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1. 发明授权

US06084213A Method and apparatus for increasing temperature uniformity of heated wafers 失效
标题翻译：用于提高加热晶片温度均匀性的方法和装置
公开(公告)号：US06084213A
公开(公告)日：2000-07-04
申请号：US80402
申请日：1998-05-18
申请人： Gil Kohav , Igor Fidelman , Arie Harnik
发明人： Gil Kohav , Igor Fidelman , Arie Harnik
IPC分类号： H01L21/00 , H01L21/20
CPC分类号： H01L21/67115
摘要： A method and apparatus are described for increasing the temperature uniformity of a wafer heated in a rapid thermal process (RTP) while the wafer is supported by a high emissivity structure in spaced relation above the head during the heating of the wafer; characterized in that a high-reflectivity ring, highly reflective to the radiation of the wafer, is provided on the head underlying the high emissivity ring.
摘要翻译：描述了一种用于提高在快速热处理（RTP）中加热的晶片的温度均匀性的方法和装置，同时晶片在晶片的加热期间以高于头部的间隔关系支撑着高发射率结构; 其特征在于，在高发射率环上的头部上提供对晶片辐射高度反射的高反射率环。

2. 发明授权

US07977258B2 Method and system for thermally processing a plurality of wafer-shaped objects 有权
标题翻译：用于热处理多个晶片形物体的方法和系统
公开(公告)号：US07977258B2
公开(公告)日：2011-07-12
申请号：US11784503
申请日：2007-04-06
申请人： Zsolt Nenyei , Paul J. Timans , Wilfried Lerch , Jüergen Niess , Manfred Falter , Patrick Schmid , Conor Patrick O'Carroll , Rudy Cardema , Igor Fidelman , Sing-Pin Tay , Yao Zhi Hu , Daniel J. Devine
发明人： Zsolt Nenyei , Paul J. Timans , Wilfried Lerch , Jüergen Niess , Manfred Falter , Patrick Schmid , Conor Patrick O'Carroll , Rudy Cardema , Igor Fidelman , Sing-Pin Tay , Yao Zhi Hu , Daniel J. Devine
IPC分类号： H01L21/00 , F27B9/14
CPC分类号： H01L21/67115
摘要： Process and system for processing wafer-shaped objects, such as semiconductor wafers is disclosed. In accordance with the present disclosure, a multiple of two wafers are processed in a thermal processing chamber. The thermal processing chamber is in communication with at least one heating device for heating the wafers. The wafers are placed in the thermal processing chamber in a face-to-face configuration or in a back-to-back configuration.
摘要翻译：公开了用于处理诸如半导体晶片的晶片状物体的工艺和系统。根据本公开，在热处理室中处理两个晶片的倍数。热处理室与用于加热晶片的至少一个加热装置连通。将晶片以面对面配置或背对背配置放置在热处理室中。

3. 发明申请

US20080248657A1 Method and system for thermally processing a plurality of wafer-shaped objects 有权
标题翻译：用于热处理多个晶片形物体的方法和系统
公开(公告)号：US20080248657A1
公开(公告)日：2008-10-09
申请号：US11784503
申请日：2007-04-06
申请人： Zsolt Nenyei , Paul J. Timans , Wilfried Lerch , Juergen Niess , Manfred Falter , Patrick Schmid , Conor Patrick O'Carroll , Rudy Cardema , Igor Fidelman , Sing-Pin Tay , Yao Zhi Hu , Daniel J. Devine
发明人： Zsolt Nenyei , Paul J. Timans , Wilfried Lerch , Juergen Niess , Manfred Falter , Patrick Schmid , Conor Patrick O'Carroll , Rudy Cardema , Igor Fidelman , Sing-Pin Tay , Yao Zhi Hu , Daniel J. Devine
IPC分类号： H01L21/00
CPC分类号： H01L21/67115
摘要： Process and system for processing wafer-shaped objects, such as semiconductor wafers is disclosed. In accordance with the present disclosure, a multiple of two wafers are processed in a thermal processing chamber. The thermal processing chamber is in communication with at least one heating device for heating the wafers. The wafers are placed in the thermal processing chamber in a face-to-face configuration or in a back-to-back configuration.
摘要翻译：公开了用于处理诸如半导体晶片的晶片状物体的工艺和系统。根据本公开，在热处理室中处理两个晶片的倍数。热处理室与用于加热晶片的至少一个加热装置连通。将晶片以面对面配置或背对背配置放置在热处理室中。

4. 发明授权

US06284051B1 Cooled window 失效
标题翻译：冷却的窗户
公开(公告)号：US06284051B1
公开(公告)日：2001-09-04
申请号：US09321198
申请日：1999-05-27
申请人： Igor Fidelman
发明人： Igor Fidelman
IPC分类号： C23C1600
CPC分类号： H01L21/67115 , C23C16/481 , C23C16/488 , C30B25/08 , C30B31/10
摘要： A cooled window assembly for a thermal processing chamber, wherein an object in the chamber is heated by a radiation source outside the chamber emitting radiation that includes infrared radiation. The assembly includes upper and lower transparent plates defining passages therebetween. A cooling fluid flows through the passages, which fluid is substantially transparent to the infrared radiation, such that the infrared radiation from the source passes through the plates and through the fluid in the passages to heat the object. The upper plate is substantially thicker than the lower plate, thus providing the window with mechanical strength sufficient withstand atmospheric pressure when the chamber is evacuated.
摘要翻译：一种用于热处理室的冷却窗组件，其中室中的物体由发射包括红外辐射的辐射的室外的辐射源加热。组件包括在其间限定通道的上部和下部透明板。冷却流体流过通道，该流体基本上对红外辐射是透明的，使得来自源的红外辐射通过板并通过通道中的流体以加热物体。上板基本上比下板更厚，从而为室提供足够的机械强度，当室被抽真空时能承受大气压力。

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