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    • 3. 发明授权
    • Plasma process chamber monitoring method and system used therefor
    • 等离子体处理室监测方法及其使用的系统
    • US06768269B2
    • 2004-07-27
    • US10288129
    • 2002-11-04
    • Gi-Chung KwonHong-Sik ByunYoung-Suk Lee
    • Gi-Chung KwonHong-Sik ByunYoung-Suk Lee
    • H01J724
    • H01J37/32935
    • A plasma process chamber is monitored for excess current while fabricating a semiconductor device. The method includes grounding the plasma process chamber in which fabricating a semiconductor device is conducted using a plasma; detecting a current flowing in a ground line from the plasma process chamber to the ground; interpreting whether the detected current is more than a reference value during fabricating the semiconductor device; and deciding that the plasma process chamber is in an abnormal state when the detected current is more than the reference value. It is thereby possible to produce more stable plasma and the operation of the plasma process chamber is stabilized. Further, the expected life span of the plasma process chamber and other devices is enlarged, and the risk of injuring the operator is prevented.
    • 在制造半导体器件的同时监测等离子体处理室的过电流。 该方法包括使用等离子体接地制造半导体器件的等离子体处理室; 检测从等离子体处理室到地面的在地线中流动的电流; 解释在制造半导体器件期间检测到的电流是否大于参考值; 并且当检测到的电流大于参考值时,判定等离子体处理室处于异常状态。 从而可以产生更稳定的等离子体,并且等离子体处理室的操作是稳定的。 此外,等离子体处理室和其他装置的预期寿命被扩大,并且防止了操作者受伤的风险。
    • 4. 发明授权
    • Wafer susceptor
    • 晶圆座
    • US06683274B1
    • 2004-01-27
    • US10295954
    • 2002-11-18
    • Gi Chung KwonSoo Sik YoonHong Sik Byun
    • Gi Chung KwonSoo Sik YoonHong Sik Byun
    • B23K1000
    • H01L21/67103C23C16/4586C23C16/505H01J37/32082
    • Disclosed is a wafer susceptor which includes: a ceramic body; a RF electrode mounted within the ceramic body; a heater mounted within the ceramic body and spaced apart from the RF electrode by a predetermined distance to be disposed below the RF electrode; and an RF shield of a metal material, the RF shield being electrically grounded and mounted within the ceramic body, the RF shield being disposed between the RF electrode and the heater without being in contact with either the heater or the RF electrode. In case where an RF power is applied to the RF electrode, it is possible to minimize an influence of an RF noise on the heater 24. Accordingly, since the RF power can be applied to the susceptor while heating the susceptor at a high temperature, it is possible to deposit a high-density thin film and also control properties of the thin film such as stress and step coverage. Further, the invention may take the stabilization of the power system.
    • 公开了一种晶片基座,其包括:陶瓷体; 安装在陶瓷体内的RF电极; 安装在陶瓷体内并与RF电极隔开预定距离的加热器,以设置在RF电极下方; 以及金属材料的RF屏蔽层,RF屏蔽层电接地并安装在陶瓷体内,RF屏蔽件设置在RF电极和加热器之间,而不与加热器或RF电极接触。 在向RF电极施加RF功率的情况下,可以使RF噪声对加热器24的影响最小化。因此,由于可以在高温下加热基座的同时向基座施加RF功率, 可以沉积高密度薄膜,并且还可以控制薄膜的性能,例如应力和台阶覆盖。 此外,本发明可以实现电力系统的稳定。