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1. 发明专利

JP2003060428A High-frequency circuit device and production method therefor 审中-公开
标题翻译：高频电路装置及其生产方法
公开(公告)号：JP2003060428A
公开(公告)日：2003-02-28
申请号：JP2001250108
申请日：2001-08-21
申请人： Hitachi Car Eng Co Ltd , Hitachi Ltd , 株式会社日立カーエンジニアリング , 株式会社日立製作所
发明人： ISONO TADASHI , NAKAZAWA TERUMI , OUCHI SHIRO , SASADA YOSHIYUKI , OBA MAMORU
IPC分类号： H05K1/09 , C25D5/12 , C25D5/56 , C25D7/00 , H01P11/00 , H01Q1/38 , H01Q13/08 , H01Q21/06 , H05K1/16 , H05K3/00 , H05K3/24
CPC分类号： H05K3/244 , H01Q1/38 , H01Q21/065 , H05K1/16 , H05K3/0058 , H05K3/242 , Y10T428/12569
摘要： PROBLEM TO BE SOLVED: To provide a high-frequency circuit device which enhances reliability in electrical conduction, even if repeated bending stress occurs, in the high-frequency circuit device which uses a plane antenna. SOLUTION: A Cu film layer 6 is formed on an organic substrate 5, and Ni plating 7 and Au plating 8 are conducted, to form a film structure of a wiring pattern 10. Here, the Ni plating 7 is formed by electrolytic plating. The lowest value for an extension percentage of electrolytic Ni-plated products is 4.9%, and cracks and disconnections of the wiring pattern 10 after thermal shock test disappear and reliability is enhanced with respected to repeated bending stress.
摘要翻译：要解决的问题：即使在使用平面天线的高频电路装置中，即使发生重复的弯曲应力，也可以提供提高导电性的可靠性的高频电路装置。解决方案：在有机基板5上形成Cu膜层6，并且进行Ni镀层7和Au镀层8以形成布线图案10的膜结构。这里，通过电解电镀形成Ni镀层7。电解镀镍产品的延伸百分比的最低值为4.9％，热冲击试验后的布线图案10的裂纹和断开消失，并且相对于反复的弯曲应力而提高可靠性。

2. 发明专利

JP2003037420A High-frequency transmitter/receiver 有权
标题翻译：高频发射器/接收器
公开(公告)号：JP2003037420A
公开(公告)日：2003-02-07
申请号：JP2001220940
申请日：2001-07-23
申请人： Hitachi Car Eng Co Ltd , Hitachi Ltd , 株式会社日立カーエンジニアリング , 株式会社日立製作所
发明人： SASADA YOSHIYUKI , ISONO TADASHI , OUCHI SHIRO , NAKAZAWA TERUMI , OBA MAMORU
IPC分类号： B60R11/02 , G01S7/02 , G01S7/03 , G01S7/28 , H01Q1/22 , H01Q1/32 , H01Q1/36 , H01Q1/38 , H01Q9/04 , H01Q21/06 , H01Q23/00
CPC分类号： H01Q9/0407 , G01S7/03 , H01Q1/3233 , H01Q21/065 , H01Q23/00
摘要： PROBLEM TO BE SOLVED: To provide a high-frequency transmitter/receiver that can prevent burnout of antenna pattern.
SOLUTION: A radar apparatus 1 is equipped with a high-frequency antenna 4, a base plate 5, and a module 3. The antenna 4 comprises an organic substrate 4A, and a metal pattern 4B formed on the organic substrate 4A. The high-frequency antenna 4 is bonded and is fixed over the base plate 5 and module 3. In this case, in the clearance at a position to which the antenna between the base plate 5 and module 3 is bonded is such that the relation (the amount of change in the clearance dimension to the change in service temperature)/(original clearance dimension)≤6% is satisfied.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供可以防止天线图案烧坏的高频发射机/接收机。解决方案：雷达装置1配备有高频天线4，基板5和模块3.天线4包括有机基板4A和形成在有机基板4A上的金属图案4B。高频天线4被接合并固定在基板5和模块3上。在这种情况下，在基板5和模块3之间的天线接合的位置的间隙中，使得（间隙尺寸与使用温度变化的关系）/（原始间隙尺寸）<= 6％。

3. 发明专利

JP2002076770A HIGH-FREQUENCY TRANSMITTER/RECEIVER 失效
公开(公告)号：JP2002076770A
公开(公告)日：2002-03-15
申请号：JP2000261774
申请日：2000-08-30
申请人： HITACHI LTD , HITACHI CAR ENG CO LTD
发明人： OUCHI SHIRO , SASADA YOSHIYUKI , ISONO TADASHI
IPC分类号： H01Q23/00 , G01S7/28 , H01Q1/22 , H01Q1/38 , H04B1/08
摘要： PROBLEM TO BE SOLVED: To suppress warping an antenna substrate of a high-frequency transmitter/receiver and also to make the connection easy between the circuit substrate of this antenna substrate and the external circuit easy. SOLUTION: Inside an aperture 1a on an outer base plate 1 and on the side of an antenna substrate 4 of a conductor passage forming part 2a on an inner base plate 2, a conductor passage 12 is formed through which leads for connecting a circuit substrate 5 and the external circuit are routed. Through this conductor passage 2, an external connection connector 8 is disposed, and a part of a connector casing 8b supports the antenna substrate 4 by making good use of the external connection connector 8.

4. 发明专利

JP2001237263A HIGH FREQUENCY CIRCUIT DEVICE AND METHOD FOR MANUFACTURING THE SAME 失效
公开(公告)号：JP2001237263A
公开(公告)日：2001-08-31
申请号：JP2000047926
申请日：2000-02-24
申请人： HITACHI LTD , HITACHI CAR ENG CO LTD
发明人： ISONO TADASHI , NAKAZAWA TERUMI , MATSUURA KAZUO , OUCHI SHIRO , OBA MAMORU
IPC分类号： H01L21/60 , H01P5/02 , H01P5/08 , H01P11/00
摘要： PROBLEM TO BE SOLVED: To provide a high frequency circuit device in which transmission loss can be reduced sufficiently at the joint of a semiconductor element and a microstrip line while keeping a sufficient reliability at the joint. SOLUTION: Metal bumps 11 of gold or copper are formed previously on the bonding pads 9 formed on a high frequency semiconductor board 4 and a plurality of bonding wires 7 are bonded through the metal bumps 11 thus reducing damage of the bonding pads 9 due to ultrasonic wave. Since the high frequency transmission line 5 on a high frequency circuit board 6 is bonded surely through metal bumps 11 having a wide bonding area, connection reliability is enhanced with no tail even for a high frequency circuit board 6 made of an organic material resulting in reduction of transmission loss due to radiation and dispersion of transmission characteristics.

5. 发明专利

JPH11258201A EXHAUST COMPONENT SENSOR 失效
公开(公告)号：JPH11258201A
公开(公告)日：1999-09-24
申请号：JP6181498
申请日：1998-03-13
申请人： HITACHI LTD , HITACHI CAR ENG CO LTD
发明人： UENO SADAYASU , OUCHI SHIRO , EBINE HIROMICHI
IPC分类号： G01N27/409
摘要： PROBLEM TO BE SOLVED: To improve stability against the disconnection of heater wire due to thermal stress by constituting a heater by repeatedly reciprocating or turning a thin platinum-group foil or a thin line laminated and arranged on a closely packed inorganic layer. SOLUTION: A heater 16 is constituted by repeatedly reciprocating or turning a platinum-group thin foil or a thin line laminated and arranged on an inorganic layer more closely packed or of a smaller void ratio than that of a porous ceramic material. In other words, the heater 16 is tightly and integrally molded on a porous ceramic layer by fusion bonding by burning a glass material. As an inorganic agent such as a glass agent is used for filling as an adhesive, there are formed extremely few voids between the heater 16 and a zirconia solid electrolyte body or its coated layer in comparison with direct bonding to the porous ceramic layer. Therefore, the heater 16 is securely fixed, and there is no fear of the occurrence of cracks. Then the disconnection failures of wires due to thermal stress in heating are eliminated, and it is possible to use stably.

6. 发明专利

JP2004040430A High frequency communication apparatus and manufacturing method thereof 有权
标题翻译：高频通信设备及其制造方法
公开(公告)号：JP2004040430A
公开(公告)日：2004-02-05
申请号：JP2002194072
申请日：2002-07-03
申请人： Hitachi Car Eng Co Ltd , Hitachi Ltd , 株式会社日立カーエンジニアリング , 株式会社日立製作所
发明人： HIGUMA MASATO , KOSHIZAKA ATSUSHI , OUCHI SHIRO
IPC分类号： H01P3/08 , H04B1/38 , H04B1/3822
摘要： PROBLEM TO BE SOLVED: To provide a high frequency communication apparatus for reducing an interference by an electromagnetic wave from inside and outside its enclosure. SOLUTION: In a transmitter-receiver constituted of: an MMIC acting like an oscillator, an amplifier and a mixer; a circuit board on which the MMIC is mounted and to which the MMIC is connected; an antenna board for constituting an antenna; a base on which the circuit board and the antenna board are mounted and through which a coaxial line or a waveguide is penetrated and supported; and a cover at the side of which projections are periodically provided, the MMIC and the circuit board existing on the side, the pitch, size and shape of the projections differ from each other between a cover part placed at a position opposed to the coaxial line or the waveguide and the other cover part than the position, and the projections are formed by extrusion. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种用于减少来自其外壳内外的电磁波的干扰的高频通信装置。解决方案：在由以下构成的发射机 - 接收机中构成：MMIC如振荡器，放大器和混频器; 安装有MMIC的电路板，MMIC连接到该电路板; 用于构成天线的天线板; 其上安装有电路板和天线板的基座，穿过并支撑同轴线或波导的基座; 并且其周边设置有突起的盖，MMIC和存在于侧面的电路板，突起的间距，尺寸和形状在放置在与同轴线相对的位置的盖部之间彼此不同或波导和另一个盖部分，并且突起通过挤压形成。版权所有（C）2004，JPO

7. 发明专利

JP2002246841A COMPACT OSCILLATOR, HIGH FREQUENCY CIRCUIT DEVICE AND METHOD FOR MANUFACTURING THE OSCILLATOR 失效
公开(公告)号：JP2002246841A
公开(公告)日：2002-08-30
申请号：JP2001043425
申请日：2001-02-20
申请人： HITACHI LTD , HITACHI CAR ENG CO LTD
发明人： OBA MAMORU , SASADA YOSHIYUKI , ISONO TADASHI , OUCHI SHIRO , MATSUURA KAZUO
IPC分类号： H01P7/10 , H03B5/18
摘要： PROBLEM TO BE SOLVED: To efficiently manufacture a compact oscillator with high performance. SOLUTION: The oscillation circuit components including an MMIC chip 4 and a dielectric resonator 2 is mounted on a metallic plate 1, and the metallic plate 1 is inserted from the opening of an integrally formed metallic shield case 6 whose one side edge is opened so that the dielectric resonator 2 can be covered.

8. 发明专利

JP2002076720A HIGH FREQUENCY COAXIAL LINE CONNECTION STRUCTURE 失效
公开(公告)号：JP2002076720A
公开(公告)日：2002-03-15
申请号：JP2000263739
申请日：2000-08-31
申请人： HITACHI LTD , HITACHI CAR ENG CO LTD
发明人： SASADA YOSHIYUKI , ISONO TADASHI , MATSUURA KAZUO , OUCHI SHIRO , OBA MAMORU
IPC分类号： H05K1/11 , H01P1/04 , H01P1/30 , H01P5/08 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a high frequency coaxial line connection structure which has a high degree of reliability against temperature fluctuation hysteresis by increasing the degree of deformation on a first circuit substrate 2 and a second circuit substrate 3 against expansion and contraction of a center conductor 4 accompanying the fluctua tion of the ambient temperature. SOLUTION: The high frequency coaxial line connection structure comprises a first organic material substrate 21 which has metalized areas on both surface and which forms the first high frequency circuit, of a second organic material substrate 31 which has metalized areas on both surfaces which forms the second high frequency circuit. And the organic material substrate 21 and the organic material substrate 31 are each bonded on one and the other side surface of a base substrate 1 which forms a through hole starting from the organic material substrate 21 through the substrate 1 reaching to the organic material substrate 31. The base conductor 4 is deployed coaxially within the through hole and conductively connected each ends to the first and second high frequency circuits. The through holes are comprised of a first through hole 8 which formed on the base substrate 1 and a second through hole 9 formed on the organic material substrate 21 and the organic material substrate 31, and the diameter d1 of the first through hole 8 is formed bigger than the diameter d2 of the second through hole 9.

9. 发明专利

JP2002076715A HIGH FREQUENCY COMMUNICATION DEVICE 失效
公开(公告)号：JP2002076715A
公开(公告)日：2002-03-15
申请号：JP2000261564
申请日：2000-08-30
申请人： HITACHI LTD , HITACHI CAR ENG CO LTD
发明人： ISONO TADASHI , MATSUURA KAZUO , NAKAZAWA TERUMI , OUCHI SHIRO
IPC分类号： H01P1/00 , H01P3/08
摘要： PROBLEM TO BE SOLVED: To provide a high frequency communication device which exerts the circuit features to the utmost by restricting electromagnetic coupling between high frequency circuit devices. SOLUTION: At a high frequency communication device which restricts a electromagnetic interface between a high frequency circuit device 4a and 4b mounted to a circuit board 6 by a filtering features which are achieved by metal projections 7 made in plural at the ceiling part of a metal cover 3, the size L between the projection 7 and a metal wall 2 and the wavelength λg of a magnetic wave at applied bandwidth are set to form the relation of L

10. 发明专利

JP2001324561A ON-VEHICLE RADIO RADAR DEVICE 失效
公开(公告)号：JP2001324561A
公开(公告)日：2001-11-22
申请号：JP2000141200
申请日：2000-05-15
申请人： HITACHI LTD , HITACHI CAR ENG CO LTD
发明人： SUZUKI MITSUSHIGE , TAKANO KAZURO , NAKAZAWA TERUMI , OUCHI SHIRO , NAKAMURA KAZUTO
IPC分类号： G01S7/03 , G01S7/28 , G01S13/34 , G01S13/42 , G01S13/60 , G01S13/93 , H01Q1/32 , H01Q23/00
摘要： PROBLEM TO BE SOLVED: To reduce degradation in performance due to influences of unnecessary noise and static electricity. SOLUTION: An antenna base 3, a control circuit part 10 and a high-frequency circuit part 6 are sealed in by a casing 2 and a radome 1, in which internal space the control circuit part 10 and the high-frequency circuit part 6 are enclosed by the antenna base 3 and the casing 2. Circuit GND 27 common to the control circuit part 10 and the high-frequency circuit part 6 is electrically connected to the antenna base 3 and the casing 2, and connected to vehicle body GND 26 only via a capacitive impedance 31.

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