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1. 发明专利

JP2006101562A Millimeter wave radar 审中-公开
标题翻译： MILLIMETER WAVE RADAR
公开(公告)号：JP2006101562A
公开(公告)日：2006-04-13
申请号：JP2006000014
申请日：2006-01-04
申请人： Hitachi Car Eng Co Ltd , Hitachi Ltd , 株式会社日立カーエンジニアリング , 株式会社日立製作所
发明人： SASADA YOSHIYUKI , ISONO TADASHI , MATSUURA KAZUO
IPC分类号： H01P3/08 , H01Q23/00
摘要： PROBLEM TO BE SOLVED: To solve a problem of generating burrs on a ground face in production processes of die cutting and cutting with a router or the like due to low Young's modulus of tetrafluoroethylene-impregnated glass fibers generally used for a dielectric substrate with low dielectric constant and low dielectric loss. SOLUTION: It is designed so that there exists no metal on an outer high-frequency circuit board at a ground-forming side for a micro-strip line of the high-frequency circuit board. The invention eliminates generation of burrs from the high-frequency circuit board, improves mountability of the board, improves printability of adhesive agents or the like to the board, can reduce electromagnetic effect to the dielectric resonator which can obtain stable high frequency characteristic without floating GND, and allows to produce a filter cover that extends press mold's life without damaging isolation between a transmitter and a receiver. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了解决由于通常用于电介质基板的四氟乙烯浸渍玻璃纤维的低杨氏模量，用路由器等进行模切和切割的生产过程中在地面上产生毛刺的问题具有低介电常数和低介电损耗。解决方案：设计成在高频电路板的微带线的地面形成侧的外部高频电路板上不存在金属。本发明消除了高频电路板产生毛刺，提高了板的安装性，提高了粘合剂等对板的印刷性，可以降低电介质谐振器的电磁效应，可以获得稳定的高频特性而无需浮置GND ，并允许生产一个过滤器盖，延长压模的使用寿命，而不会损坏发射器和接收器之间的隔离。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2004140632A High-frequency transmitting and receiving device and its manufacturing method 审中-公开
公开(公告)号：JP2004140632A
公开(公告)日：2004-05-13
申请号：JP2002303897
申请日：2002-10-18
申请人： Hitachi Car Eng Co Ltd , Hitachi Ltd , 株式会社日立カーエンジニアリング , 株式会社日立製作所
发明人： KOSHIZAKA ATSUSHI , KAWAHARA KEIJI , MATSUURA KAZUO
IPC分类号： H01Q1/32 , H01Q21/00 , H01Q21/06 , H01Q23/00
CPC分类号： H01Q1/3233 , H01Q21/0087 , H01Q21/065 , H01Q23/00
摘要： PROBLEM TO BE SOLVED: To provide a high-frequency transmitting and receiving device which is exellent in vehicle following distance detecting performance.
SOLUTION: The high-frequency transmitting and receiving device 100 which is constituted by sticking an antenna substrate 2 having an antenna pattern conductor 7 formed and made of a dielectric on one surface of a base plate 1 is characterized in that the flatness precision of the surface of the antenna substrate 2 is ≤λα/20, where λ is an effective wavelength.
COPYRIGHT: (C)2004,JPO

3. 发明专利

JP2003309403A High frequency circuit board 审中-公开
标题翻译：高频电路板
公开(公告)号：JP2003309403A
公开(公告)日：2003-10-31
申请号：JP2002114095
申请日：2002-04-17
申请人： Hitachi Car Eng Co Ltd , Hitachi Ltd , 株式会社日立カーエンジニアリング , 株式会社日立製作所
发明人： SASADA YOSHIYUKI , ISONO TADASHI , MATSUURA KAZUO
IPC分类号： H01L23/12 , H01P3/02 , H01P3/08 , H01P11/00
摘要： PROBLEM TO BE SOLVED: To eliminate the occurrence of a burr in a high frequency circuit board, enhance the mountability and improve the print performance of an adhesive or the like onto the board, resulting in that a stable high frequency characteristic is obtained without causing a floated level of the GND. SOLUTION: The high frequency circuit board is designed so that no metal exists on the periphery of the high frequency circuit board on its side on which a ground of a microstrip line of the high frequency circuit board is formed. This invention eliminates the occurrence of a burr on the high frequency circuit board to enhance the mountability of the board, enhances the print performance of an adhesive or the like onto the board, resulting in obtaining a stably high frequency characteristic without causing the GND level to be floated and attaining less electromagnetic effect on a dielectric resonator, and provides a filter cover whereby the lifetime of the press dies can be extended without losing the isolation between transmission and reception. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题为了消除高频电路板中的毛刺的发生，提高了安装性，并且将粘合剂等的印刷性能提高到板上，从而获得稳定的高频特性而不会导致GND的浮置电平。解决方案：高频电路板设计成在高频电路板的外围形成金属，高频电路板的周边上形成有高频电路板的微带线的接地。本发明消除了在高频电路板上出现毛刺以增强板的安装性能，将粘合剂等的印刷性能提高到板上，从而获得稳定的高频特性而不会使GND电平浮动并且在介质谐振器上获得较少的电磁效应，并且提供了一个过滤器盖，从而可以延长压模的寿命，而不会损失传输和接收之间的隔离。版权所有（C）2004，JPO

4. 发明专利

JP2005136756A Antenna device 有权
标题翻译：天线设备
公开(公告)号：JP2005136756A
公开(公告)日：2005-05-26
申请号：JP2003371418
申请日：2003-10-31
申请人： Hitachi Car Eng Co Ltd , Hitachi Ltd , 株式会社日立カーエンジニアリング , 株式会社日立製作所
发明人： ISONO TADASHI , MATSUURA KAZUO , SASADA YOSHIYUKI
IPC分类号： H01L23/12 , H01L23/50 , H01Q23/00 , H04B1/38
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an antenna device having a structure that can be mounted inexpensively. SOLUTION: On a dielectric substrate on which ceramic is laminated, there are provided a film-like antenna, a supply means for supplying power to the antenna, an oscillating element for generating power, and a plurality of solder bumps or lead frames made of metal near the periphery of the dielectric substrate in the antenna device composed of a high-frequency circuit for transmitting the drive of the oscillating element and a high-frequency signal. The antenna device has an electrical connecting means in advance and no retaining members are required, thus dispensing with incidental components for mounting, reducing mounting man-hours, and shortening time. Additionally, the mounting can be made by a technique for mounting electronic components, thus increasing mounting precision. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种具有可以廉价安装的结构的天线装置。解决方案：在其上层叠有陶瓷的电介质基板上，设置有膜状天线，用于向天线供电的供给装置，用于发电的振荡元件，以及多个焊料凸块或引线框架在由用于传输振荡元件的驱动的高频电路和高频信号构成的天线装置中，靠近电介质基板周边的金属构成。天线装置预先具有电连接装置，并且不需要保持构件，从而分配用于安装的附带组件，减少安装工时和缩短时间。此外，可以通过用于安装电子部件的技术来进行安装，从而提高安装精度。版权所有（C）2005，JPO＆NCIPI

5. 发明专利

JP2008167182A High-frequency semiconductor device and its implement method 有权
标题翻译：高频半导体器件及其实现方法
公开(公告)号：JP2008167182A
公开(公告)日：2008-07-17
申请号：JP2006354689
申请日：2006-12-28
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： SASADA YOSHIYUKI , MATSUURA KAZUO , ISONO TADASHI , OUCHI SHIRO , YAMAMOTO KIYOSHI
IPC分类号： H01P1/211
摘要： PROBLEM TO BE SOLVED: To provide a high-frequency semiconductor device suitable for a vehicle radar, the high frequency filter of which is manufactured at low cost and provided with high robustness for filter performance to an external environment, such as temperature fluctuations. SOLUTION: A filter cover 30 that is inside provided with a metal-plated resin periodic structure (32) which cuts off (transmission controls) an operation frequency covers a circuit board 20 mounted with a high-frequency circuit 10. In a radar housing 60 provided with antennas 21 and 22, (1) a reinforced part 33 that has a heat expansion coefficient which is almost the same as that of the circuit board 20 is provided on the cover 30 provided with the periodic structure 32 opposing to the high-frequency circuit 10, or (2) between adjacent cavities 81 and 82 which have a transmission controller (32 or the like), a communication hole that has a height H and a width W(≤λ/4) to cut off an operation frequency is provided. Therefore, filter fluctuations are prevented, and a high-frequency semiconductor device that has high robustness to environmental changes can be acquired. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供适用于车辆雷达的高频半导体装置，其高频滤波器以低成本制造，并且具有高的鲁棒性，以适用于外部环境的过滤性能，例如温度波动。解决方案：内部设置有切断（变速器控制）操作频率的金属镀树脂周期结构（32）的过滤器盖30覆盖安装有高频电路10的电路板20.在具有天线21和22的雷达壳体60，（1）具有与电路板20的热膨胀系数几乎相同的热膨胀系数的加强部33设置在设置有周期性结构32的盖30上具有变速器控制器（32等）的相邻空腔81和82之间的高频电路10或（2），具有高度H和宽度W（≤λ/ 4）的连通孔，以切断提供操作频率。因此，防止了滤波器波动，并且可以获得对环境变化具有高鲁棒性的高频半导体器件。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2008060289A Semiconductor package 审中-公开
标题翻译：半导体封装
公开(公告)号：JP2008060289A
公开(公告)日：2008-03-13
申请号：JP2006234838
申请日：2006-08-31
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： MATSUURA KAZUO
IPC分类号： H01L23/04 , H01L25/04 , H01L25/18
CPC分类号： H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2924/1423 , H01L2924/3011 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a sealing package for surely positioning a ceramic board and a sealing member and improving a productivity and stabilizing a performance in the semiconductor package using the ceramic board.
SOLUTION: In the semiconductor package, the sealing member such as a cap 3, a wall 2a or the like is fitted on the board 1a loading an IC chip through a joining member, and the inside is sealed hermetically in a hollow. In the semiconductor package, an indentation is formed for aligning the sealing member at a site fitting the sealing member on the board 1a.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于可靠地定位陶瓷板和密封构件的密封包装，并且提高使用陶瓷板的半导体封装中的生产率和稳定性能。解决方案：在半导体封装中，诸如盖3，壁2a等的密封构件通过接合构件装配在装载IC芯片的板1a上，并且内部被密封地密封在中空中。在半导体封装中，形成有用于使密封构件对准在板1a上的密封构件的位置处的凹陷。版权所有（C）2008，JPO＆INPIT

7. 发明专利

JP2007116217A Millimeter-wave radar apparatus and millimeter radar system using it 审中-公开
标题翻译：使用它的MILLIMETER-WAVE RADAR装置和MILLIMETER RADAR系统
公开(公告)号：JP2007116217A
公开(公告)日：2007-05-10
申请号：JP2005302432
申请日：2005-10-18
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： NAGAISHI HIDEYUKI , SHINODA HIROSHI , MATSUURA KAZUO
IPC分类号： H01Q1/42 , H01L23/36
CPC分类号： H01Q1/42 , G01S7/032 , G01S13/931 , G01S2013/9353 , G01S2013/9375 , H01L23/552 , H01L23/66 , H01L24/48 , H01L25/165 , H01L2223/6677 , H01L2224/32188 , H01L2224/45014 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2924/00014 , H01L2924/14 , H01L2924/1423 , H01L2924/15153 , H01L2924/1517 , H01L2924/15192 , H01L2924/16152 , H01L2924/1616 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H01Q1/38 , H01Q17/001 , H01Q23/00 , H05K1/0206 , H05K1/0237 , H05K1/0298 , H05K1/056 , H05K1/141 , H05K1/144 , H05K3/0061 , H05K2201/10371 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： PROBLEM TO BE SOLVED: To provide a millimeter-wave radar apparatus which has a good heat radiation characteristic.
SOLUTION: The millimeter-wave radar apparatus includes a multilayer substrate 1, an RF circuit 2, an antenna 3, a thermal via hole 5, a heat transmitting plate 4, and a casing 6. The RF circuit 2 and the antenna 3 are provided on the front and rear surfaces of the multilayer substrate 1 respectively. The thermal via hole 5 is provided within the multilayer substrate 1. The heat transmitting plate 4 is formed therein with an opening so as to avoid deterioration of the wave radiation characteristic of the antenna 3. The plane of the antenna is contacted with the heat transmitting plate 4. Heat generated in an MMIC as an active circuit of the RF circuit 2 is transmitted through the thermal via hole 5 and laminated metallic layers, and is diffused onto the surface of the multilayer substrate 1. Heat reaching the antenna surface of the rear multilayer substrate 1 is radiated from the heat transmitting plate 4.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供具有良好散热特性的毫米波雷达装置。解决方案：毫米波雷达装置包括多层基板1，RF电路2，天线3，热通孔5，传热板4和壳体6. RF电路2和天线 3分别设置在多层基板1的前表面和后表面上。热通孔5设置在多层基板1内。传热板4形成有开口，以避免天线3的波浪辐射特性的恶化。天线的平面与传热在作为RF电路2的有源电路的MMIC中产生的热量通过热通孔5和层叠的金属层传输，并且扩散到多层基板1的表面上。到达后面的天线表面的热量多层基板1从传热板4辐射。版权所有（C）2007，JPO＆INPIT

8. 发明专利

JP2006135595A Antenna system 有权
标题翻译：天线系统
公开(公告)号：JP2006135595A
公开(公告)日：2006-05-25
申请号：JP2004321690
申请日：2004-11-05
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： ISONO TADASHI , MATSUURA KAZUO
IPC分类号： H01Q13/08 , H01P11/00
CPC分类号： H01Q1/42 , G01S7/03 , G01S13/931 , G01S2007/028 , H01L2924/15192 , H01L2924/19107 , H01Q1/3233 , H01Q21/0093 , H01Q21/065 , H01Q23/00
摘要： PROBLEM TO BE SOLVED: To provide a high-frequency antenna system which holds sufficient mechanical strength tolerant even when formed on a ceramic substrate and mounted in a severe environment, for example, on an automobile and nonetheless has high productivity and inexpensive package structure. SOLUTION: The high-frequency antenna system includes: a high-frequency antenna substrate 1 in which a filmy antenna 4 is formed on one surface of a dielectric substrate 20 formed by laminating ceramic and a high-frequency circuit for generating a high-frequency signal is formed on the other surface of the dielectric substrate 20; a metallic base 2 which has a through window portion formed in a rectangular shape on a plate surface; and a cover 8 which packages the high-frequency circuit surface of the high-frequency antenna substrate 1 when the high-frequency antenna substrate 1 is joined to and fitted in the window portion of the metallic base 2, wherein the outer periphery of the high-frequency antenna substrate 1 and the metallic base 2 are airtightly sealed and joined by glass or metal brazing. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供即使形成在陶瓷基板上并且安装在恶劣环境中（例如在汽车上）时也具有足够的机械强度容限的高频天线系统，并且具有高生产率和廉价的封装结构体。解决方案：高频天线系统包括：高频天线基板1，其中薄膜天线4形成在通过层压陶瓷形成的电介质基板20的一个表面和用于产生高电平的高频电路在电介质基板20的另一个表面上形成频率信号; 金属基体2，其具有在板表面上形成为矩形形状的通孔部; 以及盖8，其在高频天线基板1接合并安装在金属基座2的窗口部分时封装高频天线基板1的高频电路面，其中高频天线基板1的外周频率天线基板1和金属基座2被气密密封并通过玻璃或金属钎焊接合。版权所有（C）2006，JPO＆NCIPI

9. 发明专利

JP2009060159A High frequency module 有权
标题翻译：高频模块
公开(公告)号：JP2009060159A
公开(公告)日：2009-03-19
申请号：JP2007223029
申请日：2007-08-29
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： SHIMADA KOJI , ISONO TADASHI , MATSUURA KAZUO
IPC分类号： H01P3/12 , H01L23/12
摘要： PROBLEM TO BE SOLVED: To provide a high frequency module having a rational structure, which reduces a manufacturing cost and endure thermal stress and mechanical stress in a severe environment, when mounted on a vehicle, thereby improving reliability and the like.
SOLUTION: The high frequency module includes: a high frequency circuit board 11 having a high frequency circuit for generation of a high frequency signal, transmission/reception processing, etc. provided on a front surface thereof and having transmission/reception terminals 11a and 11b for transmitting/receiving the high frequency signal provided on a rear surface thereof; a metal base 12 which has one surface joined to the rear surface side of the high frequency circuit board 11 and is composed of a plurality of laminated thin metal plates 12a; and a high frequency antenna 13 being a member disposed opposite to the other surface of the metal base. A waveguide 10 for transmitting/receiving the high frequency signal between the antenna 13 and the high frequency circuit board 11 is formed in the metal base 12.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有合理结构的高频模块，其在安装在车辆上时降低制造成本并且在恶劣的环境中承受热应力和机械应力，从而提高可靠性等。解决方案：高频模块包括：高频电路板11，其具有用于产生高频信号的高频电路，发送/接收处理等，并且具有发送/接收终端11a 和11b，用于发送/接收设置在其后表面上的高频信号; 金属基体12，其具有与高频电路板11的后表面接合的一个表面，并且由多个层压薄金属板12a组成; 高频天线13是与金属基底的另一个表面相对设置的部件。用于在天线13和高频电路板11之间发送/接收高频信号的波导10形成在金属底座12中。（C）2009，JPO＆INPIT

10. 发明专利

JP2004101451A On-vehicle radar apparatus 审中-公开
公开(公告)号：JP2004101451A
公开(公告)日：2004-04-02
申请号：JP2002266203
申请日：2002-09-12
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： MATSUURA KAZUO
IPC分类号： G01S13/34 , G01S7/35
摘要： PROBLEM TO BE SOLVED: To provide an on-vehicle radar apparatus for restraining a measurement error of a distance or the like even if the sensitivity to oscillation frequency or frequency modulated voltage of a transmission wave changes with a temperature or passage of time.
SOLUTION: This on-vehicle radar apparatus is provided with an oscillator for comparison with a transmission frequency and a means for mixing a signal of the oscillator with the transmission signal to obtain an intermediate frequency (IF) signal, and the comparison result is used to correct the modulation sensitivity.
COPYRIGHT: (C)2004,JPO

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