专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JPH034631B2 失效
公开(公告)号：JPH034631B2
公开(公告)日：1991-01-23
申请号：JP17636582
申请日：1982-10-08
申请人： HYOGOKEN , DAIWA KASEI KENKYUSHO KK , ISHIHARA YAKUHIN KK
发明人： OBATA KEIGO , DOI NOBUYASU , OKUHAMA YOSHIAKI , MASAKI SEIJI , OKADA YUKYOSHI , YOSHIMOTO MASAKAZU
IPC分类号： C25D3/30 , C25D3/32 , C25D3/34 , C25D3/36 , C25D3/56 , C25D3/60

2. 发明专利

JPH0116318B2 失效
公开(公告)号：JPH0116318B2
公开(公告)日：1989-03-23
申请号：JP3274685
申请日：1985-02-22
申请人： HYOGOKEN , DAIWA KASEI KENKYUSHO KK , ISHIHARA YAKUHIN KK
发明人： OBATA KEIGO , DOI NOBUYASU , OKUHAMA YOSHIAKI , MASAKI SEIJI , OKADA YUKINORI , YOSHIMOTO MASAKAZU
IPC分类号： C25D3/32 , C25D3/36 , C25D3/60

3. 发明专利

JPS6214639B2 失效
公开(公告)号：JPS6214639B2
公开(公告)日：1987-04-03
申请号：JP5519083
申请日：1983-04-01
申请人： HYOGOKEN , DAIWA KASEI KENKYUSHO KK , ISHIHARA YAKUHIN KK
发明人： OBATA KEIGO , DOI NOBUYASU , OKUHAMA YOSHIAKI , MASAKI SEIJI , OKADA YUKYOSHI , YOSHIMOTO MASAKAZU
IPC分类号： C25D3/32 , C25D3/30 , C25D3/34 , C25D3/36 , C25D3/60

4. 发明专利

JPS59182986A Tin, lead and tin-lead alloy plating bath 失效
标题翻译： TIN，铅和铅铅合金镀锌浴
公开(公告)号：JPS59182986A
公开(公告)日：1984-10-17
申请号：JP5519083
申请日：1983-04-01
申请人： Daiwa Kasei Kenkyusho:Kk , Nobuyasu Doi , Ishihara Yakuhin Kk , Keigo Obata
发明人： OBATA KEIGO , DOI NOBUYASU , OKUHAMA YOSHIAKI , MASAKI SEIJI , OKADA YUKIYOSHI , YOSHIMOTO MASAKAZU
IPC分类号： C25D3/32 , C25D3/30 , C25D3/34 , C25D3/36 , C25D3/60
摘要： PURPOSE: To obtain homogeneous plating at a higher speed by adding a specified surfactant combined with a leveling agent to a plating bath contg. a salt of alkanesulfonic acid or alkanolsulfonic acid as a soluble complex salt which is common to bivalent tin and lead.
CONSTITUTION: One or more kinds of nonionic surfactants represented by the formula and a leveling agent are added to a plating bath contg. alkanesulfonic acid or alkanolsulfonic acid and the bivalent tin salt of the acid and/or the bivalent lead salt of the acid. In the formula, A is a residue of 8W22C higher alcohol, 1W25C alkylphenol, 1W25C alkyl-β-naphthol, 3W22C fatty acid amide, 1W25C alkoxylated phosphoric acid, sorbitan esterified with 8W22C higher fatty acid or styrenated phenol (1W4C alkyl or phenyl may be substituted for H in the phenol ring), each of R' and R" is H or methyl, they are different from each other, and each of m and n is an integer of 1W30.
COPYRIGHT: (C)1984,JPO&Japio
摘要翻译：目的：通过将特定的表面活性剂与流平剂结合添加到电镀浴中，以更高的速度获得均匀的电镀。烷基磺酸或链烷醇磺酸的盐作为二价锡和铅常见的可溶性配盐。构成：将一种或多种由式表示的非离子表面活性剂和流平剂加入到镀浴中。烷基磺酸或链烷醇磺酸和酸的二价锡盐和/或酸的二价铅盐。在该式中，A为8-22C高级醇，1-25℃烷基酚，1-25℃烷基-β-萘酚，3-22C脂肪酸酰胺，1-25℃烷氧基化磷酸，8-22℃更高级酯化的脱水山梨糖醇的残基脂肪酸或苯乙烯苯酚（1-4C烷基或苯基可以取代酚环中的H），R'和R“各自为H或甲基，它们彼此不同，m和n各自为整数1-30。

5. 发明专利

JPS6148589A Tin-lead alloy plating bath 失效
标题翻译： TIN-LEAD合金镀锌浴
公开(公告)号：JPS6148589A
公开(公告)日：1986-03-10
申请号：JP16989884
申请日：1984-08-16
申请人： Daiwa Kasei Kenkyusho:Kk , Nobuyasu Doi , Ishihara Yakuhin Kk , Keigo Obata
发明人： OBATA KEIGO , DOI NOBUYASU , OKUHAMA YOSHIAKI , MASAKI SEIJI , OKADA YUKITAKA , YOSHIDA TADASHI
IPC分类号： C25D3/60 , H05K3/24 , H05K3/34
CPC分类号： H05K3/3473
摘要： PURPOSE: To form an Sn-Pb plating film having an always specified Sn/Pb ratio regardless of current density by adding at least one kind of guanamine compd. to an Sn-Pb alloy plating bath consisting essentially of org. tin sulfonate-lead salt and free org. sulfonic acid.
CONSTITUTION: The guanamide compd. expressed by general formula ( I ) is incorporated at 0.01W30g/l ratio into the plating bath contg. the alkali sulfonic acid and alkanol sulfonic acid expressed by the generatl formula R-SO
3 H (where R: an alkyl group of 1W12C) and the general formula HO-R-SO
3 H (where R: an alkyl group of 1W12C, hydroxyl group may be in any position of the alkyl group) as well as the bivalent Sn salt and Pb salt thereof at 0.5W200g/l in terms of metals as the electroplating bath of the Sn-Pb alloy. The always stable alloy plating film of Sn/Pb is obtd. regardless of the current density of the plating current.
COPYRIGHT: (C)1986,JPO&Japio
摘要翻译：目的：通过添加至少一种胍胺化合物，形成总是规定的Sn / Pb比例的Sn-Pb镀膜，而不管电流密度如何。涉及一种Sn-Pb合金电镀浴，其基本上由组织锡磺酸铅盐和免费组织。磺酸。宪法：由通式（I）表示的化合物以0.01-30g / l的比例掺入镀浴中。由式R-SO 3 H（其中R为1-12℃的烷基）和通式为HO-R-SO 3 H（其中R为1-12℃的烷基，羟基的烷基）表示的碱金属磺酸和链烷醇磺酸基团可以在烷基的任何位置）以及其二价Sn盐和Pb盐在作为Sn-Pb合金的电镀浴的金属方面为0.5-200g / l。 Sn / Pb总是稳定的合金镀膜。不管电流电流的当前密度如何。

6. 发明专利

JPS5967387A Tin, lead and tin-lead alloy plating bath 失效
标题翻译： TIN，铅和铅铅合金镀锌浴
公开(公告)号：JPS5967387A
公开(公告)日：1984-04-17
申请号：JP17636582
申请日：1982-10-08
申请人： Daiwa Kasei Kenkyusho:Kk , Hiyougoken , Ishihara Yakuhin Kk
发明人： OBATA KEIGO , DOI NOBUYASU , OKUHAMA YOSHIAKI , MASAKI SEIJI , OKADA YUKIYOSHI , YOSHIMOTO MASAKAZU
IPC分类号： C25D3/30 , C25D3/32 , C25D3/34 , C25D3/36 , C25D3/56 , C25D3/60
CPC分类号： C25D3/32 , C25D3/36 , C25D3/56 , C25D3/60
摘要： PURPOSE: To obtain a tin, lead or tin-lead alloy plating bath giving homogeneous and dense plating at high speed, by adding cationic and nonionic surfactants each hving a specified structure and a leveling agent to a tin, lead or tin- lead alloy plating soln. contg. alkane sulfonic acid.
CONSTITUTION: A plating bath contg. alkanesulfonic acid, alkanolsulfonic acid and bivalent tin salt and/or lead salt is prepared. To the plating bath are added about 0.01W50g/l of ≥1 kind of cationic surfactant represented by formula I or IIsuch as lauryltrimethylammonium salt and/or ≥1 kind of nonionic surfactant represented by formula III such as styrenated phenol and about 0.01W30g/l leveling agent such as N-(3-hydroxybutylidene)-p-sulfanilic acid. The resulting plating bath does not contain hydroborofluoric acid which is unfavorable for pollution control. The bath can be used over a wide range of current density.
COPYRIGHT: (C)1984,JPO&Japio
摘要翻译：目的：通过向锡，铅或锡铅合金电镀加入特定结构的阳离子和非离子表面活性剂和流平剂，得到锡，铅或锡铅合金电镀液，高速均匀且致密的电镀 SOLN。 contg。烷烃磺酸。构成：电镀浴烷基磺酸，链烷醇磺酸和二价锡盐和/或铅盐。向电镀浴中加入约0.01-50g / l的由式I或II表示的阳离子表面活性剂，如月桂基三甲基铵盐和/或> = 1种由式III表示的非离子表面活性剂如苯乙烯化苯酚和约0.01 -30g / l流平剂，如N-（3-羟基亚丁基） - 对氨基苯磺酸。所得镀液不含不利于污染控制的氢硼氟酸。该浴可以在宽电流密度范围内使用。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式