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1. 发明专利

JPS59182986A Tin, lead and tin-lead alloy plating bath 失效
标题翻译： TIN，铅和铅铅合金镀锌浴
公开(公告)号：JPS59182986A
公开(公告)日：1984-10-17
申请号：JP5519083
申请日：1983-04-01
申请人： Daiwa Kasei Kenkyusho:Kk , Nobuyasu Doi , Ishihara Yakuhin Kk , Keigo Obata
发明人： OBATA KEIGO , DOI NOBUYASU , OKUHAMA YOSHIAKI , MASAKI SEIJI , OKADA YUKIYOSHI , YOSHIMOTO MASAKAZU
IPC分类号： C25D3/32 , C25D3/30 , C25D3/34 , C25D3/36 , C25D3/60
摘要： PURPOSE: To obtain homogeneous plating at a higher speed by adding a specified surfactant combined with a leveling agent to a plating bath contg. a salt of alkanesulfonic acid or alkanolsulfonic acid as a soluble complex salt which is common to bivalent tin and lead.
CONSTITUTION: One or more kinds of nonionic surfactants represented by the formula and a leveling agent are added to a plating bath contg. alkanesulfonic acid or alkanolsulfonic acid and the bivalent tin salt of the acid and/or the bivalent lead salt of the acid. In the formula, A is a residue of 8W22C higher alcohol, 1W25C alkylphenol, 1W25C alkyl-β-naphthol, 3W22C fatty acid amide, 1W25C alkoxylated phosphoric acid, sorbitan esterified with 8W22C higher fatty acid or styrenated phenol (1W4C alkyl or phenyl may be substituted for H in the phenol ring), each of R' and R" is H or methyl, they are different from each other, and each of m and n is an integer of 1W30.
COPYRIGHT: (C)1984,JPO&Japio
摘要翻译：目的：通过将特定的表面活性剂与流平剂结合添加到电镀浴中，以更高的速度获得均匀的电镀。烷基磺酸或链烷醇磺酸的盐作为二价锡和铅常见的可溶性配盐。构成：将一种或多种由式表示的非离子表面活性剂和流平剂加入到镀浴中。烷基磺酸或链烷醇磺酸和酸的二价锡盐和/或酸的二价铅盐。在该式中，A为8-22C高级醇，1-25℃烷基酚，1-25℃烷基-β-萘酚，3-22C脂肪酸酰胺，1-25℃烷氧基化磷酸，8-22℃更高级酯化的脱水山梨糖醇的残基脂肪酸或苯乙烯苯酚（1-4C烷基或苯基可以取代酚环中的H），R'和R“各自为H或甲基，它们彼此不同，m和n各自为整数1-30。

2. 发明专利

JPS5934229B2 JPS5934229B2 - 失效
公开(公告)号：JPS5934229B2
公开(公告)日：1984-08-21
申请号：JP6907282
申请日：1982-04-23
申请人： Nobuyasu Doi , Keigo Obata , Tsukasa Sonoda
发明人： DOI NOBUYASU , OBATA KEIGO , SONODA TSUKASA
IPC分类号： C23C18/52 , C23C18/31
CPC分类号： C23C18/31

3. 发明专利

JPS6148589A Tin-lead alloy plating bath 失效
标题翻译： TIN-LEAD合金镀锌浴
公开(公告)号：JPS6148589A
公开(公告)日：1986-03-10
申请号：JP16989884
申请日：1984-08-16
申请人： Daiwa Kasei Kenkyusho:Kk , Nobuyasu Doi , Ishihara Yakuhin Kk , Keigo Obata
发明人： OBATA KEIGO , DOI NOBUYASU , OKUHAMA YOSHIAKI , MASAKI SEIJI , OKADA YUKITAKA , YOSHIDA TADASHI
IPC分类号： C25D3/60 , H05K3/24 , H05K3/34
CPC分类号： H05K3/3473
摘要： PURPOSE: To form an Sn-Pb plating film having an always specified Sn/Pb ratio regardless of current density by adding at least one kind of guanamine compd. to an Sn-Pb alloy plating bath consisting essentially of org. tin sulfonate-lead salt and free org. sulfonic acid.
CONSTITUTION: The guanamide compd. expressed by general formula ( I ) is incorporated at 0.01W30g/l ratio into the plating bath contg. the alkali sulfonic acid and alkanol sulfonic acid expressed by the generatl formula R-SO
3 H (where R: an alkyl group of 1W12C) and the general formula HO-R-SO
3 H (where R: an alkyl group of 1W12C, hydroxyl group may be in any position of the alkyl group) as well as the bivalent Sn salt and Pb salt thereof at 0.5W200g/l in terms of metals as the electroplating bath of the Sn-Pb alloy. The always stable alloy plating film of Sn/Pb is obtd. regardless of the current density of the plating current.
COPYRIGHT: (C)1986,JPO&Japio
摘要翻译：目的：通过添加至少一种胍胺化合物，形成总是规定的Sn / Pb比例的Sn-Pb镀膜，而不管电流密度如何。涉及一种Sn-Pb合金电镀浴，其基本上由组织锡磺酸铅盐和免费组织。磺酸。宪法：由通式（I）表示的化合物以0.01-30g / l的比例掺入镀浴中。由式R-SO 3 H（其中R为1-12℃的烷基）和通式为HO-R-SO 3 H（其中R为1-12℃的烷基，羟基的烷基）表示的碱金属磺酸和链烷醇磺酸基团可以在烷基的任何位置）以及其二价Sn盐和Pb盐在作为Sn-Pb合金的电镀浴的金属方面为0.5-200g / l。 Sn / Pb总是稳定的合金镀膜。不管电流电流的当前密度如何。

4. 发明专利

JPS58185759A Electroless plating method 失效
标题翻译：电镀法
公开(公告)号：JPS58185759A
公开(公告)日：1983-10-29
申请号：JP6907282
申请日：1982-04-23
申请人： Nobuyasu Doi , Keigo Obata , Tsukasa Sonoda
发明人： DOI NOBUYASU , OBATA KEIGO , SONODA TSUKASA
IPC分类号： C23C18/52 , C23C18/31
CPC分类号： C23C18/31
摘要： PURPOSE:To obtain an Sn film having high adhesive strength and solderability by electroless plating using Ti as a reducing agent, by utilizing a plating soln. of specified org. sulfonates as a soln. in which both of Ti and Sn are dissolved. CONSTITUTION:An org. sulfonic acid is selected from a group consisting of hydroxyalkanesulfonic acids represented by formula I (where n is 0-2 and m is 1-3), alkanesulfonic acids represented by formula II (where n is 1 or 2), and benzenesulfonic acid or a deriv. thereof represented by formula III (where X is H or OH). A plating soln. contg. the salt of the selected sulfonic acid with Ti as a reducing agent and the salt of the acid with Sn is prepared. A material to be plated is immersed in the plating soln. to carry out plating.
摘要翻译：目的：通过使用电镀溶液，通过使用Ti 3+作为还原剂，通过无电镀获得具有高粘合强度和可焊性的Sn膜。的指定组织磺酸盐作为溶剂。其中Ti和Sn都溶解。构成：组织磺酸选自由式I表示的羟基链烷磺酸（其中n为0-2且m为1-3），由式II表示的链烷磺酸（其中n为1或2），苯磺酸或派生。由式III表示（其中X为H或OH）。电镀溶液对比选择的具有Ti 3+的磺酸作为还原剂的盐和具有Sn 2+的酸的盐被制备。将待镀的材料浸入电镀溶液中。进行电镀。

5. 发明授权

US07669752B2 Flux for soldering and circuit board 有权
标题翻译：用于焊接和电路板的焊剂
公开(公告)号：US07669752B2
公开(公告)日：2010-03-02
申请号：US11767194
申请日：2007-06-22
申请人： Kazuki Ikeda , Shunsuke Ishikawa , Takaaki Anada , Keigo Obata , Takao Takeuchi , Naoya Inoue
发明人： Kazuki Ikeda , Shunsuke Ishikawa , Takaaki Anada , Keigo Obata , Takao Takeuchi , Naoya Inoue
IPC分类号： B23K31/02
CPC分类号： H05K3/3489 , H05K3/244 , H05K2203/121 , Y10T428/24917
摘要： A flux contains resin having film forming ability, activator, solvent and at least one complex selected from silver complex and copper complex. The flux is used when soldering is performed onto a circuit having electroless nickel plating or further having gold plating on the electroless nickel plating. Allowing a barrier layer of silver or copper to deposit on the surfaces of lands suppresses the diffusion of nickel into the melted solder alloy during soldering, and also prevents phosphorous concentration. This improves the bonding strength of soldering and suppresses the reduction deposition of silver and/or copper to portions other than circuit patterns.
摘要翻译：助熔剂含有具有成膜能力的树脂，活化剂，溶剂和至少一种选自银络合物和铜络合物的络合物。当在具有化学镀镍的电路上进行焊接或在化学镀镍上进一步具有镀金时，使用焊剂。允许银或铜的阻挡层沉积在焊盘的表面上，抑制镍在焊接期间向熔化的焊料合金中扩散，并且还防止磷浓度。这提高了焊接的接合强度，并且抑制了银和/或铜对除了电路图案之外的部分的还原沉积。

6. 发明授权

US06923875B2 Solder precipitating composition 有权
标题翻译：焊锡沉淀组合物
公开(公告)号：US06923875B2
公开(公告)日：2005-08-02
申请号：US10342210
申请日：2003-01-15
申请人： Kazuki Ikeda , Hiroshi Tanaka , Hisao Irie , Keigo Obata , Takao Takeuchi , Naoya Inoue
发明人： Kazuki Ikeda , Hiroshi Tanaka , Hisao Irie , Keigo Obata , Takao Takeuchi , Naoya Inoue
IPC分类号： B23K35/34 , B23K35/26 , B23K35/363 , C22C13/00 , H05K3/34 , C23C18/00
CPC分类号： H05K3/3484 , B23K35/262 , B23K35/34 , H05K2203/121
摘要： According to present invention, there is provided a lead-free solder precipitating composition comprising a tin powder, and a complex of silver ions and/or copper ions and aryl phosphines, alkyl phosphine, phosphines or azoles. The solder precipitating composition can form proper lead-free solder on lands of a circuit board, without forming silver and/or copper film on the circuit board.
摘要翻译：根据本发明，提供了一种无铅焊料沉淀组合物，其包含锡粉末，以及银离子和/或铜离子与芳基膦，烷基膦，膦或唑类的络合物。焊料沉淀组合物可以在电路板的焊盘上形成适当的无铅焊料，而不在电路板上形成银和/或铜膜。

7. 发明授权

US06852210B2 Plating method and plating bath precursor used therefor 失效
标题翻译：电镀方法及镀浴前驱体
公开(公告)号：US06852210B2
公开(公告)日：2005-02-08
申请号：US10036506
申请日：2002-01-07
申请人： Keigo Obata , Dong-Hyun Kim , Takao Takeuchi , Seiichiro Nakao , Shinji Inazawa , Ayao Kariya , Masatoshi Majima , Shigeyoshi Nakayama
发明人： Keigo Obata , Dong-Hyun Kim , Takao Takeuchi , Seiichiro Nakao , Shinji Inazawa , Ayao Kariya , Masatoshi Majima , Shigeyoshi Nakayama
IPC分类号： C23C18/31 , C23C18/16 , C23C18/34 , C25D3/56
CPC分类号： C23C18/1617 , C23C18/34 , Y10S428/935 , Y10T428/12681 , Y10T428/12701 , Y10T428/12708 , Y10T428/12792 , Y10T428/12819 , Y10T428/12826 , Y10T428/12847 , Y10T428/12861 , Y10T428/12875 , Y10T428/12889 , Y10T428/12896 , Y10T428/12903 , Y10T428/12944 , Y10T428/12951
摘要： To provide a plating method, which enables wide industrial use of the redox system electroless plating method having excellent characteristics, and a plating bath precursor which is preferable for the plating method. The plating method comprises a process oxidizing first metal ions of a redox system of a plating bath from a lower oxidation state to a high oxidation state, and second metal ions of said redox system are reduced and deposited onto the surface of an object to be plated, wherein a process is provided in which by supplying the electrical current to the plating bath, the first metal ions are reduced from said lower oxidation state to thereby activate the plating bath. The plating bath precursor is formed stabilizing the plating bath so that reduction and deposition of the second metal ions substantially do not occur in order to improve its storing performance.
摘要翻译：为了提供能够广泛地使用具有优异特性的氧化还原体系无电镀方法的镀覆方法，以及优选用于电镀方法的镀浴前体。电镀方法包括将电镀浴的氧化还原体系的第一金属离子氧化为较低氧化态的工艺，并且所述氧化还原体系的第二金属离子被还原并沉积到被镀物体的表面上其中提供了一种通过向电镀槽供应电流的方法，使第一金属离子从所述较低氧化态还原，从而激活镀浴。形成电镀槽前体稳定电镀液，从而基本上不会发生第二金属离子的还原和沉积，以改善其存储性能。

8. 发明授权

US06607653B1 Plating bath and process for depositing alloy containing tin and copper 有权
标题翻译：电镀浴和沉积含锡和铜合金的工艺
公开(公告)号：US06607653B1
公开(公告)日：2003-08-19
申请号：US09667715
申请日：2000-09-22
申请人： Kiyotaka Tsuji , Keigo Obata , Takao Takeuchi , Hidemi Nawafune , Tetsuji Nishikawa
发明人： Kiyotaka Tsuji , Keigo Obata , Takao Takeuchi , Hidemi Nawafune , Tetsuji Nishikawa
IPC分类号： C25D358
CPC分类号： C25D3/60
摘要： The present invention provides a tin-copper alloy plating bath, tin-copper-bismuth alloy plating bath or tin-copper-silver alloy plating bath containing a soluble metal compound and a specific sulfur-containing compound. The plating bath of the present invention is an alloy plating bath containing tin and copper, the bath being capable of preventing deposition of copper on a tin anode by substitution, having low dependence of plated coating composition on current density, high bath stability and resistance to turbidness.
摘要翻译：本发明提供了含有可溶性金属化合物和特定含硫化合物的锡 - 铜合金电镀浴，锡 - 铜 - 铋合金电镀浴或锡 - 铜 - 银合金电镀浴。本发明的电镀液是含有锡和铜的合金电镀液，该浴能够防止铜在锡阳极上的沉积而被置换，镀层组合物对电流密度的依赖性低，浴的稳定性和耐浑浊

9. 发明授权

US06338787B1 Redox system electroless plating method 有权
标题翻译：氧化还原体系化学镀方法
公开(公告)号：US06338787B1
公开(公告)日：2002-01-15
申请号：US09543356
申请日：2000-04-05
申请人： Keigo Obata , Dong-Hyun Kim , Takao Takeuchi , Seiichiro Nakao , Shinji Inazawa , Ayao Kariya , Masatoshi Majima , Shigeyoshi Nakayama
发明人： Keigo Obata , Dong-Hyun Kim , Takao Takeuchi , Seiichiro Nakao , Shinji Inazawa , Ayao Kariya , Masatoshi Majima , Shigeyoshi Nakayama
IPC分类号： C25C100
CPC分类号： C23C18/1617 , C23C18/34 , Y10S428/935 , Y10T428/12681 , Y10T428/12701 , Y10T428/12708 , Y10T428/12792 , Y10T428/12819 , Y10T428/12826 , Y10T428/12847 , Y10T428/12861 , Y10T428/12875 , Y10T428/12889 , Y10T428/12896 , Y10T428/12903 , Y10T428/12944 , Y10T428/12951
摘要： To provide a plating method, which enables wide industrial use of the redox system electroless plating method having excellent characteristics, and a plating bath precursor which is preferable for the plating method. The plating method comprises a process oxidizing first metal ions of a redox system of a plating bath from a lower oxidation state to a high oxidation state, and second metal ions of said redox system are reduced and deposited onto the surface of an object to be plated, wherein a process is provided in which by supplying the electrical current to the plating bath, the first metal ions are reduced from said lower oxidation state to thereby activate the plating bath. The plating bath precursor is formed stabilizing the plating bath so that reduction and deposition of the second metal ions substantially do not occur in order to improve its storing performance.
摘要翻译：为了提供能够广泛地使用具有优异特性的氧化还原体系无电镀方法的镀覆方法，以及优选用于电镀方法的镀浴前体。电镀方法包括将电镀浴的氧化还原体系的第一金属离子氧化为较低氧化态的工艺，并且所述氧化还原体系的第二金属离子被还原并沉积到被镀物体的表面上其中提供了一种通过向电镀槽供应电流的方法，使第一金属离子从所述较低氧化态还原，从而激活镀浴。形成电镀槽前体稳定电镀液，从而基本上不会发生第二金属离子的还原和沉积，以改善其存储性能。

10. 发明授权

US4673470A Tin, lead, or tin-lead alloy plating bath 失效
标题翻译：锡，铅或锡铅合金电镀浴
公开(公告)号：US4673470A
公开(公告)日：1987-06-16
申请号：US831762
申请日：1986-02-21
申请人： Keigo Obata , Nobuyasu Dohi , Yoshiaki Okuhama , Seishi Masaki , Yukiyoshi Okada , Masakazu Yoshimoto
发明人： Keigo Obata , Nobuyasu Dohi , Yoshiaki Okuhama , Seishi Masaki , Yukiyoshi Okada , Masakazu Yoshimoto
IPC分类号： C25D3/32 , C25D3/36 , C25D3/60 , C25D3/56
CPC分类号： C25D3/60 , C25D3/32 , C25D3/36
摘要： A tin, lead, or tin-lead alloy plating bath comprising, as essential ingredients, an alkali metal salt, and a soluble divalent tin compound or/and a lead compound, all of an aliphatic or aromatic sulfocarboxylic acid of the general formula ##STR1## wherein R is a C.sub.1-4 hydrocarbon radical, M.sub.1 is a hydrogen atom or alkali metal atom, M.sub.2 is an alkali metal atom, and X.sub.1 and X.sub.2 are each a hydrogen atom, OH, COON, or SO.sub.3 N (where N represents a hydrogen atom or alkali metal atom).
摘要翻译：一种锡，铅或锡铅合金电镀浴，其包含作为必要成分的碱金属盐和可溶性二价锡化合物或/和铅化合物，所有的通式为“IMAGE”的脂族或芳族磺基羧酸 >其中R是C1-4烃基，M1是氢原子或碱金属原子，M2是碱金属原子，X1和X2各自是氢原子，OH，COON或SO3N（其中N表示氢原子或碱金属原子）。

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