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1. 发明申请

US20060001140A1 Semiconductor chip package with thermoelectric cooler 有权
标题翻译：半导体芯片封装带热电冷却器
公开(公告)号：US20060001140A1
公开(公告)日：2006-01-05
申请号：US11169615
申请日：2005-06-30
申请人： Hae-Hyung Lee , Sang-Wook Park , Joong-Hyun Baek , Dong-Ho Lee , Jin-Yang Lee
发明人： Hae-Hyung Lee , Sang-Wook Park , Joong-Hyun Baek , Dong-Ho Lee , Jin-Yang Lee
IPC分类号： H01L23/02
CPC分类号： H01L23/38 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/05553 , H01L2224/05554 , H01L2224/16 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/37599 , H01L2224/48091 , H01L2224/48227 , H01L2224/49112 , H01L2224/49113 , H01L2224/73253 , H01L2224/73265 , H01L2224/8385 , H01L2224/8485 , H01L2225/06589 , H01L2924/00014 , H01L2924/10161 , H01L2924/15311 , H01L2924/19107 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/37099
摘要： The semiconductor chip package may include a substrate having circuit patterns and substrate pads connected with the circuit patterns. At least one semiconductor chip is mounted on the substrate, and a thermoelectric cooler having a P-type material plate and an N-type material plate is mounted on the semiconductor chip. Portions of the P-type and N-type material plates may be attached on the semiconductor chip. The P-type and N-type material plates may be electrically connected to the circuit patterns of the substrate to be provided with DC power.
摘要翻译：半导体芯片封装可以包括具有电路图案的衬底和与电路图案连接的衬底焊盘。至少一个半导体芯片安装在基板上，并且具有P型材料板和N型材料板的热电冷却器安装在半导体芯片上。 P型和N型材料板的部分可以附着在半导体芯片上。 P型和N型材料板可以电连接到衬底的电路图案以提供DC电力。

2. 发明授权

US07301233B2 Semiconductor chip package with thermoelectric cooler 有权
标题翻译：半导体芯片封装带热电冷却器
公开(公告)号：US07301233B2
公开(公告)日：2007-11-27
申请号：US11169615
申请日：2005-06-30
申请人： Hae-Hyung Lee , Sang-Wook Park , Joong-Hyun Baek , Dong-Ho Lee , Jin-Yang Lee
发明人： Hae-Hyung Lee , Sang-Wook Park , Joong-Hyun Baek , Dong-Ho Lee , Jin-Yang Lee
IPC分类号： H01L23/34 , H01L23/10 , H01L23/02
CPC分类号： H01L23/38 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/05553 , H01L2224/05554 , H01L2224/16 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/37599 , H01L2224/48091 , H01L2224/48227 , H01L2224/49112 , H01L2224/49113 , H01L2224/73253 , H01L2224/73265 , H01L2224/8385 , H01L2224/8485 , H01L2225/06589 , H01L2924/00014 , H01L2924/10161 , H01L2924/15311 , H01L2924/19107 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/37099
摘要： The semiconductor chip package may include a substrate having circuit patterns and substrate pads connected with the circuit patterns. At least one semiconductor chip is mounted on the substrate, and a thermoelectric cooler having a P-type material plate and an N-type material plate is mounted on the semiconductor chip. Portions of the P-type and N-type material plates may be attached on the semiconductor chip. The P-type and N-type material plates may be electrically connected to the circuit patterns of the substrate to be provided with DC power.
摘要翻译：半导体芯片封装可以包括具有电路图案的衬底和与电路图案连接的衬底焊盘。至少一个半导体芯片安装在基板上，并且具有P型材料板和N型材料板的热电冷却器安装在半导体芯片上。 P型和N型材料板的部分可以附着在半导体芯片上。 P型和N型材料板可以电连接到衬底的电路图案以提供DC电力。

3. 发明申请

US20060006517A1 Multi-chip package having heat dissipating path 审中-公开
标题翻译：具有散热路径的多芯片封装
公开(公告)号：US20060006517A1
公开(公告)日：2006-01-12
申请号：US11176800
申请日：2005-07-06
申请人： Jin-Yang Lee , Sang-Wook Park , Hae-Hyung Lee , Dong-Ho Lee , Joong-Hyun Baek
发明人： Jin-Yang Lee , Sang-Wook Park , Hae-Hyung Lee , Dong-Ho Lee , Joong-Hyun Baek
IPC分类号： H01L23/02
CPC分类号： H01L25/0657 , H01L23/3677 , H01L24/45 , H01L24/48 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2225/0651 , H01L2225/06586 , H01L2225/06589 , H01L2924/00014 , H01L2924/01077 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012
摘要： A multi-chip package having a heat dissipating path. The multi-chip package includes a stack of integrated circuit (IC) chips, a heat sink part interposed between the IC chips so that one end portion of the heat sink part can be exposed from a side of the stack of integrated circuit chips, a substrate on which the stack of integrated circuit chips is mounted, and solder or solder ball-shaped thermally connecting parts to thermally connect the exposed end portion of the heat sink part to the substrate to dissipate heat collected in the heat sink part through the substrate.
摘要翻译：具有散热路径的多芯片封装。多芯片封装包括集成电路（IC）芯片堆叠，插入在IC芯片之间的散热器部分，使得散热部件的一个端部可以从集成电路芯片堆叠的一侧露出，其上安装有集成电路芯片的堆叠的基板，以及焊料或焊球形的热连接部件，以将散热部件的暴露端部热连接到基板，以散发通过基板收集在散热部件中的热量。

4. 发明授权

US07652383B2 Semiconductor package module without a solder ball and method of manufacturing the semiconductor package module 失效
标题翻译：没有焊球的半导体封装模块和制造半导体封装模块的方法
公开(公告)号：US07652383B2
公开(公告)日：2010-01-26
申请号：US11305282
申请日：2005-12-16
申请人： Seung-Duk Baek , Sun-Won Kang , Dong-Ho Lee , Jong-Joo Lee , Sang-Wook Park
发明人： Seung-Duk Baek , Sun-Won Kang , Dong-Ho Lee , Jong-Joo Lee , Sang-Wook Park
IPC分类号： H01L23/29
CPC分类号： H01L25/105 , H01L23/3107 , H01L23/5385 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2224/04042 , H01L2224/04105 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/48465 , H01L2224/73265 , H01L2224/97 , H01L2225/1005 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/15311 , H01L2924/18162 , H01L2924/19107 , H05K1/181 , H05K3/284 , H05K3/305 , H05K3/328 , H05K2201/10477 , H05K2201/10977 , H05K2203/049 , Y02P70/611 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package module having no solder balls and a method of manufacturing the semiconductor package module are provided. The semiconductor package module includes a module board on which a plurality of semiconductor devices are able to be mounted, a semiconductor package bonded on the module board using an adhesive, being wire-bondable to the module board, and having already undergone an electrical final test, second wires electrically connecting second bond pads of the semiconductor package to bond pads of the module board; and a third sealing resin enclosing the second wires and the semiconductor package. Because the semiconductor package module does not use solder balls, degradation of solder joint reliability (SJR) can be prevented. Further, the use of a semiconductor package that has already undergone an electrical test can reduce degradation of the yield of a completed semiconductor package module.
摘要翻译：提供一种不具有焊球的半导体封装模块和制造该半导体封装模块的方法。该半导体封装模块包括：模块板，多个半导体器件能够安装在该模块板上;半导体封装，使用粘合剂结合在模块板上，可与模块板接合，并且已经经过电气最终测试，将所述半导体封装的第二接合焊盘与所述模块板的焊盘电连接的第二布线; 以及封装第二导线和半导体封装的第三密封树脂。由于半导体封装模块不使用焊球，因此可以防止焊点可靠性（SJR）的劣化。此外，使用已经经历电测试的半导体封装可以降低完成的半导体封装模块的产量的劣化。

5. 发明授权

US07586182B2 Packaged semiconductor die and manufacturing method thereof 失效
标题翻译：封装半导体管芯及其制造方法
公开(公告)号：US07586182B2
公开(公告)日：2009-09-08
申请号：US11289665
申请日：2005-11-28
申请人： Seung-Duk Baek , Sun-Won Kang , Sang-Wook Park , Dong-Ho Lee , Jong-Joo Lee
发明人： Seung-Duk Baek , Sun-Won Kang , Sang-Wook Park , Dong-Ho Lee , Jong-Joo Lee
IPC分类号： H01L23/48 , H01L23/52
CPC分类号： H01L23/49833 , H01L23/3128 , H01L24/48 , H01L25/03 , H01L25/0657 , H01L2224/06135 , H01L2224/06136 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/4824 , H01L2224/73215 , H01L2225/0651 , H01L2225/0652 , H01L2225/06541 , H01L2225/06572 , H01L2225/06586 , H01L2225/06596 , H01L2924/00014 , H01L2924/01079 , H01L2924/15311 , H01L2924/19107 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Aspects of the subject matter described herein relate to a packaged semiconductor die which becomes a component of a finished multi-chip package. The packaged semiconductor die comprises a die substrate, a semiconductor package, and a sealant. The die substrate includes an insulating substrate and a circuit pattern formed on the insulating substrate. The semiconductor package has a semiconductor chip electrically coupled to the circuit pattern that is a known good package and is coupled to the die substrate. The sealant seals the semiconductor package. The packaged semiconductor die utilizes a known good package which has passed a series of package tests.
摘要翻译：本文描述的主题的方面涉及成为成品多芯片封装的部件的封装半导体管芯。封装的半导体管芯包括管芯衬底，半导体封装和密封剂。芯片基板包括绝缘基板和形成在绝缘基板上的电路图案。半导体封装具有电耦合到电路图案的半导体芯片，该电路图案是已知的良好封装并且耦合到管芯衬底。密封剂密封半导体封装。封装的半导体管芯使用已经通过一系列封装测试的已知的良好封装。

6. 发明申请

US20060134833A1 Packaged semiconductor die and manufacturing method thereof 失效
公开(公告)号：US20060134833A1
公开(公告)日：2006-06-22
申请号：US11289665
申请日：2005-11-28
申请人： Seung-Duk Baek , Sun-Won Kang , Sang-Wook Park , Dong-Ho Lee , Jong-Joo Lee
发明人： Seung-Duk Baek , Sun-Won Kang , Sang-Wook Park , Dong-Ho Lee , Jong-Joo Lee
IPC分类号： H01L21/48
CPC分类号： H01L23/49833 , H01L23/3128 , H01L24/48 , H01L25/03 , H01L25/0657 , H01L2224/06135 , H01L2224/06136 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/4824 , H01L2224/73215 , H01L2225/0651 , H01L2225/0652 , H01L2225/06541 , H01L2225/06572 , H01L2225/06586 , H01L2225/06596 , H01L2924/00014 , H01L2924/01079 , H01L2924/15311 , H01L2924/19107 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Aspects of the subject matter described herein relate to a packaged semiconductor die which becomes a component of a finished multi-chip package. The packaged semiconductor die comprises a die substrate, a semiconductor package, and a sealant. The die substrate includes an insulating substrate and a circuit pattern formed on the insulating substrate. The semiconductor package has a semiconductor chip electrically coupled to the circuit pattern that is a known good package and is coupled to the die substrate. The sealant seals the semiconductor package. The packaged semiconductor die utilizes a known good package which has passed a series of package tests.

7. 发明申请

US20060138648A1 Semiconductor package module without a solder ball and method of manufacturing the semiconductor package module 失效
标题翻译：没有焊球的半导体封装模块和制造半导体封装模块的方法
公开(公告)号：US20060138648A1
公开(公告)日：2006-06-29
申请号：US11305282
申请日：2005-12-16
申请人： Seung-Duk Baek , Sun-Won Kang , Dong-Ho Lee , Jong-Joo Lee , Sang-Wook Park
发明人： Seung-Duk Baek , Sun-Won Kang , Dong-Ho Lee , Jong-Joo Lee , Sang-Wook Park
IPC分类号： H01L23/34
CPC分类号： H01L25/105 , H01L23/3107 , H01L23/5385 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2224/04042 , H01L2224/04105 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/48465 , H01L2224/73265 , H01L2224/97 , H01L2225/1005 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/15311 , H01L2924/18162 , H01L2924/19107 , H05K1/181 , H05K3/284 , H05K3/305 , H05K3/328 , H05K2201/10477 , H05K2201/10977 , H05K2203/049 , Y02P70/611 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package module having no solder balls and a method of manufacturing the semiconductor package module are provided. The semiconductor package module includes a module board on which a plurality of semiconductor devices are able to be mounted, a semiconductor package bonded on the module board using an adhesive, being wire-bondable to the module board, and having already undergone an electrical final test, second wires electrically connecting second bond pads of the semiconductor package to bond pads of the module board; and a third sealing resin enclosing the second wires and the semiconductor package. Because the semiconductor package module does not use solder balls, degradation of solder joint reliability (SJR) can be prevented. Further, the use of a semiconductor package that has already undergone an electrical test can reduce degradation of the yield of a completed semiconductor package module.
摘要翻译：提供一种不具有焊球的半导体封装模块和制造该半导体封装模块的方法。该半导体封装模块包括：模块板，多个半导体器件能够安装在该模块板上;半导体封装，使用粘合剂结合在模块板上，可与模块板接合，并且已经经过电气最终测试，将所述半导体封装的第二接合焊盘与所述模块板的焊盘电连接的第二布线; 以及封装第二导线和半导体封装的第三密封树脂。由于半导体封装模块不使用焊球，因此可以防止焊点可靠性（SJR）的劣化。此外，使用已经经历电测试的半导体封装可以降低完成的半导体封装模块的产量的劣化。

8. 发明授权

US10281159B2 Steam cooking apparatus 有权
公开(公告)号：US10281159B2
公开(公告)日：2019-05-07
申请号：US13456897
申请日：2012-04-26
申请人： Guen Yong Park , Jae Hyoun Kim , Cheol Jin Kim , Han Seong Kang , Jin Hae Cho , Eun Oh Kim , Chan Park , Dong-Ho Lee
发明人： Guen Yong Park , Jae Hyoun Kim , Cheol Jin Kim , Han Seong Kang , Jin Hae Cho , Eun Oh Kim , Chan Park , Dong-Ho Lee
IPC分类号： A47J27/21 , F24C15/32
摘要： A steam cooking apparatus with improved water supply and drainage structures. The apparatus includes a body, a cooking compartment, a steam generator to supply steam into the cooking compartment, a water vessel to store water and supply the water into the steam generator, a water supply device including a holder and a slider slidably mounted in the holder so as to be withdrawn from the body, a first water supply tube connecting the slider and the water vessel, a second water supply tube connecting the water vessel and the steam generator, and a drain tube to drain water in the steam generator to the outside of the body. The drain tube includes an end fixed to the slider so that the end of the drain tube is withdrawn with the slider from the body when water in the steam generator is drained to the outside.

9. 发明授权

US08735276B2 Semiconductor packages and methods of manufacturing the same 有权
标题翻译：半导体封装及其制造方法
公开(公告)号：US08735276B2
公开(公告)日：2014-05-27
申请号：US13365378
申请日：2012-02-03
申请人： Hyun-Soo Chung , Jae-Shin Cho , Dong-Ho Lee , Dong-Hyeon Jang , Seong-Deok Hwang , Seung-Duk Baek
发明人： Hyun-Soo Chung , Jae-Shin Cho , Dong-Ho Lee , Dong-Hyeon Jang , Seong-Deok Hwang , Seung-Duk Baek
IPC分类号： H01L21/768
CPC分类号： H01L24/91 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/73 , H01L25/0657 , H01L2224/02166 , H01L2224/0401 , H01L2224/04042 , H01L2224/05599 , H01L2224/13099 , H01L2224/16145 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2225/0651 , H01L2225/06513 , H01L2225/06568 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/00
摘要： Provided are semiconductor packages and methods of manufacturing the semiconductor package. The semiconductor packages may include a substrate including a chip pad, a redistributed line which is electrically connected to the chip pad and includes an opening. The semiconductor packages may also include an external terminal connection portion, and an external terminal connection pad which is disposed at an opening and electrically connected to the redistributed line. The present general inventive concept can solve the problem where an ingredient of gold included in a redistributed line may be prevented from being diffused into an adjacent bump pad to form a void or an undesired intermetallic compound. In a chip on chip structure, a plurality of bumps of a lower chip are connected to an upper chip to improve reliability, diversity and functionality of the chip on chip structure.
摘要翻译：提供半导体封装和制造半导体封装的方法。半导体封装可以包括衬底，其包括芯片焊盘，电连接到芯片焊盘并且包括开口的再分布线。半导体封装还可以包括外部端子连接部分和设置在开口处并电连接到重新分配线路的外部端子连接焊盘。本发明的总体构思可以解决包含在再分布线中的金的成分被阻止扩散到相邻的凸块焊盘中以形成空隙或不期望的金属间化合物的问题。在片上芯片结构中，下部芯片的多个凸起连接到上部芯片以提高片上芯片结构的可靠性，分集性和功能性。

10. 发明授权

US08344952B2 Portable terminal and antenna module thereof for receiving broadcast signal 失效
标题翻译：便携式终端及其天线模块，用于接收广播信号
公开(公告)号：US08344952B2
公开(公告)日：2013-01-01
申请号：US12465416
申请日：2009-05-13
申请人： Kyung-Hack Yi , Dong-Ho Lee
发明人： Kyung-Hack Yi , Dong-Ho Lee
IPC分类号： H01Q1/24
CPC分类号： H01Q1/2283 , H01Q1/243 , H01Q1/38 , H01Q7/08
摘要： A portable terminal with an antenna for receiving broadcast signals, includes an antenna module having a chip antenna patterned on a dielectric chip so as to define a physical length of the antenna module that enables the chip antenna to operate within a broadcast band, and a conductive plate connected to the chip antenna and having an area such that conductive plate leads a main radiation of the antenna module on the broadcast band, whereby the physical length of the antenna module can be reduced as short as possible by employing the chip antenna. Accordingly, the chip antenna facilitates making the antenna module and the portable terminal be smaller in size. Also, the chip antenna is configured to lead a main radiation on the conductive plate, thereby increasing radio reception quality and improving radio performance.
摘要翻译：具有用于接收广播信号的天线的便携式终端包括天线模块，其具有图案化在介质芯片上的芯片天线，以便限定天线模块的物理长度，使得芯片天线能够在广播频带内工作，并且导电连接到芯片天线的板，并且具有使得导电板在广播频带上引导天线模块的主辐射的区域，由此可以通过采用芯片天线尽可能地减小天线模块的物理长度。因此，芯片天线有助于使天线模块和便携式终端的尺寸更小。此外，芯片天线被配置为引导导电板上的主辐射，从而增加无线电接收质量并提高无线电性能。

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