration in the atmosphere surrounding the plate-like material to be less than or equal to 1% before a surface temperature of said plate-like material to be treated rises to 200° C.; thereafter heating said plate-like material to be treated to a temperature greater than or equal to 400° C.; and then maintaining the oxygen content in the atmosphere to be less than or equal to 1% until the surface temperature of said plate-like material to be treated lowers to 200° C. The raw material is an organic SOG obtained by hydrolyzing and condensing at least one alkoxysilane compound expressed by the following equation (I) into an organic solvent under an acid catalyst, RnSi(OR1)4-n   (I) where R is an alkyl group or an aryl group having a carbon number of 1-4, R1is an alkyl group having a carbon number of 1-4, and n is an integer of 0-2.
    • 一种形成涂膜的方法,包括以下步骤:将低介电常数的原料施加到待处理的板状材料的表面上; 在待处理的板状材料的表面温度升高到200℃之前,将板状材料周围的气氛中的氧浓度降低至1%以下。 然后将待处理的板状材料加热至大于或等于400℃的温度; 然后将气氛中的氧含量保持在1%以下,直到所述待处理的板状材料的表面温度降至200℃为止。原料是通过水解和冷凝得到的有机SOG 由下式(I)表示的至少一种烷氧基硅烷化合物在酸催化剂RnSi(OR 1)4-n(I)表示的有机溶剂中,其中R是烷基或碳数为1的芳基 -4,R 1是碳数为1-4的烷基,n为0-2的整数。
    • 10. 发明授权
    • Coating solution for forming silica coating and method of forming silica coating
    • 用于形成二氧化硅涂层的涂层溶液和形成二氧化硅涂层的方法
    • US06214104B1
    • 2001-04-10
    • US08692005
    • 1996-08-02
    • Hiroyuki IidaHiroki EndoHideya KobariYoshio HagiwaraToshimasa Nakayama
    • Hiroyuki IidaHiroki EndoHideya KobariYoshio HagiwaraToshimasa Nakayama
    • B05D712
    • C09D4/00C08G77/04
    • A substrate onto which a coating solution is dropped is rotated at a low speed in a first rotational mode and then after an interval of time at a high speed in a second rotational mode. At the end of the first rotational mode, the coating solution is coated to a thickness larger than a given thickness on irregularities on the substrate such as twin patterns and a global pattern, with the coating solution being coated to a thickness smaller than the given thickness between the twin patterns. Subsequently, at the start of the second rotational mode, the coating solution coated on the twin patterns and the global pattern flows into spaces between these patterns. At the end of the second rotational mode, the thickness of the coating solution on the twin patterns is almost nil, and the thickness of the coating solution on the global pattern is small in its entirety though it is somewhat large in the central area of the global pattern.
    • 在第一旋转模式中以低速旋转涂布溶液滴落到其上的基板,然后在第二旋转模式中以高速度在一段时间之后旋转。 在第一旋转模式结束时,将涂布溶液涂覆到基板上的不规则部分上的厚度大于给定厚度,例如双图案和全局图案,涂布溶液的涂布厚度小于给定厚度 在双胞胎之间。 随后,在第二旋转模式开始时,涂覆在双模式上的涂布溶液和全局图案流入这些图案之间的空间。 在第二旋转模式结束时,两个图案上的涂布溶液的厚度几乎为零,并且全局图案上的涂布溶液的厚度整体上小,但是其中心区域 全球格局。