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1. 发明专利

DE60218089T2 未知
公开(公告)号：DE60218089T2
公开(公告)日：2007-08-09
申请号：DE60218089
申请日：2002-02-27
申请人： HITACHI LTD , HITACHI CAR ENG CO LTD
发明人： SASADA YOSHIYUKI , ISONO TADASHI , OOUCHI SHIRO , NAKAZAWA TERUMI , OOBA MAMORU
IPC分类号： B60R11/02 , H01Q21/00 , G01S7/02 , G01S7/03 , G01S7/28 , H01Q1/22 , H01Q1/32 , H01Q1/36 , H01Q1/38 , H01Q9/04 , H01Q21/06 , H01Q23/00
摘要： A high frequency transmitter-receiver which can prevent an antenna pattern from being broken. A radar apparatus 1 is provided with a high frequency antenna 4, a base plate 5 and a module 3. The antenna 4 is comprised of an organic substrate 4A and a metal pattern 4B formed on the organic substrate 4A. The high frequency antenna 4 is adhered to the base plate 5 astride the module 3. Here, the gap between the base plate 5 and the module 3 where the antenna is adhered is configured to satisfy the expression (an amount of change in gap size with respect to a change in use temperature) DIVIDED (an original gap size)

2. 发明专利

DE60218089D1 未知
公开(公告)号：DE60218089D1
公开(公告)日：2007-03-29
申请号：DE60218089
申请日：2002-02-27
申请人： HITACHI LTD , HITACHI CAR ENG CO LTD
发明人： SASADA YOSHIYUKI , ISONO TADASHI , OOUCHI SHIRO , NAKAZAWA TERUMI , OOBA MAMORU
IPC分类号： B60R11/02 , H01Q21/00 , G01S7/02 , G01S7/03 , G01S7/28 , H01Q1/22 , H01Q1/32 , H01Q1/36 , H01Q1/38 , H01Q9/04 , H01Q21/06 , H01Q23/00
摘要： A high frequency transmitter-receiver which can prevent an antenna pattern from being broken. A radar apparatus 1 is provided with a high frequency antenna 4, a base plate 5 and a module 3. The antenna 4 is comprised of an organic substrate 4A and a metal pattern 4B formed on the organic substrate 4A. The high frequency antenna 4 is adhered to the base plate 5 astride the module 3. Here, the gap between the base plate 5 and the module 3 where the antenna is adhered is configured to satisfy the expression (an amount of change in gap size with respect to a change in use temperature) DIVIDED (an original gap size)

3. 发明专利

JP2005136756A Antenna device 有权
标题翻译：天线设备
公开(公告)号：JP2005136756A
公开(公告)日：2005-05-26
申请号：JP2003371418
申请日：2003-10-31
申请人： Hitachi Car Eng Co Ltd , Hitachi Ltd , 株式会社日立カーエンジニアリング , 株式会社日立製作所
发明人： ISONO TADASHI , MATSUURA KAZUO , SASADA YOSHIYUKI
IPC分类号： H01L23/12 , H01L23/50 , H01Q23/00 , H04B1/38
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an antenna device having a structure that can be mounted inexpensively. SOLUTION: On a dielectric substrate on which ceramic is laminated, there are provided a film-like antenna, a supply means for supplying power to the antenna, an oscillating element for generating power, and a plurality of solder bumps or lead frames made of metal near the periphery of the dielectric substrate in the antenna device composed of a high-frequency circuit for transmitting the drive of the oscillating element and a high-frequency signal. The antenna device has an electrical connecting means in advance and no retaining members are required, thus dispensing with incidental components for mounting, reducing mounting man-hours, and shortening time. Additionally, the mounting can be made by a technique for mounting electronic components, thus increasing mounting precision. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种具有可以廉价安装的结构的天线装置。解决方案：在其上层叠有陶瓷的电介质基板上，设置有膜状天线，用于向天线供电的供给装置，用于发电的振荡元件，以及多个焊料凸块或引线框架在由用于传输振荡元件的驱动的高频电路和高频信号构成的天线装置中，靠近电介质基板周边的金属构成。天线装置预先具有电连接装置，并且不需要保持构件，从而分配用于安装的附带组件，减少安装工时和缩短时间。此外，可以通过用于安装电子部件的技术来进行安装，从而提高安装精度。版权所有（C）2005，JPO＆NCIPI

4. 发明专利

JP2004138415A Radar apparatus 有权
公开(公告)号：JP2004138415A
公开(公告)日：2004-05-13
申请号：JP2002301218
申请日：2002-10-16
申请人： Hitachi Car Eng Co Ltd , Hitachi Ltd , 株式会社日立カーエンジニアリング , 株式会社日立製作所
发明人： SASADA YOSHIYUKI , KOSHIZAKA ATSUSHI , NAKAZAWA TERUMI , OUCHI SHIRO
IPC分类号： G01S7/03 , G01S13/93 , H01L23/552 , H01P1/211
CPC分类号： H01P1/211 , G01S7/032 , H01L23/552 , H01L24/48 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/85399 , H01L2924/00014 , H01L2924/14 , H01L2924/1423 , H01L2924/1616 , H01L2924/16195 , H01L2924/3011 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： PROBLEM TO BE SOLVED: To provide a filter cover having only a small degree of electromagnetic effect to a dielectric resonator and capable of elongating the life of a press die long without a loss of isolation between transmission and reception.
SOLUTION: The dielectric resonator, a high-frequency transmitter connected to the dielectric resonator, a base to which the dielectric resonator and the high-frequency transmitter are to be mounted, and a base are jointed together. A cover covers the dielectric resonator and the high-frequency transmitter. The distance between the surface of the cover in the direction of the presence of the dielectric resonator and the surface of the base in the direction of the presence of the dielectric resonator is the 1/2 effective wavelength of the frequency of the oscillator or shorter. The cover comprises periodic recesses and protrusions of the 1/4 effective wavelength of the frequency of the oscillator in the direction of the presence of the dielectric resonator to form a VCO (Voltage-Controlled Oscillator). In the VCO, the most proximate distance between at least the surface of the dielectric resonator in the direction of the presence of the cover and the surface of the cover in the direction of the presence of the dielectric resonator is the 1/4 effective wavelength of the frequency of the oscillator or longer.
COPYRIGHT: (C)2004,JPO

5. 发明专利

JP2001237633A MOUNTING STRUCTURE FOR PLANAR ANTENNA 失效
公开(公告)号：JP2001237633A
公开(公告)日：2001-08-31
申请号：JP2000052188
申请日：2000-02-23
申请人： HITACHI LTD , HITACHI CAR ENG CO LTD
发明人： SASADA YOSHIYUKI , ISONO TADASHI , MATSUURA KAZUO , OUCHI SHIRO , OBA MAMORU
IPC分类号： H01L23/12 , H01Q1/38 , H01Q13/08
摘要： PROBLEM TO BE SOLVED: To provide a high quality planar antenna having signal transmission characteristics of low noise level, the antenna characteristics of a less dispersion and a high reliability connecting part by taking measures against draw backs that a feeder pin receives a noise, antenna characteristics are dispersed by dispersing the wetting form of connecting materials and connecting part reliability in an environmental load is lowered by reducing the quantity of connecting materials. SOLUTION: First of all, the feed pin is located lower than a patch in the transmitting/receiving direction of signal, concerning a solder or the like to be used for materials for connecting the feed pin and the patch, the quantity of feeding and connecting materials is fixed as preform members, the wetting form of bonding materials is controlled by applying plating with high wetness of bonding materials to the bonding part of the feed pin with the bonding materials and a bonding surface area is enlarged by providing ruggedness on the connecting plane of the patch and the feeding pin.

6. 发明专利

JPH11316166A SEMICONDUCTOR PRESSURE SENSOR 失效
公开(公告)号：JPH11316166A
公开(公告)日：1999-11-16
申请号：JP12344298
申请日：1998-05-06
申请人： HITACHI LTD , HITACHI CAR ENG CO LTD
发明人： SASADA YOSHIYUKI , SUZUKI KIYOMITSU , MIYAZAKI ATSUSHI , KUBOTA MASANORI , YAMAGUCHI SHINICHI , MIKI MASAYUKI
IPC分类号： G01L9/04 , G01L9/00 , H01L29/84
摘要： PROBLEM TO BE SOLVED: To enhance corrosion resistance of a low melting temperature glass part contacting directly with a measured medium in a semiconductor pressure sensor to improve reliability for hermetic seal. SOLUTION: A pressure-sensitive element 100 for detecting pressure of a measured medium has a diaphragm 5 formed in a silicon substrate 1, and strain gages 6a, 6b for converting displacement of the diaphragm 5 into an electric signal. A pedestal 4 for supporting the pressure-sensitive element 100 is joined to a pedestal receiving part 12 inside a sensor housing via low melting temperature glass 16, and a portion exposed to the measured medium in the low melting temperature glass 16 is covered with a coating material (protective film) 21 having corrosion resistance against the measured medium.

7. 发明专利

JP2002076720A HIGH FREQUENCY COAXIAL LINE CONNECTION STRUCTURE 失效
公开(公告)号：JP2002076720A
公开(公告)日：2002-03-15
申请号：JP2000263739
申请日：2000-08-31
申请人： HITACHI LTD , HITACHI CAR ENG CO LTD
发明人： SASADA YOSHIYUKI , ISONO TADASHI , MATSUURA KAZUO , OUCHI SHIRO , OBA MAMORU
IPC分类号： H05K1/11 , H01P1/04 , H01P1/30 , H01P5/08 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a high frequency coaxial line connection structure which has a high degree of reliability against temperature fluctuation hysteresis by increasing the degree of deformation on a first circuit substrate 2 and a second circuit substrate 3 against expansion and contraction of a center conductor 4 accompanying the fluctua tion of the ambient temperature. SOLUTION: The high frequency coaxial line connection structure comprises a first organic material substrate 21 which has metalized areas on both surface and which forms the first high frequency circuit, of a second organic material substrate 31 which has metalized areas on both surfaces which forms the second high frequency circuit. And the organic material substrate 21 and the organic material substrate 31 are each bonded on one and the other side surface of a base substrate 1 which forms a through hole starting from the organic material substrate 21 through the substrate 1 reaching to the organic material substrate 31. The base conductor 4 is deployed coaxially within the through hole and conductively connected each ends to the first and second high frequency circuits. The through holes are comprised of a first through hole 8 which formed on the base substrate 1 and a second through hole 9 formed on the organic material substrate 21 and the organic material substrate 31, and the diameter d1 of the first through hole 8 is formed bigger than the diameter d2 of the second through hole 9.

8. 发明专利

JP2000214028A SEMICONDUCTOR PRESSURE SENSOR 失效
公开(公告)号：JP2000214028A
公开(公告)日：2000-08-04
申请号：JP1741899
申请日：1999-01-26
申请人： HITACHI LTD , HITACHI CAR ENG CO LTD
发明人： SASADA YOSHIYUKI , MIKI MASAYUKI , KUBOTA MASANORI , MIYAZAKI ATSUSHI , KANAI KIYOSHI , SUZUKI KIYOMITSU
IPC分类号： G01L9/04 , G01L9/00 , H01L29/84
摘要： PROBLEM TO BE SOLVED: To securely simplify the assembling process and to improve the reliability sufficiently even if a constituent member containing lead is not used. SOLUTION: The semiconductor pressure sensor is used while bonded with a stem 12 after a pressure sensor element part composed of a 1st silicon substrate 1 and a 2nd silicon substrate 2 is bonded with an insulating substrate 4. The sensor is provided with a base layer 11 for connection made of a material having one surface bonded well with the insulating substrate 4, and the other surface bonded well with a bonding material 17 made of a solder material containing no lead. The bonding material 17 is heated and molten to bond the insulating substrate 4 with the stem 12.

9. 发明专利

JP2000131170A METHOD OF MOUNTING PRESSURE SENSOR 失效
公开(公告)号：JP2000131170A
公开(公告)日：2000-05-12
申请号：JP30666298
申请日：1998-10-28
申请人： HITACHI LTD , HITACHI CAR ENG CO LTD
发明人： MIKI MASAYUKI , SASADA YOSHIYUKI , KUBOTA MASANORI , MIYAZAKI ATSUSHI
IPC分类号： G01L9/04 , G01L9/00 , H01L29/84
摘要： PROBLEM TO BE SOLVED: To improve the pressure resistance characteristic of a sensor, without being restricted by the parent material strength of glass by directly bonding or adhering a Si member having a diaphragm to a fixing base. SOLUTION: A single-crystal Si member 1 having a diaphragm 1a is formed by the anisotropic or dry etching, etc., of Si and is eutectic-bonded to a fixing base 4 made of Si or metal, etc., which is heat treated at about 400 deg.C, e.g. using an Au-Si alloy solder-made bonding member 5. At this time, about the Si member 1 and the fixing base 4, an Au or Au-Si metal film is metallized on the bonding face of Si or the front face at the bonding face and similarly the bonding face of the base 4 or the front face at the bonding face through plating, deposition, sputtering, etc. As a result, the bond strength is improved, and the pressure resistance characteristic restricted by the parent material of the glass base can be enhanced to improve the reliability.

10. 发明专利

JP2003309403A High frequency circuit board 审中-公开
标题翻译：高频电路板
公开(公告)号：JP2003309403A
公开(公告)日：2003-10-31
申请号：JP2002114095
申请日：2002-04-17
申请人： Hitachi Car Eng Co Ltd , Hitachi Ltd , 株式会社日立カーエンジニアリング , 株式会社日立製作所
发明人： SASADA YOSHIYUKI , ISONO TADASHI , MATSUURA KAZUO
IPC分类号： H01L23/12 , H01P3/02 , H01P3/08 , H01P11/00
摘要： PROBLEM TO BE SOLVED: To eliminate the occurrence of a burr in a high frequency circuit board, enhance the mountability and improve the print performance of an adhesive or the like onto the board, resulting in that a stable high frequency characteristic is obtained without causing a floated level of the GND. SOLUTION: The high frequency circuit board is designed so that no metal exists on the periphery of the high frequency circuit board on its side on which a ground of a microstrip line of the high frequency circuit board is formed. This invention eliminates the occurrence of a burr on the high frequency circuit board to enhance the mountability of the board, enhances the print performance of an adhesive or the like onto the board, resulting in obtaining a stably high frequency characteristic without causing the GND level to be floated and attaining less electromagnetic effect on a dielectric resonator, and provides a filter cover whereby the lifetime of the press dies can be extended without losing the isolation between transmission and reception. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题为了消除高频电路板中的毛刺的发生，提高了安装性，并且将粘合剂等的印刷性能提高到板上，从而获得稳定的高频特性而不会导致GND的浮置电平。解决方案：高频电路板设计成在高频电路板的外围形成金属，高频电路板的周边上形成有高频电路板的微带线的接地。本发明消除了在高频电路板上出现毛刺以增强板的安装性能，将粘合剂等的印刷性能提高到板上，从而获得稳定的高频特性而不会使GND电平浮动并且在介质谐振器上获得较少的电磁效应，并且提供了一个过滤器盖，从而可以延长压模的寿命，而不会损失传输和接收之间的隔离。版权所有（C）2004，JPO

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