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    • 4. 发明授权
    • Shared body and diffusion contact structure and method for fabricating same
    • 共享体和扩散接触结构及其制造方法
    • US06429477B1
    • 2002-08-06
    • US09702315
    • 2000-10-31
    • Jack A. MandelmanRama DivakaruniWilliam R. Tonti
    • Jack A. MandelmanRama DivakaruniWilliam R. Tonti
    • H01L2976
    • H01L27/10861H01L21/743H01L21/76897H01L27/0214H01L27/10888H01L27/1203
    • The preferred embodiment overcomes the difficulties found in the background art by providing a body contact and diffusion contact formed in a single shared via for silicon on insulator (SOI) technologies. By forming the body contact and diffusion contact in a single shared via, device size is minimized and performance is improved. Particularly, the formed body contact connects the SOI layer with the underlying substrate to avoid instabilities and leakage resulting from a floating SOI channel region. The formed diffusion contact connects device diffusions to above wiring to facilitate device operation. By providing the body contact and diffusion contact together in a single shared via, the preferred embodiment avoids the area penalty that would result from separate contacts. Additionally, the preferred embodiment provides a body contact that is self aligned with other devices, minimizing tolerances needed while minimizing process complexity. Additionally, the shared via body contact and diffusion contact can be selectively formed borderless to adjacent gate conductors in the device.
    • 优选实施例通过提供在用于绝缘体上硅(SOI)技术的单个共享通孔中形成的体接触和扩散接触来克服背景技术中发现的困难。 通过在单个共享通孔中形成体接触和扩散接触,器件尺寸最小化并且性能得到改善。 特别地,形成的体接触将SOI层与底层衬底连接,以避免由浮动SOI沟道区产生的不稳定性和漏电。 形成的扩散触点将器件扩散连接到上述布线以便于器件操作。 通过在单个共享通孔中将身体接触和扩散接触提供在一起,优选的实施例避免了由单独接触引起的区域损失。 此外,优选实施例提供与其他装置自对准的身体接触,使尽可能少的过程复杂性所需的公差最小化。 此外,共享的通孔体接触和扩散接触可以选择性地形成与设备中的相邻栅极导体无边界。
    • 6. 发明授权
    • Programmable anti-fuse structures with conductive material islands
    • 具有导电材料岛的可编程抗熔丝结构
    • US08471356B2
    • 2013-06-25
    • US12761780
    • 2010-04-16
    • Kangguo ChengLouis L. HsuWilliam R. TontiChih-Chao Yang
    • Kangguo ChengLouis L. HsuWilliam R. TontiChih-Chao Yang
    • G06F17/50H01L21/768H01L23/525
    • H01L23/5252G06F17/505H01L2924/0002H01L2924/00
    • Voltage programmable anti-fuse structures and methods are provided that include at least one conductive material island atop a dielectric surface that is located between two adjacent conductive features. In one embodiment, the anti-fuse structure includes a dielectric material having at least two adjacent conductive features embedded therein. At least one conductive material island is located on an upper surface of the dielectric material that is located between the at least two adjacent conductive features. A dielectric capping layer is located on exposed surfaces of the dielectric material, the at least one conductive material island and the at least two adjacent conductive features. When the anti-fuse structure is in a programmed state, a dielectric breakdown path is present in the dielectric material that is located beneath the at least one conductive material island which conducts electrical current to electrically couple the two adjacent conductive features.
    • 提供了电压可编程的抗熔丝结构和方法,其包括位于介于两个相邻导电特征之间的电介质表面上的至少一个导电材料岛。 在一个实施例中,反熔丝结构包括具有嵌入其中的至少两个相邻导电特征的电介质材料。 至少一个导电材料岛位于介电材料的位于至少两个相邻导电特征之间的上表面上。 电介质覆盖层位于电介质材料的暴露表面上,至少一个导电材料岛和至少两个相邻的导电特征。 当反熔丝结构处于编程状态时,介电击穿路径存在于介电材料中,介电材料位于至少一个导电材料岛之下,该导电材料岛传导电流以电耦合两个相邻导电特征。
    • 10. 发明授权
    • Band gap modulated optical sensor
    • 带隙调制光传感器
    • US08008696B2
    • 2011-08-30
    • US12146575
    • 2008-06-26
    • Kangguo ChengToshiharu FurukawaRobert RobisonWilliam R. Tonti
    • Kangguo ChengToshiharu FurukawaRobert RobisonWilliam R. Tonti
    • H01L29/72
    • H01L27/14645H01L27/14627
    • A complementary metal-oxide-semiconductor (CMOS) optical sensor structure comprises a pixel containing a charge collection well of a same semiconductor material as a semiconductor layer in a semiconductor substrate and at least another pixel containing another charge collection well of a different semiconductor material than the material of the semiconductor layer. The charge collections wells have different band gaps, and consequently, generate charge carriers in response to light having different wavelengths. The CMOS sensor structure thus includes at least two pixels responding to light of different wavelengths, enabling wavelength-sensitive, or color-sensitive, capture of an optical data. Further, a design structure for the inventive complementary metal-oxide-semiconductor (CMOS) image sensor is also provided.
    • 互补金属氧化物半导体(CMOS)光学传感器结构包括含有与半导体衬底中的半导体层相同的半导体材料的电荷收集阱的像素,以及包含不同半导体材料的另一电荷收集阱的至少另一个像素 半导体层的材料。 电荷收集阱具有不同的带隙,因此响应于具有不同波长的光而产生电荷载流子。 因此,CMOS传感器结构包括响应于不同波长的光的至少两个像素,使得能够对光学数据进行波长敏感或颜色敏感的捕获。 此外,还提供了本发明的互补金属氧化物半导体(CMOS)图像传感器的设计结构。