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1. 发明申请

US20050076967A1 Lead forming for a semiconductor device 失效
标题翻译：半导体器件的引线形成
公开(公告)号：US20050076967A1
公开(公告)日：2005-04-14
申请号：US10613989
申请日：2003-07-08
申请人： Hidetaka Yamasaki , Itaru Matsuo , Hidekazu Manabe , Kenji Imamura , Kenichirou Katou , Mitsutaka Matsuo
发明人： Hidetaka Yamasaki , Itaru Matsuo , Hidekazu Manabe , Kenji Imamura , Kenichirou Katou , Mitsutaka Matsuo
IPC分类号： H01L23/50 , B21F1/00 , H01L21/60 , H01L23/48 , H05K13/00
CPC分类号： H05K13/0092
摘要： In a lead forming apparatus for a semiconductor device, a holder holds a semiconductor device with leads to be formed, the semiconductor device having leads extending from a package. Two die assemblies (for bending, for cutting, or the like) are set in parallel, each including top and bottom dies matched with each other. A mover changes relative distance between the two die assemblies. The top and bottom dies in the two die assemblies are positioned so the leads of the semiconductor device held on the holder are between the dies.
摘要翻译：在用于半导体器件的引线形成装置中，保持器保持具有要形成的引线的半导体器件，该半导体器件具有从封装延伸的引线。两个模具组件（用于弯曲，切割等）平行设置，每个模具组件包括彼此匹配的顶部和底部模具。移动器改变两个模具组件之间的相对距离。两个模具组件中的顶部和底部模具被定位成使得保持在保持器上的半导体器件的引线位于模具之间。

2. 发明授权

US06830446B2 Clamping apparatus 有权
标题翻译：夹紧装置
公开(公告)号：US06830446B2
公开(公告)日：2004-12-14
申请号：US10264354
申请日：2002-10-04
申请人： Hiroyoshi Harada , Itaru Matsuo , Takehiko Ikegami , Hiromichi Yamada , Jyunji Sakakibara , Hiroaki Tanoue
发明人： Hiroyoshi Harada , Itaru Matsuo , Takehiko Ikegami , Hiromichi Yamada , Jyunji Sakakibara , Hiroaki Tanoue
IPC分类号： B29C4566
CPC分类号： B29C45/661
摘要： A clamping apparatus includes upper and lower platens; one or more tiebars connecting the platens; and an intermediate platen between the upper and lower platens for movement relative to and along the tiebars. Upper and lower mold halves are provided on the upper and intermediate platens, respectively. A linkage connects the lower and intermediate platens. The linkage includes upper and lower links connected with each other for rotation on an intermediate shaft. The upper and lower links are pivotably supported on first and second shafts fixed to the intermediate and lower platens, repectively. The intermediate shaft is operatively connected with a drive mechanism so that the drive mechanism transmits a driving force to the linkage, and the lower platen is moved relative to the intermediate platen. A set of a radical needle bearing and a thrust bearing is used for at least one of the intermediate, first, and second shafts.
摘要翻译：夹紧装置包括上压板和下压板; 连接压板的一个或多个连杆; 以及在上压板和下压板之间的中间压板，用于相对于并沿着拉杆运动。上半模和下半模分别设置在上压板和中压板上。连杆连接下部和中间压板。联动装置包括彼此连接以在中间轴上旋转的上部和下部连杆。上连杆和下连杆分别可枢转地支撑在固定到中间和下压板上的第一和第二轴上。中间轴与驱动机构可操作地连接，使得驱动机构向联动装置传递驱动力，下压板相对于中间压板移动。一组自由基滚针轴承和推力轴承用于中间轴，第一轴和第二轴中的至少一个轴。

3. 发明授权

US4904173A Plastic molding device for a semiconductor element 失效
标题翻译：用于半导体元件的塑料模制装置
公开(公告)号：US4904173A
公开(公告)日：1990-02-27
申请号：US174816
申请日：1988-03-29
申请人： Minoru Tanaka , Itaru Matsuo
发明人： Minoru Tanaka , Itaru Matsuo
IPC分类号： B29C33/22 , B29C45/66 , B29C3/06
CPC分类号： B29C33/22 , B29C45/661 , B29C2045/648
摘要： A plastic molding device for a semiconductor element for plastic molding a semiconductor element on a lead frame, which comprises: an upper platen, a lower platen, and a movable platen movably provided at a tie bar which is provided between said two platens; an upper metal mold and a lower metal mold provided at the upper platen and the movable platen, respectively; a motor for applying a raising force for driving the movable platen to; a driving force conversion mechanism for converting the rotation force of the motor into a reciprocative force; and a double toggle mechanism for giving the reciprocative force to the movable platen.

4. 发明授权

US4522627A Process for producing oil-containing, microspherical carbonaceous particles 失效
标题翻译：用于生产含油微球形碳质颗粒的方法
公开(公告)号：US4522627A
公开(公告)日：1985-06-11
申请号：US447289
申请日：1982-12-06
申请人： Shimpei Gomi , Tomomitsu Takeuchi , Itaru Matsuo , Toshio Tsutsui , Takao Nakagawa , Shigeru Miwa
发明人： Shimpei Gomi , Tomomitsu Takeuchi , Itaru Matsuo , Toshio Tsutsui , Takao Nakagawa , Shigeru Miwa
IPC分类号： C10C3/14 , C10L9/00 , C10L5/00 , C10L5/16 , C10L9/10
CPC分类号： C10C3/14
摘要： Molten pitch is mixed and atomized in an inert gas stream having a temperature less than that of the molten pitch, cooled to the ordinary temperature and separated from the gas stream.Fine powder such as carbon, silica alumina and the like is added to at least one step of the process to improve the fluidity of the thusly obtained fine solid pitch spheres. The pitch spheres are easy to storage, handle and transport as they behave like a fluid.
摘要翻译：将熔融沥青在温度低于熔融沥青的惰性气流中混合和雾化，冷却至常温并与气流分离。加入细粉如碳，二氧化硅氧化铝等至少一个步骤，以提高由此获得的细固体沥青球的流动性。球面球体易于储存，处理和运输，因为它们像流体一样。

5. 发明申请

US20060237087A1 Method of forming leads of a packaged semiconductor device 审中-公开
标题翻译：形成封装半导体器件的引线的方法
公开(公告)号：US20060237087A1
公开(公告)日：2006-10-26
申请号：US11445180
申请日：2006-06-02
申请人： Hidetaka Yamasaki , Itaru Matsuo , Hidekazu Manabe , Kenji Imamura , Kenichirou Katou , Mitsutaka Matsuo
发明人： Hidetaka Yamasaki , Itaru Matsuo , Hidekazu Manabe , Kenji Imamura , Kenichirou Katou , Mitsutaka Matsuo
IPC分类号： B21F1/00
CPC分类号： H05K13/0092
摘要： In lead forming of a packaged semiconductor device having sides and leads extending outwardly from the sides of a package, separation between first and second bottom dies is adjusted to receive the package. The first and second bottom dies have top surfaces that include oblique portions. The package is placed between the first and second bottom dies with the leads proximate the top surfaces of the first and second bottom dies. At least one of (i) the first and second bottom dies and (ii) first and second top dies having respective bottom surfaces with oblique portions complementary to the top surfaces of the first and second bottom dies are moved toward each other. The leads are clamped between the top and bottom dies and are formed. Simultaneously, lateral forces, produced through contact of the complementary top and bottom surfaces and the leads, move the first and second top dies laterally, changing separation between the first and second top dies.
摘要翻译：在具有从封装的侧面向外延伸的侧面和引线的封装半导体器件的引线形成中，调节第一和第二底部模具之间的间隔以接收封装。第一和第二底模具有包括倾斜部分的顶表面。包装被放置在第一和第二底模之间，引线靠近第一和第二底模的顶表面。（i）第一和第二底部模具中的至少一个和（ii）具有与第一和第二底部模具的顶表面互补的倾斜部分的相应底部表面的第一和第二顶部模具朝向彼此移动。引线夹在顶部和底部模具之间并形成。同时，通过互补的顶部和底部表面和引线的接触产生的侧向力横向移动第一和第二顶部模具，改变了第一和第二顶部模具之间的分离。

6. 发明授权

US06479318B2 Method of manufacturing a substrate with directionally anisotropic warping 失效
标题翻译：制造具有定向各向异性翘曲的基板的方法
公开(公告)号：US06479318B2
公开(公告)日：2002-11-12
申请号：US09838388
申请日：2001-04-20
申请人： Itaru Matsuo , Hiroshi Ryu , Kayo Miyamura
发明人： Itaru Matsuo , Hiroshi Ryu , Kayo Miyamura
IPC分类号： H01L2144
CPC分类号： B23K1/0016 , B23K2101/40 , H01L23/13 , H01L2924/0002 , H05K1/0271 , H05K3/28 , H01L2924/00
摘要： A semiconductor device substrate which can be easily conveyed and a semiconductor device fabrication method using the substrate. The semiconductor device fabrication method includes forming a solder resist on a semiconductor element mounting plate-shaped substrate having major and minor sides and containing organic matter, having a linear expansion coefficient A different from that of the substrate, warping the substrate along a minor-side direction, and conveying the warped substrate.
摘要翻译：可容易地输送的半导体器件基板和使用该基板的半导体器件制造方法。半导体器件制造方法包括在具有主面和次侧的含有有机物的半导体元件安装板状基板上形成阻焊剂，其具有与基板的线膨胀系数不同的线膨胀系数A，使基板沿着副边方向，并输送翘曲的基材。

7. 发明授权

US4836909A Process of thermally cracking heavy petroleum oil 失效
标题翻译：重质石油的热裂解工艺
公开(公告)号：US4836909A
公开(公告)日：1989-06-06
申请号：US94492
申请日：1987-09-09
申请人： Itaru Matsuo , Yuzo Takahashi , Hideo Hashimoto , Toru Takatsuka , Takeru Iimori , Hitoshi Maekawa , Tamotsu Ito , Yoshihiko Shohji , Ryuzo Watari , Hiroshi Aida
发明人： Itaru Matsuo , Yuzo Takahashi , Hideo Hashimoto , Toru Takatsuka , Takeru Iimori , Hitoshi Maekawa , Tamotsu Ito , Yoshihiko Shohji , Ryuzo Watari , Hiroshi Aida
IPC分类号： C10G9/00 , C10G51/02
CPC分类号： C10G9/00 , C10G51/023
摘要： A process of thermally cracking a heavy petroleum oil wherein the heavy petroleum oil is treated successively in a cracking furnace and then in a perfect mixing type tank reactor. The thermal cracking in the cracking furnace is performed at a temperature at the outlet of the cracking furnace of 450.degree.-520.degree. C. with a conversion of at least 60-75% of the overall conversion rate while the thermal cracking in the tank reactor is performed at a temperature of 400.degree.-450.degree. C. a pressure of from ambient pressure to 1 kg/cm.sup.2 for a period of time of less than 30 minutes but not less than 10 minutes while feeding steam having a temperature of 435.degree.-700.degree. C. to the tank reactor in an amount of 8-20% by weight of the heavy petroleum oil fed to the cracking furnace.
摘要翻译：一种热裂解重质石油的方法，其中重质石油油在裂化炉中依次进行处理，然后在完美混合型罐式反应器中进行。裂解炉中的热裂解在450℃-520℃的出口处的温度下进行，转化率为总转化率的至少60-75％，而釜式反应器中的热裂化在温度为435℃的温度下，在400〜-450℃的温度下进行环境压力〜1kg / cm 2的压力，时间小于30分钟但不低于10分钟， 700℃至储罐反应器，其量为进料至裂解炉的重质石油的8-20重量％。

8. 发明授权

US5164203A Plastic molding device for a semiconductor element 失效
标题翻译：用于半导体元件的塑料模制装置
公开(公告)号：US5164203A
公开(公告)日：1992-11-17
申请号：US831646
申请日：1992-02-07
申请人： Minoru Tanaka , Itaru Matsuo
发明人： Minoru Tanaka , Itaru Matsuo
IPC分类号： B29C33/22 , B29C45/66
CPC分类号： B29C45/661 , B29C33/22 , B29C2045/648
摘要： A plastic molding device for a semiconductor element for plastic molding a semiconductor element on a lead frame, which comprises: an upper platen, a lower platen, and a movable platen movably provided at a tie bar which is provided between said two platens; an upper metal mold and a lower metal mold provided at the upper platen and the movable platen, respectively; a motor for applying a raising force for driving the movable platen; a driving force conversion mechanism for converting the rotation force of the motor into a reciprocative force; and a double toggle mechanism for giving the reciprocative force to the movable platen.
摘要翻译：一种用于在引线框架上塑造半导体元件的半导体元件的塑料模制装置，包括：上压板，下压板和可移动的压板，可移动地设置在设置在所述两个压板之间的连杆上; 分别设置在上压板和可动压板上的上金属模和下金属模; 用于施加用于驱动可动压板的提升力的电动机; 用于将电动机的旋转力转换成往复力的驱动力转换机构; 以及用于向可动压板提供往复力的双肘杆机构。

9. 发明授权

US4477334A Thermal cracking of heavy hydrocarbon oils 失效
标题翻译：重质烃油的热裂解
公开(公告)号：US4477334A
公开(公告)日：1984-10-16
申请号：US583183
申请日：1984-02-24
申请人： Shimpei Gomi , Tomomitsu Takeuchi , Itaru Matsuo , Masaki Fujii , Toru Takatsuka , Ryuzo Watari
发明人： Shimpei Gomi , Tomomitsu Takeuchi , Itaru Matsuo , Masaki Fujii , Toru Takatsuka , Ryuzo Watari
IPC分类号： C10G51/02 , C10G9/14
CPC分类号： C10G51/023
摘要： A heavy hydrocarbon feed stock is, after being heat-treated in a first cracking zone, introduced into a second thermal cracking zone for obtaining a thermally cracked product and a pitch product. The second cracking zone has a plurality of cracking reactors which are connected in series, through which is successively passed the treated feed stock and to each of which is supplied a gaseous heat transfer medium to maintain the liquid phase therein at a temperature sufficient for effecting the thermal cracking and to strip the resulting distillable, cracked components from the liquid phase. The thermal cracking temperature in one reactor is so controlled as to become higher than that in its adjacent upstream-side reactor. The distillable, cracked components in respective reactors are removed overhead therefrom and separated into a heavy fraction and a light fraction, while the liquid phase in the downstream-end reactor is discharged therefrom for recovery as the pitch product. The light fraction is recovered as a light product oil, while the heavy fraction is fed to a third thermal cracking zone for obtaining a tar-containing product which is recycled to at least one of the reactors of the second thermal cracking zone.
摘要翻译：在第一裂解区热处理后，将重质烃原料引入第二热裂解区以获得热裂化产物和沥青产物。第二裂解区具有多个串联连接的裂解反应器，通过该裂化反应器连续通过处理过的原料，并将其中的每一个供应气态传热介质，以保持其中的液相在足以实现热裂解并从液相中剥离得到的可馏出的裂化组分。一个反应器中的热裂解温度被控制得高于其相邻的上游侧反应器中的热裂解温度。各反应器中的可蒸馏的裂化组分在其上从其上除去并分离成重馏分和轻馏分，而下游反应器中的液相从其排出，作为沥青产物进行回收。将轻馏分作为轻质产物油回收，同时将重馏分进料至第三热裂解区，以获得再循环至第二热裂解区的至少一个反应器的含焦油产物。

10. 发明授权

US07077170B2 Method of forming leads of a semiconductor device 失效
标题翻译：形成半导体器件的引线的方法
公开(公告)号：US07077170B2
公开(公告)日：2006-07-18
申请号：US10613989
申请日：2003-07-08
申请人： Hidetaka Yamasaki , Itaru Matsuo , Hidekazu Manabe , Kenji Imamura , Kenichirou Katou , Mitsutaka Matsuo
发明人： Hidetaka Yamasaki , Itaru Matsuo , Hidekazu Manabe , Kenji Imamura , Kenichirou Katou , Mitsutaka Matsuo
IPC分类号： B21F1/00
CPC分类号： H05K13/0092
摘要： In a lead forming apparatus for a semiconductor device, a holder holds a semiconductor device with leads to be formed, the semiconductor device having leads extending from a package. Two die assemblies (for bending, for cutting, or the like) are set in parallel, each including top and bottom dies matched with each other. A mover changes relative distance between the two die assemblies. The top and bottom dies in the two die assemblies are positioned so the leads of the semiconductor device held on the holder are between the dies.
摘要翻译：在用于半导体器件的引线形成装置中，保持器保持具有要形成的引线的半导体器件，该半导体器件具有从封装延伸的引线。两个模具组件（用于弯曲，切割等）平行设置，每个模具组件包括彼此匹配的顶部和底部模具。移动器改变两个模具组件之间的相对距离。两个模具组件中的顶部和底部模具被定位成使得保持在保持器上的半导体器件的引线位于模具之间。

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