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1. 发明申请

US20060197197A1 Surface acoustic wave device and manufacruring method thereof 审中-公开
标题翻译：表面声波装置及其制造方法
公开(公告)号：US20060197197A1
公开(公告)日：2006-09-07
申请号：US11418148
申请日：2006-05-05
申请人： Tadaaki Tsuda , Yasushi Yamamoto , Hiroshi Kawahara , Yoshihiro Takahashi , Minoru Sakai
发明人： Tadaaki Tsuda , Yasushi Yamamoto , Hiroshi Kawahara , Yoshihiro Takahashi , Minoru Sakai
IPC分类号： H01L23/495
CPC分类号： H03H9/1071 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48471 , H01L2224/73265 , H01L2224/83385 , H01L2924/01078 , H01L2924/01079 , H01L2924/15153 , H01L2924/15165 , H01L2924/16152 , H03H9/0585 , Y10T29/42 , H01L2924/00014 , H01L2924/00 , H01L2224/48227
摘要： In the surface acoustic wave device including a lead frame made of metal in which a plurality of inner leads 9 are formed, wherein a chip 1 comprising at least one piezoelectric substrate is mounted on a resin base 3 into which a lead frame is molded integrally, are provided a wire lead section metal surface 7a that is formed by exposing a wire lead section 7, which is electrically connected with an electrode of the chip through a bonding wire 4, out of inner leads that are arranged on both sides of the chip, from the resin base, and a chip lead section metal surface 10a that is formed by exposing a chip lead section 10, which is partially covered with the chip, from the resin base.
摘要翻译：在包括形成有多个内部引线9的由金属构成的引线框架的弹性表面波装置中，其中包括至少一个压电基板的芯片1安装在一个引线框架一体模制的树脂基座3上，设置有引线部金属表面7A，其通过将通过接合线4与芯片的电极电连接的引线部7从配置在芯片的两侧的内部引线露出而形成和从树脂基部暴露由芯片部分覆盖的芯片引线部10形成的芯片引线部金属面10a。

2. 发明授权

US07067963B2 Surface acoustic wave device 失效
标题翻译：表面声波装置
公开(公告)号：US07067963B2
公开(公告)日：2006-06-27
申请号：US09983250
申请日：2001-10-23
申请人： Tadaaki Tsuda , Yasushi Yamamoto , Hiroshi Kawahara , Yoshihiro Takahashi , Minoru Sakai
发明人： Tadaaki Tsuda , Yasushi Yamamoto , Hiroshi Kawahara , Yoshihiro Takahashi , Minoru Sakai
IPC分类号： H01L41/053
CPC分类号： H03H9/1071 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48471 , H01L2224/73265 , H01L2224/83385 , H01L2924/01078 , H01L2924/01079 , H01L2924/15153 , H01L2924/15165 , H01L2924/16152 , H03H9/0585 , Y10T29/42 , H01L2924/00014 , H01L2924/00 , H01L2224/48227
摘要： In the surface acoustic wave device including a lead frame made of metal in which a plurality of inner leads 9 are formed, wherein a chip 1 comprising at least one piezoelectric substrate is mounted on a resin base 3 into which a lead frame is molded integrally, are provided a wire lead section metal surface 7a that is formed by exposing a wire lead section 7, which is electrically connected with an electrode of the chip through a bonding wire 4, out of inner leads that are arranged on both sides of the chip, from the resin base, and a chip lead section metal surface 10a that is formed by exposing a chip lead section 10, which is partially covered with the chip, from the resin base.
摘要翻译：在包括形成有多个内部引线9的由金属构成的引线框架的弹性表面波装置中，其中包括至少一个压电基板的芯片1安装在一个引线框架一体模制的树脂基座3上，设置有引线部金属表面7A，其通过将通过接合线4与芯片的电极电连接的引线部7从配置在芯片的两侧的内部引线露出而形成和从树脂基部暴露由芯片部分覆盖的芯片引线部10形成的芯片引线部金属面10a。

3. 发明授权

US06518501B1 Electronic part and method of assembling the same 失效
标题翻译：电子部件及其组装方法
公开(公告)号：US06518501B1
公开(公告)日：2003-02-11
申请号：US09696580
申请日：2000-10-25
申请人： Hiroshi Kawahara , Minoru Sakai , Yasushi Yamamoto
发明人： Hiroshi Kawahara , Minoru Sakai , Yasushi Yamamoto
IPC分类号： H01L2302
CPC分类号： H03H9/059 , H01L23/055 , H01L23/057 , H01L23/49861 , H01L24/45 , H01L24/48 , H01L2224/05599 , H01L2224/16 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/85399 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/15153 , H01L2924/15165 , H01L2924/15174 , H01L2924/16152 , H01L2924/16195 , H01L2924/19041 , H01L2924/30107 , H03H3/08 , H03H9/0585 , H03H9/1071 , H01L2224/45015 , H01L2924/207
摘要： An electronic part in which a surface acoustic wave device or the like is packaged by using a resin. The electronic part has a resin base in which a lead frame and a resin are integrally molded, a surface acoustic wave device or the like mounted on the top face of the resin base, a bonding wire for connecting a lead portion on the top face of the resin base and the electronic device, and a resin cap which is bonded on the resin base so as to form a space between the resin cap and the resin base. Apart of the lead is bent along the surface of the plastic package. It is also possible to dispose the surface acoustic wave device so that its electrode pattern formation surface faces the resin base without using the bonding wire.
摘要翻译：通过使用树脂封装声表面波器件等的电子部件。该电子部件具有将引线框架和树脂一体成形的树脂基体，安装在树脂基材的顶面上的声表面波装置等，用于将引线部分连接在树脂基材的顶面上的接合线树脂基底和电子器件，以及树脂帽，其接合在树脂基底上，以在树脂帽和树脂基底之间形成空间。除了引线外，塑料包装表面也弯曲。也可以将弹性表面波元件设置为使其电极图形形成面与树脂基体相面对而不使用接合线。

4. 发明授权

US06720845B2 Saw filter device and package for accommodating the same 失效
标题翻译：锯过滤装置和包装用于容纳它
公开(公告)号：US06720845B2
公开(公告)日：2004-04-13
申请号：US09986096
申请日：2001-11-07
申请人： Yoshihiro Takahashi , Tadaaki Tuda , Yasushi Yamamoto , Hiroshi Kawahara
发明人： Yoshihiro Takahashi , Tadaaki Tuda , Yasushi Yamamoto , Hiroshi Kawahara
IPC分类号： H03H964
CPC分类号： H03H9/1071 , H03H9/02921
摘要： A GND terminal 74 extends into a package 7, and the inwardly extending portion has a laterally extending portion (lateral portion) and a longitudinally extending portion (longitudinal portion). The lateral and longitudinal portions of the GND terminal 74 form an L-shaped metal portion 80 extending in a recess 78 of the package 7. When accommodating an SAW filter 100 in the package 7, the SAW package 100 is set in the recess 78 of the package 7 such that the back surface of the chip substrate is in contact with the L-shaped portion 80.
摘要翻译： GND端子74延伸到封装7中，并且向内延伸的部分具有横向延伸部分（侧向部分）和纵向延伸部分（纵向部分）。 GND端子74的横向和纵向部分形成在封装7的凹部78中延伸的L形金属部分80.当在封装7中容纳SAW滤波器100时，SAW封装件100被设置在封装7使得芯片基板的背面与L形部分80接触。

5. 发明授权

US06750592B2 Surface acoustic wave filter and surface acoustic wave filter apparatus 失效
标题翻译：表面声波滤波器和声表面波滤波器
公开(公告)号：US06750592B2
公开(公告)日：2004-06-15
申请号：US09985898
申请日：2001-11-06
申请人： Yoshihiro Takahashi , Tadaaki Tsuda , Yasushi Yamamoto , Hiroshi Kawahara
发明人： Yoshihiro Takahashi , Tadaaki Tsuda , Yasushi Yamamoto , Hiroshi Kawahara
IPC分类号： H01L4104
CPC分类号： H03H9/02921 , H03H9/1071
摘要： The present invention relates to a surface acoustic wave filter in which a plurality of pairs of comb electrode patterns are formed on an upper surface of a chip substrate made of a piezoelectric material. The surface acoustic wave filter includes a high-resistance pattern formed to surround a peripheral portion of the chip substrate on an upper surface side thereof, and a plurality of patterns formed to connect the high-resistance pattern to the respective comb electrode patterns.
摘要翻译：本发明涉及一种表面声波滤波器，其中在由压电材料制成的芯片基板的上表面上形成有多对梳状电极图案。表面声波滤波器包括形成为围绕芯片基板的上表面侧的周边部分的高电阻图案，以及形成为将高电阻图案连接到各个梳状电极图案的多个图案。

6. 发明授权

US08656798B2 Linear actuator 有权
标题翻译：线性执行机构
公开(公告)号：US08656798B2
公开(公告)日：2014-02-25
申请号：US13516454
申请日：2011-04-26
申请人： Hiroshi Kawahara , Tooru Harada , Tomofumi Yamashita
发明人： Hiroshi Kawahara , Tooru Harada , Tomofumi Yamashita
IPC分类号： F16H1/26
CPC分类号： F16H25/20 , F16H25/2015 , F16H25/2214 , F16H2025/204 , F16H2025/2081
摘要： A linear actuator is provided which is able to simplify its structure by adding a stopper function, too, to a detent mechanism and to prevent generation of radial load. The linear actuator comprises a ball screw mechanism, to which a rotational driving force is transmitted, for converting a rotational motion into a linear motion. The ball screw mechanism comprises radially projecting guide projections provided in a linear motion component, and a guide groove arranged in a securing portion facing the linear motion component and is engaged with the guide projections to guide the guide projections in an axial direction. The guide projection has a projection projecting by the predetermined length, while engaging into the guide groove, at a stroke end of the linear motion component and a locking portion provided in a rotary motion component is locked to the projection of the guide projection.
摘要翻译：提供了一种线性致动器，其能够通过向制动机构添加止动器功能并且防止径向载荷的产生来简化其结构。线性致动器包括用于将旋转运动转换成直线运动的滚珠丝杠机构，旋转驱动力被传递到该滚珠丝杠机构。滚珠丝杠机构包括设置在直线运动部件中的径向突出的引导突起，以及布置在面向线性运动部件的固定部分中的引导槽，并且与引导突起接合以沿轴向引导引导突起。引导突起具有在线性运动部件的行程末端处突出预定长度的突起，同时在引导槽中接合，并且设置在旋转运动部件中的锁定部分锁定到引导突起的突出部。

7. 发明授权

US08429800B2 Methods for manufacturing piezoelectric vibrating pieces 失效
标题翻译：制造压电振动片的方法
公开(公告)号：US08429800B2
公开(公告)日：2013-04-30
申请号：US12880514
申请日：2010-09-13
申请人： Hiroshi Kawahara , Ryoichi Ichikawa
发明人： Hiroshi Kawahara , Ryoichi Ichikawa
IPC分类号： H04R17/10 , H01L41/053
CPC分类号： H03H9/1035 , H03H9/0595 , Y10T29/42 , Y10T29/49126 , Y10T29/49144 , Y10T156/10 , Y10T156/1052
摘要： In an exemplary method a piezoelectric wafer is prepared on which multiple piezoelectric frames are formed. Each frame has a piezoelectric vibrating piece including excitation electrodes, and a frame portion surrounds the vibrating piece. A lid wafer is prepared on which multiple respective lids are formed, each sized substantially similarly to the respective frames. A base wafer is prepared on which multiple of bases are formed, each sized substantially similarly to the respective frames. Each base has through-holes. Stripes of a first bonding film are formed on both major surfaces of the piezoelectric wafer around the periphery of each frame. Stripes of a second bonding film are formed on the inner major surface of the lid wafer, corresponding to respective stripes of the first bonding film. Stripes of a third bonding film are formed on the inner major surface of the base wafer, corresponding to respective stripes of the first bonding film. A bonding material is placed between the stripes of first bonding film and respective stripes of second bonding film, and between stripes of first bonding film and respective stripes of third bonding film, by which the three wafers are bonded together after being aligned with each other in a sandwich manner.
摘要翻译：在一个示例性方法中，准备在其上形成多个压电框架的压电晶片。每个框架具有包括激励电极的压电振动片，框架部分围绕振动片。制备盖片晶片，其上形成有多个相应的盖子，每个尺寸基本上与各个框架类似。制备基底晶片，其上形成有多个基底，每个尺寸基本上与各个框架类似。每个基地都有通孔。在每个框架的周围的压电晶片的两个主表面上形成第一接合膜的条纹。第二接合膜的条纹形成在盖晶片的内主表面上，对应于第一接合膜的各条纹。对应于第一接合膜的各个条纹，在基底晶片的内主表面上形成第三接合膜的条纹。在第一接合膜的条纹和第二接合膜的条纹之间以及第一接合膜的条纹和第三接合膜的各条之间放置接合材料，通过该接合材料将三个晶片彼此对准接合在一起一个三明治的方式。

8. 发明申请

US20110309720A1 PIEZOELECTRIC DEVICE AND METHOD FOR MANUFACTURING SAME 失效
标题翻译：压电元件及其制造方法
公开(公告)号：US20110309720A1
公开(公告)日：2011-12-22
申请号：US13120256
申请日：2009-09-24
申请人： Hiroshi Kawahara
发明人： Hiroshi Kawahara
IPC分类号： H01L41/00 , H01L41/22
CPC分类号： H03H9/1035 , H01L23/10 , H01L2924/0002 , H01L2924/01079 , H01L2924/09701 , H03H9/0595 , H01L2924/00
摘要： A piezoelectric device employs solder on a roughened surface to improve bonding of electrical contacts with the device package. The device package includes a base, a crystal frame and a lid. The base includes connecting electrodes on a side of the base adjacent the crystal frame. The base has a through hole and a through hole electrode formed in the through hole in electrical contact with the connecting electrodes. The through hole is sealed with a sealing material and a first external electrode layer, which is electrically connected to the through hole electrode, is formed on an outside surface of the base opposite the piezoelectric plate. A second external electrode layer is formed to cover the first external electrode layer and the sealing material.
摘要翻译：压电装置在粗糙表面上使用焊料来改善电触点与器件封装的结合。该装置包装包括底座，水晶框架和盖子。底座包括在与水晶框架相邻的底座一侧的连接电极。基座具有通孔和形成在通孔中的与通孔电连接的电气接触的通孔电极。通孔用密封材料密封，与通孔电极电连接的第一外部电极层形成在与压电板相对的基座的外表面上。形成第二外部电极层以覆盖第一外部电极层和密封材料。

9. 发明申请

US20110062825A1 PIEZOELECTRIC VIBRATING DEVICES AND METHODS FOR MANUFACTURING SAME 失效
标题翻译：压电振动装置及其制造方法
公开(公告)号：US20110062825A1
公开(公告)日：2011-03-17
申请号：US12859202
申请日：2010-08-18
申请人： Hiroshi Kawahara
发明人： Hiroshi Kawahara
IPC分类号： H01L41/053 , H01L41/22
CPC分类号： H03H9/1035 , H03H9/0595 , Y10T29/42
摘要： An exemplary piezoelectric device includes a piezoelectric vibrating piece, on which excitation electrodes are formed, and a piezoelectric frame having a frame portion surrounding the piezoelectric vibrating piece. A plate (e.g., lid or base) is bonded to one surface of the frame portion. Fitting members are provided on both the frame and the plate. When the piezoelectric frame and plate are brought together for assembly, the fitting members fit together (e.g., interdigitate) to provide quick and error-free alignment. Then, the fitting members are bonded together by a bonding material.
摘要翻译：示例性压电装置包括其上形成有激励电极的压电振动片和具有围绕压电振动片的框架部分的压电框架。板（例如，盖子或底座）结合到框架部分的一个表面。配件均设在框架和板上。当将压电框架和板组合在一起用于组装时，配合构件配合在一起（例如，交叉），以提供快速无误差的对准。然后，通过接合材料将嵌合构件接合在一起。

10. 发明授权

US07587328B2 Transaction adjusting device 失效
公开(公告)号：US07587328B2
公开(公告)日：2009-09-08
申请号：US10070358
申请日：2001-05-11
申请人： Hiroshi Kawahara , Takuya Sato , Daisuke Kobayashi , Jingo Takemura , Yuji Yamamoto , Norio Iwai
发明人： Hiroshi Kawahara , Takuya Sato , Daisuke Kobayashi , Jingo Takemura , Yuji Yamamoto , Norio Iwai
IPC分类号： G06F9/46
CPC分类号： G06Q30/06 , G06Q10/0631
摘要： A transaction coordinating device 100 is composed, in which a transportation adjusting portion 140 is provided for adjusting an insertion of cargo transportation of a spot transaction with respect to a schedule of single and/or plural cargo transportation of predetermined fixed transactions, in the event an insertion of a spot transaction based on a temporary contract with respect to fixed transactions based on the contracts of predetermined period of time is adjusted. Accordingly, inserting cargo transportation of a spot transaction easily into a schedule of single and/or plural cargo transportation of fixed transactions becomes possible even in the event that a spot transaction arises suddenly, and further inserting a commodity transaction under a flexible contract into commodity transactions under rigid contract simply also becomes possible.

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