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1. 发明专利

DE60306040D1 未知
公开(公告)号：DE60306040D1
公开(公告)日：2006-07-27
申请号：DE60306040
申请日：2003-07-03
申请人： HITACHI LTD , HITACHI CAR ENG CO LTD
发明人： YOSHIZAKI ATSUHIRO , MASHINO KEIICHI , ANAN HIROMICHI , OCHIAI YOSHITAKA
IPC分类号： H01L23/051 , H01L23/367 , H01L23/373 , H01L25/07 , H01L25/11 , H02M7/48
摘要： One method of achieving the above subjects is by connecting a block member 14, which is connected to the side opposite to that of a semiconductor chip 11 having insulating substrates 12 and 13 connected to the top and bottom of the semiconductor chip 11, to a block member 15 across an laminated structure constituted by the semiconductor chip 11 and the insulating substrates 12 and 13.

2. 发明专利

DE60306040T2 未知
公开(公告)号：DE60306040T2
公开(公告)日：2006-12-14
申请号：DE60306040
申请日：2003-07-03
申请人： HITACHI LTD , HITACHI CAR ENG CO LTD
发明人： YOSHIZAKI ATSUHIRO , MASHINO KEIICHI , ANAN HIROMICHI , OCHIAI YOSHITAKA
IPC分类号： H01L23/051 , H01L23/367 , H01L23/373 , H01L25/07 , H01L25/11 , H02M7/48
摘要： One method of achieving the above subjects is by connecting a block member 14, which is connected to the side opposite to that of a semiconductor chip 11 having insulating substrates 12 and 13 connected to the top and bottom of the semiconductor chip 11, to a block member 15 across an laminated structure constituted by the semiconductor chip 11 and the insulating substrates 12 and 13.

3. 发明专利

DE3573864D1 ALIGNMENT METHOD FOR REDUCTION PROJECTION TYPE ALIGNER 未知
公开(公告)号：DE3573864D1
公开(公告)日：1989-11-23
申请号：DE3573864
申请日：1985-11-12
申请人： HITACHI LTD
发明人： NAKATA TOSHIHIKO , SHIBA MASATAKA , OSHIDA YOSHITADA , UTO SACHIO , YOSHIZAKI ATSUHIRO
IPC分类号： G03F9/00 , H01L21/68 , G03B27/53 , G02B27/00
摘要： An alignment method for reduction projection type aligner is disclosed in which the rough detection of reticle position in the reticle alignment process at the time of mounting a reticle (1) and the fine detection of reticle position in the wafer alignment for the alignment between a wafer (3) and the reticle (1) are performed automatically by the same reticle alignment pattern (18) and the same optical alignment detection system (38). A plurality of one- or two-dimensional Fresnel zone plates (19, 20) having different shapes of diffraction patterns formed outside of a reticle circuit pattern (16) and arranged at a position outward of the entrance pupil (2') of the reduction projection lens (2) are used as a a reticle alignment pattern (18) to detect the absolute position of the reticle (1). The detection field of view of the optical alignment detection system (38) is thus effectively widened to make pattern detection possible with high magnification for an improved detection accuracy. The same reticle alignment pattern (18) and the same optical alignment detection system (38) are used for rough detection of reticle position in reticle alignment and fine detection of reti- cie position in wafer alignment. In the optical alignment detection system (38), on the other hand, the image position of the diffraction pattern (39a to 39c) from the reticle alignment pattern (18) and the image position of the wafer alignment pattern (14) are located at the same distance from the recticle surface.

4. 发明专利

JP2004040899A Semiconductor module and power converter 有权
公开(公告)号：JP2004040899A
公开(公告)日：2004-02-05
申请号：JP2002194077
申请日：2002-07-03
申请人： Hitachi Car Eng Co Ltd , Hitachi Ltd , 株式会社日立カーエンジニアリング , 株式会社日立製作所
发明人： YOSHIZAKI ATSUHIRO , MASUNO KEIICHI , ANAMI HIROYASU , OCHIAI YOSHITAKA
IPC分类号： H01L23/051 , H01L23/36 , H01L25/07 , H01L25/18 , H02M1/00 , H02M7/48
CPC分类号： H01L24/48 , H01L23/051 , H01L23/36 , H01L25/072 , H01L2224/05599 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/484 , H01L2224/85399 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/01047 , H01L2924/01074 , H01L2924/014 , H01L2924/10253 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/3011 , H01L2924/351 , H01L2224/45099 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor module which can enhance the cooling performance and a reliable, small-sized and low-cost power converter which can keep its motion normally even if used under severe environment of heat cycles. SOLUTION: One hand of conductive members 12 which are bonded severally to both sides of a semiconductor chip 11 and have heat conductivity is bonded with the same face as the installation face of the conductive member 13, while it is insulated electrically from a conductive member 13, astride the stack of the semiconductor chip 11 and the conductive member 13. COPYRIGHT: (C)2004,JPO

5. 发明专利

JP2002043479A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2002043479A
公开(公告)日：2002-02-08
申请号：JP2000224863
申请日：2000-07-26
申请人： HITACHI LTD , HITACHI CAR ENG CO LTD
发明人： YOSHIZAKI ATSUHIRO , YAMAMURA HIROHISA , MASUNO KEIICHI , SHIMIZU IZUMI , YASUKAWA AKIO
IPC分类号： H01L23/36
摘要： PROBLEM TO BE SOLVED: To provide a small-sized semiconductor device by which working man-hours can be reduced. SOLUTION: An insulating plate 14 and a radiating body 16 are integrally molded by casting processing by using the structure 12 of a molten aluminum alloy material 12 to be made a composite material 10. A semiconductor element 20 constituting a power circuit is joined by soldering 40 on a wiring pattern 30 of the insulating plate 14.

6. 发明专利

JP2001217389A LOW-REACTANCE POWER CIRCUIT MOUNTING STRUCTURE 失效
公开(公告)号：JP2001217389A
公开(公告)日：2001-08-10
申请号：JP2000027214
申请日：2000-01-31
申请人： HITACHI LTD , HITACHI CAR ENG CO LTD
发明人： YOSHIZAKI ATSUHIRO , YAMAMURA HIROHISA , MASUNO KEIICHI , MOKUYA KINJI , SHIMIZU IZUMI
IPC分类号： H01L25/07 , H01L25/18
摘要： PROBLEM TO BE SOLVED: To provide a mounting structure of a power electronics circuit which realizes suppression of a parasitic reactance component in a current circuit and efficient radiation of heat in a semiconductor element. SOLUTION: Forward wiring path from a power supply to a semiconductor element and a return path thereto are made of flat plate-like wiring conductors, the plate conductors are positioned adjacent to each other, and the flat semiconductor element is sandwiched by the plate conductors. Electrodes on front and rear surfaces of the semiconductor element are connected to the plate conductors to form a wiring for application of a large current. At the same time, a surface area of a wiring loop of the forward and return paths is minimized to minimize a parasitic reactance in a large current circuit and also a trouble caused thereby.

7. 发明专利

JPH07187389A NONCONTACT BRAKING POSITIONING METHOD 失效
公开(公告)号：JPH07187389A
公开(公告)日：1995-07-25
申请号：JP33130493
申请日：1993-12-27
申请人： HITACHI LTD , HITACHI KIDEN KOGYO KK
发明人： YOSHIZAKI ATSUHIRO , FUJII HIROSHI
IPC分类号： B61H9/06 , B60L7/28 , B65G1/00 , B65G54/02 , H02P7/00 , H02P25/06
摘要： PURPOSE:To effectively brake and position a motional object in a noncontact condition by keeping a clean condition without generating a foreign matter. CONSTITUTION:Braking plates 4 are arranged on a carriage 2, and magnetic fluxes 8 orthogonal to the braking plates 4 are generated by magnetic poles 5, and an eddy current is generated on them by motion of the braking plates 4, and kinetic energy of the carriage 2 is converted into energy of the eddy current, and the kinetic energy is vanished. Thereby, clean braking force can be obtained in a noncontact condition. Speed of a motional object is monotonously reduced, and vibration is restrained. Braking and unidirectional positioning operation are combined with each other, and simple positioning operation becomes possible.

8. 发明专利

JPH06275494A STEPPER 失效
公开(公告)号：JPH06275494A
公开(公告)日：1994-09-30
申请号：JP6205993
申请日：1993-03-22
申请人： HITACHI LTD
发明人： YOSHIZAKI ATSUHIRO , SAITO NAOTAKE
IPC分类号： G03F7/20 , H01L21/027 , H01L21/30
摘要： PURPOSE:To enable miniaturizing a stepper by using a low-pressure chamber for reduced error due to fluctuation of atmospheric temperature, moisture and pressure, accompanied by less dust. CONSTITUTION:A reticule 2, its supporting frame 3 and an incidence part of a reduction lens assembly 4 are enclosed in the first low-pressure chamber 13, and an out-going part of the reduction lens assembly 4, a wafer 5 and its transportation X-Y stage 6 are enclosed in the second low-pressure chamber 14. A wafer pattern detection system 10 and reticule pattern detection system 12 are assigned in the first low-pressure chamber 13, and a laser length measuring device 11 is assigned in the second low-pressure chamber 14. On the outside of the first and second low-pressure chambers 13 and 14, a lens temperature adjustment system 20 is assigned around an outside cylinder part of the reduction lens assembly 4. At the reduction lens assembly 4, an air path for communication between the first and second low-pressure chambers 13 and 14 and the space between lens elements is formed.

9. 发明专利

JPH0516649B2 失效
公开(公告)号：JPH0516649B2
公开(公告)日：1993-03-05
申请号：JP23742084
申请日：1984-11-13
申请人： HITACHI LTD
发明人： NAKADA TOSHIHIKO , SHIBA MASATAKA , OSHIDA YOSHITADA , UTO YUKIO , YOSHIZAKI ATSUHIRO
IPC分类号： H01L21/30 , G03F9/00 , H01L21/027

10. 发明专利

JPS61116836A Alignment system 失效
标题翻译：对齐系统
公开(公告)号：JPS61116836A
公开(公告)日：1986-06-04
申请号：JP23742084
申请日：1984-11-13
申请人： Hitachi Ltd
发明人： NAKADA TOSHIHIKO , SHIBA MASATAKA , OSHIDA YOSHISADA , UTO YUKIO , YOSHIZAKI ATSUHIRO
IPC分类号： H01L21/30 , G03F9/00 , H01L21/027
CPC分类号： G03F9/7076
摘要： PURPOSE:To easily realize alignment by executing the coarse detection for loading reticle to the fixed position and fine detection for alignment with wafer through same reticle alignment pattern and the same detection optical system. CONSTITUTION:The alignment pattern groups 18a-18e of reticle 1 have different number of fresnel belt plates 19a-19e, its diffraction pattern is focused to a movable slit 9 of optical system 38. Meanwhile, the reflected light of mirror pattern 17 is reflected by the alignment pattern, focused to the slit 9 and is detected by photosensor. In this case, when the sight (dotted line) of optical system 38 exists in the pattern 18a (target value) in the same position as the mirror pattern 17, the diffracted pattern image 39c on the slit 9 becomes linear and the signal 40c can be obtained by the slit scanning. The patterns 18a-18e are set independently within the detection sight and the relation between a number of fresnel plate 19 and center interval of pattern group 18 is previously detected. Thereby, the absolute position of reticle 1 can be detected from a number of linear diffraction patterns 39 and corrected distance from the position of pattern 18 to the target position can also be detected.
摘要翻译：目的：通过执行粗调检测，通过相同的掩模版校准图案和相同的检测光学系统，通过执行将掩模版加载到固定位置的微细检测和与晶片对准的精细检测来容易地实现对准。构图：标线片1的取向图案组18a-18e具有不同数量的菲涅耳带板19a-19e，其衍射图案被聚焦到光学系统38的可移动狭缝9上。同时，反射镜图案17的反射光被对准图案被聚焦到狭缝9并被光电传感器检测。在这种情况下，当与镜面图案17相同位置的光学系统38的视线（虚线）存在于图案18a（目标值）时，狭缝9上的衍射图案图像39c变为线性的，信号40c可以通过狭缝扫描获得。图案18a-18e被独立地设置在检测视线内，并且先前检测了菲涅尔板19的数量与图案组18的中心间隔之间的关系。因此，可以从多个线性衍射图案39检测标线片1的绝对位置，并且还可以检测从图案18的位置到目标位置的校正距离。

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