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    • 10. 发明授权
    • Thin multichip flex-module
    • 薄多芯片柔性模块
    • US07429788B2
    • 2008-09-30
    • US11715091
    • 2007-03-07
    • James E. ClaytonZakaryae Fathi
    • James E. ClaytonZakaryae Fathi
    • H01L23/02
    • H05K1/189H01L23/473H01L23/5387H01L25/50H01L2225/06589H01L2924/0002H01L2924/09701H01L2924/3011H05K1/0278H05K1/028H05K3/0064H05K2201/0191H05K2201/056H05K2201/09118H05K2201/09445H05K2201/10159H05K2201/2018H01L2924/00
    • A thin multichip module comprises: a foldable frame comprising two rigid, substantially planar members capable of being folded together about a selected fold axis to form a substantially closed structure; a flex circuit having a plurality of integrated circuit chips disposed thereon, the flex circuit bonded to at least one of the planar members over at least a portion of each of their respective surfaces; and, electrodes on the module configured to be accessible to an external socket after the frame is closed. A method for making a thin multichip module comprises the steps of: a. attaching integrated circuit chips to a flex circuit; b. bonding the flex circuit to a foldable frame comprising two rigid, substantially planar members capable of being folded together about a selected fold axis to form a substantially closed structure; and, c. folding the frame approximately 180° about the fold axis.
    • 薄多芯片模块包括:可折叠框架,其包括两个刚性的基本平坦的构件,其能够围绕选定的折叠轴线折叠在一起以形成基本封闭的结构; 具有设置在其上的多个集成电路芯片的柔性电路,所述柔性电路在其各自表面的每一个的至少一部分上结合到所述平面构件中的至少一个; 并且模块上的电极被配置为在框架关闭之后可以被外部插座访问。 一种制造薄多芯片模块的方法包括以下步骤:a。 将集成电路芯片附接到柔性电路; b。 将柔性电路接合到可折叠框架,该可折叠框架包括两个刚性的基本平坦的构件,能够围绕选定的折叠轴线折叠在一起以形成基本封闭的结构; 和,c。 将框架围绕折叠轴线折叠约180°。