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    • 8. 发明授权
    • Use or organic acids in low residue solder pastes
    • 在低残留焊膏中使用或有机酸
    • US5064481A
    • 1991-11-12
    • US524540
    • 1990-05-17
    • James L. DavisRobert W. PennisiFadia NounouBobby D. Landreth
    • James L. DavisRobert W. PennisiFadia NounouBobby D. Landreth
    • H05K3/34B23K35/22B23K35/36B23K35/363
    • B23K35/3618B23K35/36
    • Fluxing compositions are described containing as fluxing agents compounds of the formula: ##STR1## where R is an electron withdrawing group. In one embodiment, R is selected from the group consisting of fluorine, chlorine, bromine, iodine, sulfur, hydroxyl, nitrile, and benzyl. The compound cleans oxides from the printed circuit boards (PCBs) under assembly and then volatilize with little or no need for a cleaning step, or cleaning only with water or formic acid. Very little or no undesired residue remains. Such acid fluxing agents can be used mixed with typical solder formulations, such as lead/tin solder pastes, or applied topically to solders, such as solder balls; both techniques permit the assembly of PCBs more easily with high quality bonds, and with little or no residue. Malic acid is a preferred organic acid fluxing agent.
    • 描述了助熔组合物,其含有下式的助熔剂化合物:其中R是吸电子基团。 在一个实施方案中,R选自氟,氯,溴,碘,硫,羟基,腈和苄基。 该复合物从组装的印刷电路板(PCB)中清除氧化物,然后几乎不需要清洁步骤或仅用水或甲酸清洗即可挥发。 很少或不需要不需要的残留物。 这种酸性助熔剂可以与典型的焊料配方(例如铅/锡焊膏)混合使用,或局部施用于焊料如焊料球; 这两种技术允许更容易地组装PCBs,具有高质量的键,并且几乎没有或没有残留物。 苹果酸是优选的有机酸助熔剂。