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1. 发明专利

JP2004173318A High frequency transmitting/receiving apparatus 审中-公开
公开(公告)号：JP2004173318A
公开(公告)日：2004-06-17
申请号：JP2004038452
申请日：2004-02-16
申请人： Hitachi Car Eng Co Ltd , Hitachi Ltd , 株式会社日立カーエンジニアリング , 株式会社日立製作所
发明人： OUCHI SHIRO , NAKAZAWA TERUMI , YOKOYAMA MIZUHO , KOSHIZAKA ATSUSHI , ISONO TADASHI
IPC分类号： H01Q23/00 , G01S7/03 , H01Q1/22
摘要： PROBLEM TO BE SOLVED: To provide a high frequency transmitting/receiving apparatus capable of being made into a module rationally, thereby being made high in precision, small in size and simle in configuration. SOLUTION: The high frequency transmitting/receiving apparatus is made into a module by attaching an antenna substrate 3 and a front substrate 4 on which a front portion of a high frequency transmitting/receiving circuit is packaged on a portion of a base plate 1, and a recess 1a is formed on the base plate 1 to obtain a connection path from the outside to the front substrate 4 via a connection part 6 provided in the recess 1a. COPYRIGHT: (C)2004,JPO

2. 发明专利

JP2003051658A Electronic module and manufacturing method therefor 审中-公开
标题翻译：电子模块及其制造方法
公开(公告)号：JP2003051658A
公开(公告)日：2003-02-21
申请号：JP2001236548
申请日：2001-08-03
申请人： Hitachi Car Eng Co Ltd , Hitachi Ltd , 株式会社日立カーエンジニアリング , 株式会社日立製作所
发明人： OUCHI SHIRO , NAKAZAWA TERUMI , ISONO TADASHI , SASADA YOSHIYUKI
IPC分类号： H05K1/03 , H01L23/12 , H05K3/18 , H05K3/24
CPC分类号： H01L2224/45144 , H01L2224/49171 , H01L2924/19107 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To improve connecting reliability of a circuit substrate, having a low rigidity to a wire. SOLUTION: A method for manufacturing an electronic module comprises the steps of forming a wiring, having an electroless nickel plating film as an intermediate layer on a fluororesin substrate, and bonding a gold wire on the wiring. When a peel test for tensioning this gold wire at a constant speed in substantially the normal direction of the substrate is executed, as shown by a curve for connecting a mark '▵' or a mark '○', the thicker the electroless nickel plating film is, the larger the force for releasing the gold wire from the wiring will become. When the nickel plating film becomes 7 μm or more in thickness, the gold wire is broken without releasing from the wiring pattern. A working accuracy by etching is, as shown by a curve for connecting a mark '', the thinner the electroless nickel plating film is, the more the film will be improved. When the nickel plating film becomes 40 μm or less in thickness, the gold wire becomes ±20 μm or less. Then, the method further comprises a step of forming a wiring having the electroless nickel plating film having 7 μm to 40 μm as the intermediate layer on the fluororesin substrate.
摘要翻译：要解决的问题：为了提高电路基板的连接可靠性，对线材的刚性低。解决方案：一种用于制造电子模块的方法包括以下步骤：在氟树脂衬底上形成具有化学镀镍膜作为中间层的布线，并将金线接合在布线上。执行基本上沿基板的法线方向以恒定的速度拉伸该金线的剥离试验，如用于连接标记“▵”或标记“○”的曲线所示，化学镀镍膜越厚是，从配线释放金线的力越大。当镀镍膜的厚度为7μm以上时，金线断裂而不从配线图案脱离。通过蚀刻的加工精度，如用于连接标记“曲线”所示，化学镀镍膜越薄，则膜的改良越多。当镀镍膜的厚度为40μm以下时，金线变为±20μm以下。然后，该方法还包括在氟树脂基板上形成具有7μm至40μm的化学镀镍膜作为中间层的布线的步骤。

3. 发明专利

JP2004040550A Dielectric resonator type oscillator and transmitter/receiver 审中-公开
公开(公告)号：JP2004040550A
公开(公告)日：2004-02-05
申请号：JP2002195929
申请日：2002-07-04
申请人： Hitachi Car Eng Co Ltd , Hitachi Ltd , 株式会社日立カーエンジニアリング , 株式会社日立製作所
发明人： ISONO TADASHI
IPC分类号： H01P7/10 , H03B5/04 , H03B5/18
摘要： PROBLEM TO BE SOLVED: To provide an oscillator capable of generating a stable output even if a temperature change occurs and to provide a transmitter/receiver. SOLUTION: In a dielectric resonator type oscillator 10 provided with an oscillator IC 13 with an oscillation circuit formed on a semiconductor substrate and a dielectric substrate 14 provided with a coupled line with a dielectric resonator 16, a temperature sensing resistor 17 of a metal film is provided on the dielectric substrate by the same processing technique as that of the coupled line so as to control a circuit characteristic in accordance with its detection resistance value. COPYRIGHT: (C)2004,JPO

4. 发明专利

JP2006101562A Millimeter wave radar 审中-公开
标题翻译： MILLIMETER WAVE RADAR
公开(公告)号：JP2006101562A
公开(公告)日：2006-04-13
申请号：JP2006000014
申请日：2006-01-04
申请人： Hitachi Car Eng Co Ltd , Hitachi Ltd , 株式会社日立カーエンジニアリング , 株式会社日立製作所
发明人： SASADA YOSHIYUKI , ISONO TADASHI , MATSUURA KAZUO
IPC分类号： H01P3/08 , H01Q23/00
摘要： PROBLEM TO BE SOLVED: To solve a problem of generating burrs on a ground face in production processes of die cutting and cutting with a router or the like due to low Young's modulus of tetrafluoroethylene-impregnated glass fibers generally used for a dielectric substrate with low dielectric constant and low dielectric loss. SOLUTION: It is designed so that there exists no metal on an outer high-frequency circuit board at a ground-forming side for a micro-strip line of the high-frequency circuit board. The invention eliminates generation of burrs from the high-frequency circuit board, improves mountability of the board, improves printability of adhesive agents or the like to the board, can reduce electromagnetic effect to the dielectric resonator which can obtain stable high frequency characteristic without floating GND, and allows to produce a filter cover that extends press mold's life without damaging isolation between a transmitter and a receiver. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了解决由于通常用于电介质基板的四氟乙烯浸渍玻璃纤维的低杨氏模量，用路由器等进行模切和切割的生产过程中在地面上产生毛刺的问题具有低介电常数和低介电损耗。解决方案：设计成在高频电路板的微带线的地面形成侧的外部高频电路板上不存在金属。本发明消除了高频电路板产生毛刺，提高了板的安装性，提高了粘合剂等对板的印刷性，可以降低电介质谐振器的电磁效应，可以获得稳定的高频特性而无需浮置GND ，并允许生产一个过滤器盖，延长压模的使用寿命，而不会损坏发射器和接收器之间的隔离。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2004140672A Dielectric resonator oscillator, transmitter-receiver using this oscillator, and resonator used for this oscillator 审中-公开
标题翻译：介质谐振器振荡器，使用该振荡器的发射器接收器和用于该振荡器的谐振器
公开(公告)号：JP2004140672A
公开(公告)日：2004-05-13
申请号：JP2002304543
申请日：2002-10-18
申请人： Hitachi Car Eng Co Ltd , Hitachi Ltd , 株式会社日立カーエンジニアリング , 株式会社日立製作所
发明人： ISONO TADASHI , MIYATA MASARU
IPC分类号： H01P7/10 , H03B5/18
摘要： PROBLEM TO BE SOLVED: To provide a dielectric resonator oscillator having high Q by enhancing a degree of contact between a coupling line and a dielectric resonator; and to provide a transmitter-receiver using the oscillator, and the resonator used for the oscillator.
SOLUTION: The dielectric resonator oscillator comprises an oscillation element 2 forming an oscillation circuit on a semiconductor substrate; the dielectric resonator 7; and a dielectric substrate 8 having the coupling line 8 to the dielectric resonator 7. A dielectric film 9 holding the dielectric resonator 7 is formed at the vicinity of the coupling line 8 on the dielectric substrate 6. The dielectric resonator 7 is fixed by an adhesive 10 by extending over the coupling line 8 and the dielectric film 9.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：通过增加耦合线和介质谐振器之间的接触程度来提供具有高Q值的介质谐振器; 并提供使用振荡器的发射机 - 接收机，以及用于振荡器的谐振器。解决方案：介质谐振器包括在半导体衬底上形成振荡电路的振荡元件2; 介质谐振器7; 以及具有到介电谐振器7的耦合线8的电介质基板8.在电介质基板6上的耦合线8附近形成保持介质谐振器7的电介质膜9.介质谐振器7由粘合剂通过在耦合线8和电介质膜9上延伸

6. 发明专利

JP2003309403A High frequency circuit board 审中-公开
标题翻译：高频电路板
公开(公告)号：JP2003309403A
公开(公告)日：2003-10-31
申请号：JP2002114095
申请日：2002-04-17
申请人： Hitachi Car Eng Co Ltd , Hitachi Ltd , 株式会社日立カーエンジニアリング , 株式会社日立製作所
发明人： SASADA YOSHIYUKI , ISONO TADASHI , MATSUURA KAZUO
IPC分类号： H01L23/12 , H01P3/02 , H01P3/08 , H01P11/00
摘要： PROBLEM TO BE SOLVED: To eliminate the occurrence of a burr in a high frequency circuit board, enhance the mountability and improve the print performance of an adhesive or the like onto the board, resulting in that a stable high frequency characteristic is obtained without causing a floated level of the GND. SOLUTION: The high frequency circuit board is designed so that no metal exists on the periphery of the high frequency circuit board on its side on which a ground of a microstrip line of the high frequency circuit board is formed. This invention eliminates the occurrence of a burr on the high frequency circuit board to enhance the mountability of the board, enhances the print performance of an adhesive or the like onto the board, resulting in obtaining a stably high frequency characteristic without causing the GND level to be floated and attaining less electromagnetic effect on a dielectric resonator, and provides a filter cover whereby the lifetime of the press dies can be extended without losing the isolation between transmission and reception. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题为了消除高频电路板中的毛刺的发生，提高了安装性，并且将粘合剂等的印刷性能提高到板上，从而获得稳定的高频特性而不会导致GND的浮置电平。解决方案：高频电路板设计成在高频电路板的外围形成金属，高频电路板的周边上形成有高频电路板的微带线的接地。本发明消除了在高频电路板上出现毛刺以增强板的安装性能，将粘合剂等的印刷性能提高到板上，从而获得稳定的高频特性而不会使GND电平浮动并且在介质谐振器上获得较少的电磁效应，并且提供了一个过滤器盖，从而可以延长压模的寿命，而不会损失传输和接收之间的隔离。版权所有（C）2004，JPO

7. 发明专利

JP2003060428A High-frequency circuit device and production method therefor 审中-公开
标题翻译：高频电路装置及其生产方法
公开(公告)号：JP2003060428A
公开(公告)日：2003-02-28
申请号：JP2001250108
申请日：2001-08-21
申请人： Hitachi Car Eng Co Ltd , Hitachi Ltd , 株式会社日立カーエンジニアリング , 株式会社日立製作所
发明人： ISONO TADASHI , NAKAZAWA TERUMI , OUCHI SHIRO , SASADA YOSHIYUKI , OBA MAMORU
IPC分类号： H05K1/09 , C25D5/12 , C25D5/56 , C25D7/00 , H01P11/00 , H01Q1/38 , H01Q13/08 , H01Q21/06 , H05K1/16 , H05K3/00 , H05K3/24
CPC分类号： H05K3/244 , H01Q1/38 , H01Q21/065 , H05K1/16 , H05K3/0058 , H05K3/242 , Y10T428/12569
摘要： PROBLEM TO BE SOLVED: To provide a high-frequency circuit device which enhances reliability in electrical conduction, even if repeated bending stress occurs, in the high-frequency circuit device which uses a plane antenna. SOLUTION: A Cu film layer 6 is formed on an organic substrate 5, and Ni plating 7 and Au plating 8 are conducted, to form a film structure of a wiring pattern 10. Here, the Ni plating 7 is formed by electrolytic plating. The lowest value for an extension percentage of electrolytic Ni-plated products is 4.9%, and cracks and disconnections of the wiring pattern 10 after thermal shock test disappear and reliability is enhanced with respected to repeated bending stress.
摘要翻译：要解决的问题：即使在使用平面天线的高频电路装置中，即使发生重复的弯曲应力，也可以提供提高导电性的可靠性的高频电路装置。解决方案：在有机基板5上形成Cu膜层6，并且进行Ni镀层7和Au镀层8以形成布线图案10的膜结构。这里，通过电解电镀形成Ni镀层7。电解镀镍产品的延伸百分比的最低值为4.9％，热冲击试验后的布线图案10的裂纹和断开消失，并且相对于反复的弯曲应力而提高可靠性。

8. 发明专利

JP2003037420A High-frequency transmitter/receiver 有权
标题翻译：高频发射器/接收器
公开(公告)号：JP2003037420A
公开(公告)日：2003-02-07
申请号：JP2001220940
申请日：2001-07-23
申请人： Hitachi Car Eng Co Ltd , Hitachi Ltd , 株式会社日立カーエンジニアリング , 株式会社日立製作所
发明人： SASADA YOSHIYUKI , ISONO TADASHI , OUCHI SHIRO , NAKAZAWA TERUMI , OBA MAMORU
IPC分类号： B60R11/02 , G01S7/02 , G01S7/03 , G01S7/28 , H01Q1/22 , H01Q1/32 , H01Q1/36 , H01Q1/38 , H01Q9/04 , H01Q21/06 , H01Q23/00
CPC分类号： H01Q9/0407 , G01S7/03 , H01Q1/3233 , H01Q21/065 , H01Q23/00
摘要： PROBLEM TO BE SOLVED: To provide a high-frequency transmitter/receiver that can prevent burnout of antenna pattern.
SOLUTION: A radar apparatus 1 is equipped with a high-frequency antenna 4, a base plate 5, and a module 3. The antenna 4 comprises an organic substrate 4A, and a metal pattern 4B formed on the organic substrate 4A. The high-frequency antenna 4 is bonded and is fixed over the base plate 5 and module 3. In this case, in the clearance at a position to which the antenna between the base plate 5 and module 3 is bonded is such that the relation (the amount of change in the clearance dimension to the change in service temperature)/(original clearance dimension)≤6% is satisfied.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供可以防止天线图案烧坏的高频发射机/接收机。解决方案：雷达装置1配备有高频天线4，基板5和模块3.天线4包括有机基板4A和形成在有机基板4A上的金属图案4B。高频天线4被接合并固定在基板5和模块3上。在这种情况下，在基板5和模块3之间的天线接合的位置的间隙中，使得（间隙尺寸与使用温度变化的关系）/（原始间隙尺寸）<= 6％。

9. 发明专利

JP2005136756A Antenna device 有权
标题翻译：天线设备
公开(公告)号：JP2005136756A
公开(公告)日：2005-05-26
申请号：JP2003371418
申请日：2003-10-31
申请人： Hitachi Car Eng Co Ltd , Hitachi Ltd , 株式会社日立カーエンジニアリング , 株式会社日立製作所
发明人： ISONO TADASHI , MATSUURA KAZUO , SASADA YOSHIYUKI
IPC分类号： H01L23/12 , H01L23/50 , H01Q23/00 , H04B1/38
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an antenna device having a structure that can be mounted inexpensively. SOLUTION: On a dielectric substrate on which ceramic is laminated, there are provided a film-like antenna, a supply means for supplying power to the antenna, an oscillating element for generating power, and a plurality of solder bumps or lead frames made of metal near the periphery of the dielectric substrate in the antenna device composed of a high-frequency circuit for transmitting the drive of the oscillating element and a high-frequency signal. The antenna device has an electrical connecting means in advance and no retaining members are required, thus dispensing with incidental components for mounting, reducing mounting man-hours, and shortening time. Additionally, the mounting can be made by a technique for mounting electronic components, thus increasing mounting precision. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种具有可以廉价安装的结构的天线装置。解决方案：在其上层叠有陶瓷的电介质基板上，设置有膜状天线，用于向天线供电的供给装置，用于发电的振荡元件，以及多个焊料凸块或引线框架在由用于传输振荡元件的驱动的高频电路和高频信号构成的天线装置中，靠近电介质基板周边的金属构成。天线装置预先具有电连接装置，并且不需要保持构件，从而分配用于安装的附带组件，减少安装工时和缩短时间。此外，可以通过用于安装电子部件的技术来进行安装，从而提高安装精度。版权所有（C）2005，JPO＆NCIPI

10. 发明专利

JP2004039764A Manufacturing method of high-frequency transmitting/receiving device 审中-公开
公开(公告)号：JP2004039764A
公开(公告)日：2004-02-05
申请号：JP2002192820
申请日：2002-07-02
申请人： Hitachi Car Eng Co Ltd , Hitachi Ltd , 株式会社日立カーエンジニアリング , 株式会社日立製作所
发明人： OUCHI SHIRO , NAKAZAWA TERUMI , ISONO TADASHI
IPC分类号： H05K9/00 , H01Q23/00
摘要： PROBLEM TO BE SOLVED: To provide high-frequency communication equipment which reduces the interference of electromagnetic waves inside and outside a cabinet or unreasonable electromagnetic coupling between circuit elements in the cabinet, or between the circuit elements in the cabinet and the electromagnetic wave outside the cabinet without precluding mass production and the cost down of the equipment.
SOLUTION: In the communication equipment having a cabinet mounting the high-frequency circuit elements inside, a periodic structural body on which projections are cyclically formed is provided at least on one part of a wall constituting the cabinet by bonding, clamping or the like while the organic or inorganic material of the periodic structural body is coated with a metal by plating or depositing.
COPYRIGHT: (C)2004,JPO

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