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    • 1. 发明授权
    • Ultra thin radio housing with integral antenna
    • 超薄无线电外壳,带集成天线
    • US4894663A
    • 1990-01-16
    • US121322
    • 1987-11-16
    • Glenn F. UrbishQuirino BalzanoDale W. DorinskiMartin J. McKinleyLeng H. OoiJohn A. StoutlandAnthony B. Suppelsa
    • Glenn F. UrbishQuirino BalzanoDale W. DorinskiMartin J. McKinleyLeng H. OoiJohn A. StoutlandAnthony B. Suppelsa
    • H01Q1/24H01Q7/00H05K1/00H05K1/16
    • H01Q7/00H01Q1/243H05K1/0284H05K1/16
    • The preferred housing includes an integrally molded thermoplastic base (102) and cover (104) assembly. The cover is joined to the base by a living hinge (106) and a peripheral wall (108) extends around the perimeter of the base. In one embodiment, the antenna is a wire loop (204), the wire being wound in an external circumferential groove (202A) in the peripheral wall or, alternatively, integrally molded into the peripheral wall. Other embodiments use printed circuit loop antenna patterns that are preferably vacuum deposited directly onto the thermoplastic base and/or cover. When the antenna pattern is disposed on both the cover and the base, a portion of the antenna (e.g., 1002K) is also disposed on the hinge to join the main portions of the antenna on the base and cover. In one embodiment of the printed circuit loop antenna, the plane of the loop lies parallel to the base and may include one or more turns or loops (e.g., 402C, E, G and J). In another embodiment, the loop includes a 90 degree bend (e.g., 504) and both planes of the loop lie perpendicular to the base. In still another embodiment, the loop includes three 90 degree bends, a crossover at one of the bends (e.g., at 704), and all four planes of the loop lie perpendicular to the base.
    • 优选的壳体包括整体模制的热塑性基座(102)和盖(104)组件。 盖通过活动铰链(106)连接到基部,并且周壁(108)围绕基部的周边延伸。 在一个实施例中,天线是线环(204),线缠绕在周壁中的外周凹槽(202A)中,或者整体模制成周壁。 其他实施例使用优选地真空地直接沉积到热塑性基底和/或盖上的印刷电路环形天线图案。 当天线图案设置在盖和底座上时,天线的一部分(例如,1002K)也设置在铰链上,以将天线的主要部分连接在基座和盖上。 在印刷电路环形天线的一个实施例中,环的平面平行于基部并且可以包括一个或多个匝或环(例如,402C,E,G和J)。 在另一个实施例中,环包括90度弯曲(例如504),并且环的两个平面垂直于基部。 在另一个实施例中,环路包括三个90度弯曲部,在一个弯曲处(例如,在704处)的交叉,并且环的所有四个平面垂直于基部。
    • 2. 发明授权
    • Process for photoimaging a three dimensional printed circuit substrate
    • 用于三维印刷电路基板的光学成像的方法
    • US5001038A
    • 1991-03-19
    • US121326
    • 1987-11-16
    • Dale W. DorinskiM. William Branan, Jr.Glenn F. UrbishAnthony B. SuppelsaMartin J. McKinleyDouglas W. Hendricks
    • Dale W. DorinskiM. William Branan, Jr.Glenn F. UrbishAnthony B. SuppelsaMartin J. McKinleyDouglas W. Hendricks
    • G03F7/20H05K1/00H05K3/00
    • G03F7/70283G03F7/20G03F7/2022G03F7/70333G03F7/70466H05K3/0082H05K1/0284H05K2203/056H05K3/0002
    • Printed circuit patterns are photolithographically defined on a three dimensional "projection" surface (204) of a printed circuit substrate (202) using a projection image aligner and a photomask (210) having a planar image (210A). The geometry of the projection is restricted such that the slope of the projection surface, as measured at any point on the projection surface and relative to a reference plane which is parallel to the focal plane of the projection image aligner, is less than 90 degrees. A solution of photoresist includes a photoresist solvent, a fluorosurfactant and an aromatic hydrocarbon solvent, and is preferably sprayed over the projection surface. In one method of manufacture, the printed circuit substrate is moved from one position to another during the exposure of the photoresist layer (206). In another method, after a first portion of the projection surface is exposed by a first photomask (502), a second photomask (504) is substituted and the remainder of the projection surface exposed. In still another method, a photomask having a plurality of planar images (604A, 604B and 606A) each image being positioned parallel to the others but separated by a small distance, is used to simultaneously exposed the entire projection surface.
    • 使用投影图像对准器和具有平面图像(210A)的光掩模(210)将印刷电路图案光刻地限定在印刷电路基板(202)的三维“投影”表面(204)上。 突起的几何形状受到限制,使得投影表面的倾斜度(在投影表面上的任何点上相对于平行于投影图像对准器的焦平面的参考平面)测得的小于90度。 光致抗蚀剂溶液包括光致抗蚀剂溶剂,含氟表面活性剂和芳族烃溶剂,并且优选地喷射在投影表面上。 在一种制造方法中,在光致抗蚀剂层(206)的曝光期间,印刷电路基板从一个位置移动到另一个位置。 在另一种方法中,在投影表面的第一部分被第一光掩模(502)暴露之后,替换第二光掩模(504),并且突出表面的其余部分被暴露。 在另一种方法中,使用具有多个平面图像(604A,604B和606A)的光掩模,每个图像平行于另一个平行而被分开一小段距离,以同时曝光整个投影表面。
    • 6. 发明授权
    • Housing with integral thin film resistive snap-fits
    • 外壳采用整体薄膜电阻卡扣
    • US5536917A
    • 1996-07-16
    • US264551
    • 1994-06-23
    • Anthony B. SuppelsaDale W. Dorinski
    • Anthony B. SuppelsaDale W. Dorinski
    • B29C65/08B29C65/58B29C65/76E05B47/00E05C19/06H05K5/00H05B1/00
    • E05B47/0009B29C65/08B29C65/58B29C65/76B29C66/54B29C66/542B29C66/73921E05C19/06H05K5/0013Y10T156/1158Y10T156/1911
    • An assembly (5) has two or more plastic parts joined together. One of the plastic parts (20) has an electrical heating element (31) whose function is to soften a portion of the plastic when the heating element is electrically energized. Once the plastic is softened, the two parts can be separated and the assembly disassembled. When the two parts are joined together with snap-fit joints, the snap-fits have a heating element to soften a portion of the snap-fit (24) when the heating element is electrically energized, thereby allowing the housing to be opened and separated. If the two parts are ultrasonically welded together to form a housing, a heating element is located therein to soften the ultrasonically welded portion (44), thereby allowing the two halves of the housing to be separated. The heating element can be a nichrome or thin film resistor that is energized by a source (33) located within the housing, or by an power source external to the housing, or it may be inductively coupled to the power source.
    • 组件(5)具有两个或多个连接在一起的塑料部件。 其中一个塑料部件(20)具有电加热元件(31),其功能是在加热元件通电时软化一部分塑料。 一旦塑料软化,两个部分可以分离,拆卸组件。 当两个部分用卡扣配合接合在一起时,卡扣配合件具有加热元件,以在加热元件被通电时软化卡扣配合件(24)的一部分,从而允许壳体打开和分离 。 如果两个部件被超声波焊接在一起形成壳体,则加热元件位于其中,以软化超声波焊接部分(44),从而允许壳体的两半分离。 加热元件可以是由位于壳体内的源(33)或壳体外部的电源激励的镍铬合金或薄膜电阻器,或者可以感应地耦合到电源。
    • 8. 发明授权
    • Light erasable multichip module
    • 光可擦多芯片模块
    • US5438216A
    • 1995-08-01
    • US937017
    • 1992-08-31
    • Frank J. JuskeyAnthony B. SuppelsaDale W. Dorinski
    • Frank J. JuskeyAnthony B. SuppelsaDale W. Dorinski
    • G11C5/00G11C16/18H01L27/14H01L23/02H01L23/12H01L31/00
    • G11C16/18G11C5/00H01L2224/48091H01L2924/01322H01L2924/1815
    • A multichip circuit package is formed for use with an EPROM chip. The active circuitry on the EPROM die surface is revealed. An EPROM die (14) is mounted on an insulating substrate (10). The active circuitry (15) on the die is connected to a conductive circuit pattern (13) on the substrate by wire bonds (16) between the die and the conductive circuit pattern. A second integrated circuit die (20) is also mounted on the substrate and electrically connected to the conductive circuit pattern by wire bonds. A plastic material (50) is then molded to encapsulate the perimeter (18) of the EPROM and the associated thin wires, the entire second integrated circuit die and it's associated thin wires, at least a portion of the conductive circuit pattern, and portions of the insulating substrate. The plastic material is formed so as to expose the active circuitry on the face of the EPROM.
    • 形成用于EPROM芯片的多芯片电路封装。 显示了EPROM芯片表面上的有源电路。 EPROM芯片(14)安装在绝缘基板(10)上。 管芯上的有源电路(15)通过管芯和导电电路图案之间的引线键合(16)连接到衬底上的导电电路图案(13)。 第二集成电路管芯(20)也安装在衬底上并且通过引线键与导电电路图案电连接。 塑料材料(50)然后被模制以封装EPROM的周边(18)和相关联的细线,整个第二集成电路管芯及其相关联的细线,导电电路图案的至少一部分和 绝缘基板。 塑料材料被形成为暴露EPROM表面上的有源电路。
    • 10. 发明授权
    • Housing with integral opening feature
    • 外壳具有整体打开功能
    • US5591364A
    • 1997-01-07
    • US535370
    • 1995-09-28
    • Anthony B. SuppelsaDale W. Dorinski
    • Anthony B. SuppelsaDale W. Dorinski
    • B29C65/08B29C65/58B29C65/76E05B47/00E05C19/06H05K5/00H05B1/00
    • E05B47/0009B29C65/08B29C65/58B29C65/76B29C66/54B29C66/542B29C66/73921E05C19/06H05K5/0013Y10T156/1158Y10T156/1911
    • An assembly (5) has two or more plastic parts joined together. One of the plastic parts (20) has an electrical heating element (31) whose function is to soften a portion of the plastic when the heating element is electrically energized. Once the plastic is softened, the two parts can be separated and the assembly disassembled. When the two parts are joined together with snap-fit joints, the snap-fits have a heating element to soften a portion of the snap-fit (24) when the heating element is electrically energized, thereby allowing the housing to be opened and separated. If the two parts are ultrasonically welded together to form a housing, a heating element is located therein to soften the ultrasonically welded portion (44), thereby allowing the two halves of the housing to be separated. The heating element can be a nichrome or thin film resistor that is energized by a source (33) located within the housing, or by an power source external to the housing, or it may be inductively coupled to the power source.
    • 组件(5)具有两个或多个连接在一起的塑料部件。 其中一个塑料部件(20)具有电加热元件(31),其功能是在加热元件通电时软化一部分塑料。 一旦塑料软化,两个部分可以分离,拆卸组件。 当两个部分用卡扣配合接合在一起时,卡扣配合件具有加热元件,以在加热元件被通电时软化卡扣配合件(24)的一部分,从而允许外壳打开和分离 。 如果两个部件被超声波焊接在一起形成壳体,则加热元件位于其中,以软化超声波焊接部分(44),从而允许壳体的两半分离。 加热元件可以是由位于壳体内的源(33)或壳体外部的电源激励的镍铬合金或薄膜电阻器,或者可以感应地耦合到电源。