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    • 1. 发明授权
    • Method for forming a buried dielectric layer underneath a semiconductor fin
    • 在半导体翅片下形成掩埋介质层的方法
    • US08835278B2
    • 2014-09-16
    • US13885884
    • 2011-11-16
    • Gouri Sankar KarAntonino CacciatoMin-Soo Kim
    • Gouri Sankar KarAntonino CacciatoMin-Soo Kim
    • H01L21/76H01L21/762H01L21/8234H01L27/115
    • H01L21/76224H01L21/76208H01L21/76281H01L21/823431H01L27/11521
    • Disclosed are methods for forming a localized buried dielectric layer under a fin for use in a semiconductor device. In some embodiments, the method may include providing a substrate comprising a bulk semiconductor material and forming at least two trenches in the substrate, thereby forming at least one fin. The method further includes filling the trenches with an insulating material and partially removing the insulating material to form an insulating region at the bottom of each of the trenches. The method further includes depositing a liner at least on the sidewalls of the trenches, removing a layer from a top of each of the insulating regions to thereby form a window opening at the bottom region of the fin, and transforming the bulk semiconductor material of the bottom region of the fin via the window opening, thereby forming a localized buried dielectric layer in the bottom region of the fin.
    • 公开了在用于半导体器件的翅片下面形成局部埋置介质层的方法。 在一些实施例中,该方法可以包括提供包括体半导体材料并在衬底中形成至少两个沟槽的衬底,从而形成至少一个鳍。 该方法还包括用绝缘材料填充沟槽并且部分地去除绝缘材料以在每个沟槽的底部形成绝缘区域。 该方法还包括至少在沟槽的侧壁上沉积衬垫,从每个绝缘区域的顶部去除层,从而在鳍的底部区域形成窗口开口,并且将本体半导体材料 通过窗口打开翅片的底部区域,从而在翅片的底部区域中形成局部埋置的介质层。
    • 2. 发明申请
    • Method for Forming a Buried Dielectric Layer Underneath a Semiconductor Fin
    • 在半导体翅片下形成掩埋电介质层的方法
    • US20140065794A1
    • 2014-03-06
    • US13885884
    • 2011-11-16
    • Gouri Sankar KarAntonino CacciatoMin-Soo Kim
    • Gouri Sankar KarAntonino CacciatoMin-Soo Kim
    • H01L21/762
    • H01L21/76224H01L21/76208H01L21/76281H01L21/823431H01L27/11521
    • Disclosed are methods for forming a localized buried dielectric layer under a fin for use in a semiconductor device. In some embodiments, the method may include providing a substrate comprising a bulk semiconductor material and forming at least two trenches in the substrate, thereby forming at least one fin. The method further includes filling the trenches with an insulating material and partially removing the insulating material to form an insulating region at the bottom of each of the trenches. The method further includes depositing a liner at least on the sidewalls of the trenches, removing a layer from a top of each of the insulating regions to thereby form a window opening at the bottom region of the fin, and transforming the bulk semiconductor material of the bottom region of the fin via the window opening, thereby forming a localized buried dielectric layer in the bottom region of the fin.
    • 公开了在用于半导体器件的翅片下面形成局部埋置介质层的方法。 在一些实施例中,该方法可以包括提供包括体半导体材料并在衬底中形成至少两个沟槽的衬底,从而形成至少一个鳍。 该方法还包括用绝缘材料填充沟槽并且部分地去除绝缘材料以在每个沟槽的底部形成绝缘区域。 该方法还包括至少在沟槽的侧壁上沉积衬垫,从每个绝缘区域的顶部去除层,从而在鳍的底部区域形成窗口开口,并且将本体半导体材料 通过窗口打开翅片的底部区域,从而在翅片的底部区域中形成局部埋置的介质层。
    • 5. 发明授权
    • Embedded robot control system
    • 嵌入式机器人控制系统
    • US09086694B2
    • 2015-07-21
    • US12779729
    • 2010-05-13
    • Young-Youl HaSeong-Hun ChoiMin-Soo KimGap-Joo Woo
    • Young-Youl HaSeong-Hun ChoiMin-Soo KimGap-Joo Woo
    • G05B19/418G05B19/414B25J9/16
    • G05B19/4141B25J9/161G05B2219/33342G05B2219/34024
    • The present invention relates to an embedded robot control system, particularly to an embedded robot control system of a highly expandable distributed control mode. An aspect of the present invention features an embedded robot control system. In accordance with an embodiment of the present invention, the embedded robot control system, which controls a plurality of robot instruments, which have a motor and a sensor, and a robot, which is connected with the plurality of robot instruments, can include a master controller, which is installed on the robot and controls the motor and the sensor of the robot instrument, and a slave controller, which is installed on another robot, connected to the robot, or the robot instrument and receives a control signal of the motor or the sensor from the master controller and controls the motor and the sensor.
    • 嵌入式机器人控制系统技术领域本发明涉及一种嵌入式机器人控制系统,特别涉及一种高度可扩展的分布式控制模式的嵌入式机器人控制系统。 本发明的一个方面的特征在于嵌入式机器人控制系统。 根据本发明的一个实施例,与多个机器人器械连接的控制具有马达和传感器的多个机器人器械的嵌入式机器人控制系统和机器人可以包括主机 控制器,其安装在机器人上并控制机器人仪器的电动机和传感器,以及安装在与机器人连接的另一机器人上的从控制器或机器人仪器,并且接收电动机的控制信号或 来自主控制器的传感器,并控制电机和传感器。