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    • 10. 发明专利
    • Tin, lead and tin-lead alloy plating bath
    • TIN,铅和铅铅合金镀锌浴
    • JPS59182986A
    • 1984-10-17
    • JP5519083
    • 1983-04-01
    • Daiwa Kasei Kenkyusho:KkNobuyasu DoiIshihara Yakuhin KkKeigo Obata
    • OBATA KEIGODOI NOBUYASUOKUHAMA YOSHIAKIMASAKI SEIJIOKADA YUKIYOSHIYOSHIMOTO MASAKAZU
    • C25D3/32C25D3/30C25D3/34C25D3/36C25D3/60
    • PURPOSE: To obtain homogeneous plating at a higher speed by adding a specified surfactant combined with a leveling agent to a plating bath contg. a salt of alkanesulfonic acid or alkanolsulfonic acid as a soluble complex salt which is common to bivalent tin and lead.
      CONSTITUTION: One or more kinds of nonionic surfactants represented by the formula and a leveling agent are added to a plating bath contg. alkanesulfonic acid or alkanolsulfonic acid and the bivalent tin salt of the acid and/or the bivalent lead salt of the acid. In the formula, A is a residue of 8W22C higher alcohol, 1W25C alkylphenol, 1W25C alkyl-β-naphthol, 3W22C fatty acid amide, 1W25C alkoxylated phosphoric acid, sorbitan esterified with 8W22C higher fatty acid or styrenated phenol (1W4C alkyl or phenyl may be substituted for H in the phenol ring), each of R' and R" is H or methyl, they are different from each other, and each of m and n is an integer of 1W30.
      COPYRIGHT: (C)1984,JPO&Japio
    • 目的:通过将特定的表面活性剂与流平剂结合添加到电镀浴中,以更高的速度获得均匀的电镀。 烷基磺酸或链烷醇磺酸的盐作为二价锡和铅常见的可溶性配盐。 构成:将一种或多种由式表示的非离子表面活性剂和流平剂加入到镀浴中。 烷基磺酸或链烷醇磺酸和酸的二价锡盐和/或酸的二价铅盐。 在该式中,A为8-22C高级醇,1-25℃烷基酚,1-25℃烷基-β-萘酚,3-22C脂肪酸酰胺,1-25℃烷氧基化磷酸,8-22℃更高级酯化的脱水山梨糖醇的残基 脂肪酸或苯乙烯苯酚(1-4C烷基或苯基可以取代酚环中的H),R'和R“各自为H或甲基,它们彼此不同,m和n各自为 整数1-30。