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    • 6. 发明申请
    • Semiconductor module with heat sink and method thereof
    • 具有散热器的半导体模块及其方法
    • US20050201063A1
    • 2005-09-15
    • US10958392
    • 2004-10-06
    • Hae-Hyung LeeSang-Wook ParkJoong-Hyun BaekJin-Yang Lee
    • Hae-Hyung LeeSang-Wook ParkJoong-Hyun BaekJin-Yang Lee
    • H01L23/34H05K7/20
    • H01L23/427H01L23/3672H01L23/467H01L2924/0002H05K7/20509H01L2924/00
    • A semiconductor module, including a semiconductor device mounted on a printed circuit board (PCB), the PCB having an electrical connection to the semiconductor module, and a heat sink in direct contact with the semiconductor device, the heat sink being formed with a first end and a second end, the first end and the second end being formed with different heights, wherein the semiconductor module allows air flow to pass through the semiconductor module, radiating heat away from the heat sink. Another semiconductor module, including a semiconductor device mounted on a PCB, a heat sink in direct contact with the semiconductor device, the heat sink having a first portion and a second portion, wherein the first portion has a flat shape and is in direct contact with the semiconductor device and the second portion has a corrugated shape and is not in contact with the semiconductor device, wherein the semiconductor module allows air flow to pass through the semiconductor module, radiating heat away from the heat sink.
    • 一种半导体模块,包括安装在印刷电路板(PCB)上的半导体器件,具有与半导体模块的电连接的PCB以及与半导体器件直接接触的散热器,散热器形成有第一端 以及第二端,所述第一端和所述第二端形成有不同的高度,其中所述半导体模块允许空气流通过所述半导体模块,从所述散热器辐射热量。 另一个半导体模块,包括安装在PCB上的半导体器件,与半导体器件直接接触的散热器,散热器具有第一部分和第二部分,其中第一部分具有扁平形状并且直接与 半导体器件和第二部分具有波纹形状并且不与半导体器件接触,其中半导体模块允许空气流通过半导体模块,从散热器辐射热量。
    • 9. 发明授权
    • Semiconductor module with heat sink and method thereof
    • 具有散热器的半导体模块及其方法
    • US07345882B2
    • 2008-03-18
    • US10958392
    • 2004-10-06
    • Hae-Hyung LeeSang-Wook ParkJoong-Hyun BaekJin-Yang Lee
    • Hae-Hyung LeeSang-Wook ParkJoong-Hyun BaekJin-Yang Lee
    • H05K7/20H01L23/36
    • H01L23/427H01L23/3672H01L23/467H01L2924/0002H05K7/20509H01L2924/00
    • A semiconductor module, including a semiconductor device mounted on a printed circuit board (PCB), the PCB having an electrical connection to the semiconductor module, and a heat sink in direct contact with the semiconductor device, the heat sink being formed with a first end and a second end, the first end and the second end being formed with different heights, wherein the semiconductor module allows air flow to pass through the semiconductor module, radiating heat away from the heat sink. Another semiconductor module, including a semiconductor device mounted on a PCB, a heat sink in direct contact with the semiconductor device, the heat sink having a first portion and a second portion, wherein the first portion has a flat shape and is in direct contact with the semiconductor device and the second portion has a corrugated shape and is not in contact with the semiconductor device, wherein the semiconductor module allows air flow to pass through the semiconductor module, radiating heat away from the heat sink.
    • 一种半导体模块,包括安装在印刷电路板(PCB)上的半导体器件,具有与半导体模块的电连接的PCB以及与半导体器件直接接触的散热器,散热器形成有第一端 以及第二端,所述第一端和所述第二端形成有不同的高度,其中所述半导体模块允许空气流通过所述半导体模块,从所述散热器辐射热量。 另一个半导体模块,包括安装在PCB上的半导体器件,与半导体器件直接接触的散热器,散热器具有第一部分和第二部分,其中第一部分具有扁平形状并且直接与 半导体器件和第二部分具有波纹形状并且不与半导体器件接触,其中半导体模块允许空气流通过半导体模块,从散热器辐射热量。