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1. 发明专利

JPH07111383A METHOD FOR MANUFACTURING CIRCUIT BOARD 失效
公开(公告)号：JPH07111383A
公开(公告)日：1995-04-25
申请号：JP27883993
申请日：1993-10-13
申请人： FURUKAWA ELECTRIC CO LTD , FURUKAWA SAAKIT FOIL KK
发明人： OTANI KENICHI , MUGISHIMA TOSHIO , SEKI OSAMU , MATSUKI NOBORU
IPC分类号： H05K3/42
摘要： PURPOSE:To simultaneously performing punching for forming a through hole to be continuous and that to be insulated by depositing a metal plating layer on the conductive polymer layer surface on the wall surface within a first through hole which is not forced to be non-conductive by a non-conductor process. CONSTITUTION:A conductive polymer layer 6 is formed on each inner wall surface of first and second through holes 3 and 4 at a conductivity-giving process for a base 1 made of an insulation material such as plastic with first and second through holes 3 and 4. Then, the surface of the conductive polymer layer 6 formed on the inner wall surface of the second through hole (device hole) 4 in the non-conductor process is turned into non-conductive state and a metal plating layer is deposited on the surface of the conductive polymer layer 6 on the inner wall surface of the first through hole 3 which is not turned into non-conductive state by the non-conductor process in the plating process, thus simultaneously performing punching for forming the through hole 3 and the device hole 4, reducing the number of etchings, and simply manufacturing a circuit board.

2. 发明专利

JPH07111279A FILM CHIP CARRIER AND ITS MANUFACTURE 失效
公开(公告)号：JPH07111279A
公开(公告)日：1995-04-25
申请号：JP27884193
申请日：1993-10-13
申请人： FURUKAWA ELECTRIC CO LTD , FURUKAWA SAAKIT FOIL KK
发明人： SEKI OSAMU , MUGISHIMA TOSHIO , OTANI KENICHI
IPC分类号： H01L21/60 , H01L23/48 , H01L23/50
摘要： PURPOSE:To make it possible to form a stable circuit without dispersion in exposure and developing process, permitting the easy coating of uniform resist and eliminating level differences caused by the different thickness of a metal layer on the surface of a metal wiring layer where the outer leads have a thick film construction. CONSTITUTION:A metal plated layer 9 is adhered to an outer lead portion exposed to an outer lead hole region of a boundary surface to an insulation layer of a metal wiring layer 2 formed on at least one of the surfaces of an insulation layer 1 consisting of a plastic material to which outer lead holes 7 were drilled.

3. 发明专利

JPH0714886A CHIP CARRIER 失效
公开(公告)号：JPH0714886A
公开(公告)日：1995-01-17
申请号：JP17764493
申请日：1993-06-25
申请人： FURUKAWA ELECTRIC CO LTD , FURUKAWA SAAKIT FOIL KK
发明人： OTANI KENICHI , MUGISHIMA TOSHIO , SEKI OSAMU
IPC分类号： H01L21/60 , H05K1/11
摘要： PURPOSE:To enable a metal wiring to be very small in wire width and inter-wire pitch on both an inner lead side and an outer lead side by a method wherein the metal wiring is supported by a first flexible film member at the inner lead side and supported by a second flexible film member at the outer lead side respectively. CONSTITUTION:A metal wiring 1 is supported by a polyimide film 2 as a first flexible film member at an inner lead 1a side making its one side bear against the film 2 and supported by polyimide coating layers 3a to 3d as a second flexible film member at an outer lead 1b side making its other side bear against the polyimide coating layers 3a to 3d. The exposed surface of the inner lead 1a is made to face upward, and on the other hand that of the outer lead 1b is made to face downward. By this setup, metal wirings can be made very small in both wiring width and inter-writing pitch on both an inner lead side and an outer lead side.

4. 发明专利

JPH05206201A SEMICONDUCTOR DEVICE AND ITS MANUFACTURE 失效
公开(公告)号：JPH05206201A
公开(公告)日：1993-08-13
申请号：JP3853792
申请日：1992-01-28
申请人： FURUKAWA ELECTRIC CO LTD , FURUKAWA SAAKITSUTO FOIL KK
发明人： MUGISHIMA TOSHIO , SEKI OSAMU , OTANI KENICHI
IPC分类号： H01L21/60
摘要： PURPOSE:To improve bonding workability and durability of a chip carrier, by arranging a theremally conductive penetration post which penetrates a flexible film part, on the rear side of an inner lead part of metal wiring. CONSTITUTION:Metal wiring 1 is radially arranged in four directions in the manner in which inner lead parts la are positioned inside and outer lead parts 1b are positioned outside. The inner lead parts 1a are bonded to bumps 7 of a semiconductor chip 6, and the outer lead parts 1b are connected with a lead frame, terminal parts of an external circuit board, etc. Coating and exposure of cyclized isoprene rubber are repeated on the surface of a compound tape on which surface metal wiring 1 is formed and on the surface of a flexible tape 2, thereby forming through holes, sprocket holes 5, and outer lead holes 1b. After the wall surface of the through hole is subjected to conduction treatment, the hole is filled by electroplating, and a penetration post 8 is formed. At the time of bonding, a tool is made to abut against the penetration post 8, heat and pressure are applied, and the bump of the chip 6 is bonded to the inner lead part 1a. Sufficient finger strength can be obtained and the metal wiring can be made fine.

5. 发明专利

JPH04345044A MANUFACTURE OF TWO-LAYERED TAB 失效
公开(公告)号：JPH04345044A
公开(公告)日：1992-12-01
申请号：JP11771891
申请日：1991-05-22
申请人： FURUKAWA ELECTRIC CO LTD
发明人： SEKI OSAMU , OTANI KENICHI , MUGISHIMA TOSHIO
IPC分类号： H01L21/60
摘要： PURPOSE:To effectively obtain a two-layered TAB exerting no influence upon heating at the time of semiconductor element mounting, while compensating mechanical strength of inner leads, by performing etching while an outer lead part and a sprocket part are irradiated from the insulating layer side of a two-layered TAB original sheet, with a light having an ultraviolet wavelength region. CONSTITUTION:A two-layered TAB original sheet is obtained by forming a copper layer 11 on a polyimide film 10. After a resist layer 12 is formed on the polyimide film 10, said resist layer 12 is exposed to light by using a photo mask having patterns of a sprocket hole part 30, an inner lead part 31 and an outer lead part 32, and then developed, thus forming a resist mask 13. While the sprocket hole part 30 and the outer lead part 32 are irradiated with ultraviolet rays by using a high pressure mercury lamp, etching is performed. The resist layer 13 is eliminated, and the sprocket hole part 30 and the outer lead part 32 are completely etched, thereby obtaining a two-layered TAB wherein the inner lead part 31 of about 5mum in thickness is left.

6. 发明专利

JPH02112248A MANUFACTURE OF TAPE CARRIER 失效
公开(公告)号：JPH02112248A
公开(公告)日：1990-04-24
申请号：JP26417588
申请日：1988-10-21
申请人： FURUKAWA ELECTRIC CO LTD
发明人： KUMAZAWA KINYA , SEKI OSAMU
IPC分类号： H01L21/60 , H05K1/03 , H05K3/00
摘要： PURPOSE:To reduce a manufacturing cost by decreasing the number of processes and securely remove impurity ions by treating a silver foil using a plasma by means of a non-oxidizing gas and by disposing a device hole and sprocket holes after boring them by exposing and developing selectively a resin layer itself after using a photosensitive polyimide resin. CONSTITUTION:After treating the surface of an electrolytic copper foil 1 with AC plasma by means of a non-oxidizing gas, a photosensitive polyimide resin precursory substance solution is applied on the above surface treated using a plasma through a screen printing process to form a double layer substrate. Subsequently, a photoresist 3 is applied on the surface of the foregoing copper foil 1. After drying it, it is exposed and developed by using a photomask for forming a conductor pattern and after that, the copper foil 1 is etched to form the conductor pattern. Then a photomask for making a device hole and sprocket holes is placed on the faces of the conductor pattern and a photosensitive polyimide resin 2 and then, its resin 2 is exposed selectively and its development is obtained. In this way, the device hole 4 and sprocket holes 5 are bored and disposed after removing unnecessary parts.

7. 发明专利

JPH01214096A MANUFACTURE OF FLEXIBLE PRINTED CIRCUIT BOARD 失效
公开(公告)号：JPH01214096A
公开(公告)日：1989-08-28
申请号：JP3904688
申请日：1988-02-22
申请人： FURUKAWA ELECTRIC CO LTD
发明人： KUMAZAWA KINYA , SEKI OSAMU , YAMANAKA NOBUMITSU , KOMATSU MASAYA
IPC分类号： H05K3/38
摘要： PURPOSE:To obtain a board with excellent contact and having excellent dimensional stability by processing the surface of a film made of liquid crystal polymer or a sheet board using low temperature plasma of oxidizing gas under a specific pressure, and then by forming a conductive layer on the surface thereof by physical deposition. CONSTITUTION:One or both surfaces of a film made of liquid crystal polymer or a sheet board 1 is processed by low temperature plasma of oxidizing gas in pressures of 10 Torr-10Torr. Then, a conductive layer 2 is formed on the processed surface by physical deposition. For example, liquid crystal polymer film 1 (polyester copolymer containing parahydroxy benzoic acid) of 50mum thick is set in a sputtering device having a plasma processing mechanism. After the device is discharged fully, oxygen gas is introduced to process by plasma for ten seconds at a gas pressure of 3X10 Torr and at a high-frequency power of 100W. After this, argon gas is introduced inside the device. Copper is sputtered for 120sec. at a gas pressure of 3X10 Torr and a high-frequency power of 100W, forming the conductive layer 2 of 1mum on the film 1.

8. 发明专利

JPH01205495A MANUFACTURE OF FLEXIBLE PRINTED CIRCUIT BOARD 失效
公开(公告)号：JPH01205495A
公开(公告)日：1989-08-17
申请号：JP2980688
申请日：1988-02-10
申请人： FURUKAWA ELECTRIC CO LTD
发明人： SEKI OSAMU , KOMATSU MASAYA , YAMANAKA NOBUMITSU , KUMAZAWA KINYA
IPC分类号： H05K3/02 , H05K3/04
摘要： PURPOSE:To form a flexible printed circuit board with a conductor circuit whose edge section is sharp in shape and high in dimensional accuracy, by a method wherein the thickness of a resist film is not less than ten times as large as the film thickness of a metallic thin-film of the conductor circuit which is attachedly formed. CONSTITUTION:An unnecessary section for shaping a conductor circuit pattern on the surface of a plastic film substrate 1 is coated with a resist 2, and desired metals 3, 4 are attached onto the surface of the substrate through a physical evaporation method. When the conductor circuit pattern is formed by peeling a resist film, the film thickness of the resist film is not less than ten times as large as the film thickness of an attachedly formed metallic film for a conductor circuit. Accordingly, the metallic film 3 bonded and formed onto the resist film 2 as a mask and the metallic film (a conductor layer) 4 on a film as the conductor circuit are not continued, thus acquiring a conductor circuit layer, an edge section of which is sharpened, after peeling the resist film.

9. 发明专利

JPH01147055A MANUFACTURE OF METAL-COATED PLASTIC FILM 失效
公开(公告)号：JPH01147055A
公开(公告)日：1989-06-08
申请号：JP30629987
申请日：1987-12-03
申请人： FURUKAWA ELECTRIC CO LTD
发明人： KUMAZAWA KINYA , KOMATSU MASAYA , YAMANAKA NOBUMITSU , SEKI OSAMU
IPC分类号： C23C14/24 , C23C14/20
摘要： PURPOSE:To improve the surface smoothness of a metal-coated film by forming a thin metallic film layer of the desired thickness on the surface of a plastic film by the PVD method and then forming a thin metallic film layer on the above at low vapor deposition velocity. CONSTITUTION:Plasma treatment is applied to a plastic film 1 to form a plasma treated layer 2. Then, a thin metallic film layer 3 of the desired thickness is formed at a vapor deposition rate of >=0.1mum/min by a PVD method. Successively, vapor deposition is carried out at a vapor deposition rate as low as

10. 发明专利

JP2542428B2 失效
公开(公告)号：JP2542428B2
公开(公告)日：1996-10-09
申请号：JP23848988
申请日：1988-09-22
申请人： FURUKAWA ELECTRIC CO LTD
发明人： KUMAZAWA KINYA , SEKI OSAMU , SHIBUYA SEIJI
IPC分类号： H05K3/06 , H05K3/00

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