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    • 1. 发明授权
    • Low ohmic through substrate interconnection for semiconductor carriers
    • 用于半导体载体的低欧姆通过衬底互连
    • US08633572B2
    • 2014-01-21
    • US12293101
    • 2007-03-16
    • Gereon VogtmeierRoger SteadmanRalf DorscheidJeroen Jonkers
    • Gereon VogtmeierRoger SteadmanRalf DorscheidJeroen Jonkers
    • H01L29/40
    • H01L21/76898H01L23/481H01L2224/0401H01L2224/05H01L2224/131H01L2924/014
    • It is described a low ohmic Through Wafer Interconnection (TWI) for electronic chips formed on a semiconductor substrate (600). The TWI comprises a first connection extending between a front surface and a back surface of the substrate (600). The first connection (610) comprises a through hole filled with a low ohmic material having a specific resistivity lower than poly silicon. The TWI further comprises a second connection (615) also extending between the front surface and the back surface. The second connection (615) is spatially separated from the first connection (610) by at least a portion of the semiconductor substrate (600). The front surface is provided with a integrated circuit arrangement (620) wherein the first connection (610) is electrically coupled to at least one node of the integrated circuit arrangement (620) without penetrating the integrated circuit arrangement (620). During processing the TWI the through hole may be filled first with a non-metallic material, e.g. poly silicon. After forming integrated components (620) on top of the front surface the substrate (600) may be thinned and the non-metallic material may be substituted with the low ohmic material, which is in particular a metallic material.
    • 描述了形成在半导体衬底(600)上的电子芯片的低欧姆通晶片互连(TWI)。 TWI包括在基板(600)的前表面和后表面之间延伸的第一连接。 第一连接(610)包括填充有低于多晶硅的比电阻率的低欧姆材料的通孔。 TWI还包括也在前表面和后表面之间延伸的第二连接(615)。 第二连接(615)通过半导体衬底(600)的至少一部分在空间上与第一连接(610)分离。 前表面设置有集成电路装置(620),其中第一连接(610)电耦合到集成电路装置(620)的至少一个节点而不穿透集成电路装置(620)。 在处理TWI期间,通孔可以首先用非金属材料填充,例如, 多晶硅。 在前表面顶部形成集成组件(620)之后,可以使衬底(600)变薄并且非金属材料可以被低欧姆材料代替,这是特别是金属材料。
    • 2. 发明申请
    • LOW OHMIC THROUGH SUBSTRATE INTERCONNECTION FOR SEMICONDUCTOR CARRIERS
    • 通过半导体载体的基板互连的低OHMIC
    • US20090079021A1
    • 2009-03-26
    • US12293101
    • 2007-03-16
    • Gereon VogtmeierRoger SteadmanRalf DorscheidJeroen Jonkers
    • Gereon VogtmeierRoger SteadmanRalf DorscheidJeroen Jonkers
    • H01L31/02H01L23/48H01L21/44
    • H01L21/76898H01L23/481H01L2224/0401H01L2224/05H01L2224/131H01L2924/014
    • It is described a low ohmic Through Wafer Interconnection (TWI) for electronic chips formed on a semiconductor substrate (600). The TWI comprises a first connection extending between a front surface and a back surface of the substrate (600). The first connection (610) comprises a through hole filled with a low ohmic material having a specific resistivity lower than poly silicon. The TWI further comprises a second connection (615) also extending between the front surface and the back surface. The second connection (615) is spatially separated from the first connection (610) by at least a portion of the semiconductor substrate (600). The front surface is provided with a integrated circuit arrangement (620) wherein the first connection (610) is electrically coupled to at least one node of the integrated circuit arrangement (620) without penetrating the integrated circuit arrangement (620). During processing the TWI the through hole may be filled first with a non-metallic material, e.g. poly silicon. After forming integrated components (620) on top of the front surface the substrate (600) may be thinned and the non-metallic material may be substituted with the low ohmic material, which is in particular a metallic material.
    • 描述了形成在半导体衬底(600)上的电子芯片的低欧姆通晶片互连(TWI)。 TWI包括在基板(600)的前表面和后表面之间延伸的第一连接。 第一连接(610)包括填充有低于多晶硅的比电阻率的低欧姆材料的通孔。 TWI还包括也在前表面和后表面之间延伸的第二连接(615)。 第二连接(615)通过半导体衬底(600)的至少一部分在空间上与第一连接(610)分离。 前表面设置有集成电路装置(620),其中第一连接(610)电耦合到集成电路装置(620)的至少一个节点而不穿透集成电路装置(620)。 在处理TWI期间,通孔可以首先用非金属材料填充,例如, 多晶硅。 在前表面顶部形成集成组件(620)之后,可以使衬底(600)变薄并且非金属材料可以被低欧姆材料代替,这是特别是金属材料。
    • 4. 发明申请
    • METHOD OF INCREASING THE CONVERSION EFFICIENCY OF AN EUV AND/OR SOFT X-RAY LAMP AND A CORRESPONDING APPARATUS
    • 提高EUV和/或软X射线灯转换效率的方法及相关装置
    • US20090206268A1
    • 2009-08-20
    • US12300858
    • 2007-05-08
    • Jeroen JonkersDominik Marcel Vaudrevange
    • Jeroen JonkersDominik Marcel Vaudrevange
    • G01T1/18G01J3/10
    • H05G2/003H05G2/005
    • The present invention relates to a method of increasing the conversion efficiency of an EUV and/or soft X-ray lamp, in which a discharge plasma (8) emitting EUV radiation or soft X-rays is generated in a gaseous medium formed by an evaporated liquid material in a discharge space, said liquid material being provided on a surface in the discharge space and being at least partially evaporated by an energy beam (9). The invention also refers to a corresponding apparatus for producing EUV radiation and/or soft X-rays. In the method, a gas (11) composed of chemical elements having a lower mass number than chemical elements of the liquid material is supplied through at least one nozzle (10) in a directed manner to the discharge space and/or to the liquid material on a supply path to the discharge space in order to reduce the density of the evaporated liquid material in the discharge space. With the present method and corresponding apparatus the conversion efficiency of the lamp is increased.
    • 本发明涉及一种提高EUV和/或软X射线灯的转换效率的方法,其中在由蒸发的形成的气体介质中产生发射EUV辐射或软X射线的放电等离子体(8) 液体材料在放电空间中,所述液体材料设置在放电空间中的表面上,并被能量束(9)至少部分地蒸发。 本发明还涉及用于产生EUV辐射和/或软X射线的相应装置。 在该方法中,由具有比液体材料的化学元素低的质量数的化学元素构成的气体(11)通过至少一个喷嘴(10)以指向的方式供给到放电空间和/或液体材料 在放电空间的供给路径上,以便减小放电空间中蒸发的液体材料的密度。 利用本方法和相应的装置,灯的转换效率提高。
    • 8. 发明授权
    • EUV-transparent interface structure
    • EUV透明接口结构
    • US06683936B2
    • 2004-01-27
    • US10124035
    • 2002-04-17
    • Jeroen Jonkers
    • Jeroen Jonkers
    • G21K500
    • B82Y10/00G03F7/70033G03F7/70166G03F7/70916G03F7/70933
    • An EUV-transparent interface structure for optically linking a first closed chamber (80) and a second closed chamber (70) whilst preventing a contaminating flow of a medium and/or particles from one chamber to the other comprises an EUV-transparent member (60) in the form of a membrane (60) or a channel structure (100). An EUV-transparent (inert) gas (68) is forced to flow at the side of the member facing the source of contamination (LA; W) and towards the source of contamination to keep the contaminating particles away from the member (60; 100). The interface structure may be arranged between an EUV radiation source (LA) and the illuminator optics (IL) and/or between the projection system (PL) and the resist layer (RL) on top of a substrate (W) in a lithographic projection apparatus.
    • 用于光学连接第一封闭室(80)和第二封闭室(70)同时防止介质和/或颗粒从一个室到另一个室的污染流动的EUV透明界面结构包括EUV透明构件(60 )以膜(60)或通道结构(100)的形式。 EUV透明(惰性)气体(68)被迫在面向污染源(LA; W)的构件的侧面流动并且朝向污染源流动,以使污染的颗粒远离构件(60; 100) )。 接口结构可以布置在EUV辐射源(LA)和照明器光学器件(IL)之间和/或投影系统(PL)和抗蚀剂层(RL)之间,在光刻投影 仪器。