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    • 2. 发明授权
    • Apparatus using hybrid coupled plasma
    • 使用混合耦合等离子体的装置
    • US07442273B2
    • 2008-10-28
    • US10892259
    • 2004-07-14
    • Gi-Chung KwonHong-Young ChangYong-Kwan Lee
    • Gi-Chung KwonHong-Young ChangYong-Kwan Lee
    • C23C16/00C23F1/00H01L21/306
    • H01J37/32174H01J37/32082H01J37/321
    • A hybrid coupled plasma type apparatus includes: a chamber having a gas-injecting unit; an electrostatic chuck in the chamber; an insulating plate over the gas-injecting unit; a high frequency generator; an impedance matching circuit connected to the high frequency generator; first and second antennas connected to the impedance matching circuit in parallel, a power of the high frequency generator being supplied to the first and second antennas; an electrode of a plate shape connected to one of the first and second antennas in serial, the power of the high frequency generator being supplied to the electrode; and a power distributor between the high frequency generator and one of the first and second antennas.
    • 混合耦合等离子体型装置包括:具有气体注入单元的室; 腔室中的静电卡盘; 气体注入单元上的绝缘板; 高频发生器; 连接到高频发生器的阻抗匹配电路; 第一和第二天线并联连接到阻抗匹配电路,高频发生器的功率被提供给第一和第二天线; 连接到第一和第二天线中的一个的板状电极,高频发生器的功率被提供给电极; 以及高频发生器与第一和第二天线之一之间的功率分配器。
    • 3. 发明授权
    • Plasma generation apparatus
    • 等离子体发生装置
    • US07411148B2
    • 2008-08-12
    • US11356947
    • 2006-02-16
    • Gi-Chung KwonSang-Won LeeSae-Hoon UhmJae-Hyun KimBo-Han HongYong-Kwan Lee
    • Gi-Chung KwonSang-Won LeeSae-Hoon UhmJae-Hyun KimBo-Han HongYong-Kwan Lee
    • B23K9/00B23K9/02
    • H01J37/32935H01J37/321H05H1/46
    • A plasma generation apparatus includes: a chamber having a chamber lid and defining an airtight reaction region; a susceptor in the chamber; a gas supplier supplying a process gas to the chamber; and a toroidal core vertically disposed with respect to the susceptor through the chamber lid, including: a toroidal ferromagnetic core combined with the chamber, the toroidal ferromagnetic core having a first portion outside the chamber and a second portion inside the chamber, the second portion having an opening portion; a radio frequency (RF) power supply connected to the chamber; an induction coil electrically connected to the RF power supply, the induction coil rolling the first portion; and a matching circuit matching an impedance between the RF power supply and the induction coil.
    • 等离子体产生装置包括:具有室盖并限定气密反应区域的室; 室内的一个感受器; 供应处理气体的气体供应器; 以及相对于所述基座通过所述室盖垂直设置的环形芯,包括:与所述室结合的环形铁磁芯,所述环形铁磁芯具有在所述室外部的第一部分和所述室内的第二部分,所述第二部分具有 开口部; 连接到所述室的射频(RF)电源; 感应线圈,其电连接到所述RF电源,所述感应线圈滚动所述第一部分; 以及与RF电源和感应线圈之间的阻抗匹配的匹配电路。
    • 4. 发明授权
    • Apparatus for etching substrate and method of etching substrate using the same
    • 用于蚀刻基板的设备和使用其的蚀刻基板的方法
    • US08460469B2
    • 2013-06-11
    • US12395702
    • 2009-03-01
    • Gi-Chung KwonJoung-Sik KimJin Hong
    • Gi-Chung KwonJoung-Sik KimJin Hong
    • C23C16/00C23F1/00H01L21/306
    • H01L31/1804Y02E10/547Y02P70/521
    • An apparatus for etching a substrate includes: a chamber; a susceptor in the chamber, the susceptor including at least one loading portion corresponding to at least one substrate; a gas supply over the susceptor, the gas supply including a hollow and at least one through hole corresponding to the at least one loading portions; and at least one shielding means interposed into the at least one through holes, the at least one shielding means including a body part and a hanging part on the body part, the body part having a cross-sectional area smaller than the at least one through holes, and the hanging part outwardly protruding from the body part, wherein the at least one shielding means is suspended on the gas supply by the hanging part, and wherein the body part shields a central portion of the at least one substrate and exposes an edge portion of the at least one substrate.
    • 一种用于蚀刻衬底的设备包括:腔室; 所述腔室中的基座,所述基座包括对应于至少一个基板的至少一个装载部分; 在所述基座上的气体供应,所述气体供应包括对应于所述至少一个装载部分的中空和至少一个通孔; 以及插入所述至少一个通孔中的至少一个屏蔽装置,所述至少一个屏蔽装置包括在所述主体部分上的主体部分和悬挂部分,所述主体部分的横截面积小于所述至少一个通孔 并且所述悬挂部分从所述主体部分向外突出,其中所述至少一个屏蔽装置通过所述悬挂部分悬挂在所述气体供应器上,并且其中所述主体部分屏蔽所述至少一个基板的中心部分并且暴露出边缘 至少一个基底的部分。
    • 5. 发明授权
    • Plasma generation apparatus
    • 等离子体发生装置
    • US08035056B2
    • 2011-10-11
    • US12111903
    • 2008-04-29
    • Gi-Chung KwonSang-Won LeeSae-Hoon UhmJae-Hyun KimBo-Han HongYong-Kwan Lee
    • Gi-Chung KwonSang-Won LeeSae-Hoon UhmJae-Hyun KimBo-Han HongYong-Kwan Lee
    • B23K10/00
    • H01J37/32935H01J37/321H05H1/46
    • A plasma generation apparatus includes: a chamber having a chamber lid and defining an airtight reaction region; a susceptor in the chamber; a gas supply means supplying a process gas to the chamber; and a toroidal core vertically disposed with respect to the susceptor through the chamber lid, comprising: a toroidal ferromagnetic core combined with the chamber, the toroidal ferromagnetic core having a first portion outside the chamber and a second portion inside the chamber, the second portion having an opening portion; a radio frequency (RF) power supply connected to the chamber; an induction coil electrically connected to the RF power supply, the induction coil rolling the first portion; and a matching circuit matching an impedance between the RF power supply and the induction coil.
    • 等离子体产生装置包括:具有室盖并限定气密反应区域的室; 室内的一个感受器; 向处理室供给处理气体的气体供给装置; 以及相对于所述基座通过所述室盖垂直设置的环形芯,包括:与所述室结合的环形铁磁芯,所述环形铁磁芯具有在所述室外部的第一部分和所述室内的第二部分,所述第二部分具有 开口部; 连接到所述室的射频(RF)电源; 感应线圈,其电连接到所述RF电源,所述感应线圈滚动所述第一部分; 以及与RF电源和感应线圈之间的阻抗匹配的匹配电路。
    • 8. 发明授权
    • Plasma process chamber monitoring method and system used therefor
    • 等离子体处理室监测方法及其使用的系统
    • US06768269B2
    • 2004-07-27
    • US10288129
    • 2002-11-04
    • Gi-Chung KwonHong-Sik ByunYoung-Suk Lee
    • Gi-Chung KwonHong-Sik ByunYoung-Suk Lee
    • H01J724
    • H01J37/32935
    • A plasma process chamber is monitored for excess current while fabricating a semiconductor device. The method includes grounding the plasma process chamber in which fabricating a semiconductor device is conducted using a plasma; detecting a current flowing in a ground line from the plasma process chamber to the ground; interpreting whether the detected current is more than a reference value during fabricating the semiconductor device; and deciding that the plasma process chamber is in an abnormal state when the detected current is more than the reference value. It is thereby possible to produce more stable plasma and the operation of the plasma process chamber is stabilized. Further, the expected life span of the plasma process chamber and other devices is enlarged, and the risk of injuring the operator is prevented.
    • 在制造半导体器件的同时监测等离子体处理室的过电流。 该方法包括使用等离子体接地制造半导体器件的等离子体处理室; 检测从等离子体处理室到地面的在地线中流动的电流; 解释在制造半导体器件期间检测到的电流是否大于参考值; 并且当检测到的电流大于参考值时,判定等离子体处理室处于异常状态。 从而可以产生更稳定的等离子体,并且等离子体处理室的操作是稳定的。 此外,等离子体处理室和其他装置的预期寿命被扩大,并且防止了操作者受伤的风险。