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1. 发明专利

JPH0287589A MANUFACTURE OF FLEXIBLE DOUBLE-SIDED PRINTED CIRCUIT BOARD 失效
公开(公告)号：JPH0287589A
公开(公告)日：1990-03-28
申请号：JP23848988
申请日：1988-09-22
申请人： FURUKAWA ELECTRIC CO LTD
发明人： KUMAZAWA KINYA , SEKI OSAMU , SHIBUYA SEIJI
IPC分类号： H05K3/06 , H05K3/00
摘要： PURPOSE:To provide a flexible double-sided printed circuit board having a large electric capacity without deteriorating adhesion or flexibility by bonding a metallic conductor foil on one side of a plastic film to provide a flexible single-sided printed circuit board, forming a metallic conductor film by a vapor deposition means on the side of the flexible single-sided printed circuit board having no metallic conductor film and further forming another metallic conductor film thereon by an electrochemical means. CONSTITUTION:A flexible single-sided printed circuit board 11 consists of a plastic film 12 and a metallic conductor foil 14 bonded to one side of the film 12 by means of an adhesive 13. On the other side of the plastic film 12, there is formed a metallic conductor film 15 having a thickness in the range of 0.1 to 0.5mum by means of a physical metal vapor deposition(PVD) means. For the PVD means, sputtering, ion plating, ion cluster beam, or the like is used. On the metallic conductor foil 15, there is formed a metallic conductor layer 16 having a thickness of 1 to 10mum by means of an electrochemical metal coating means. As a result, a flexible double-sided printed circuit board 17 is obtained. Power supplying or grounding circuit patterns 18 requiring a large current capacity are formed on the side that had the metallic conductor foil 14 while fine circuit patterns 19 associated with signals requiring a small current capacity are formed on the other side that had the metallic conductor layer 16.

2. 发明专利

JPH01195269A METAL-COATED PLASTIC FILM 失效
公开(公告)号：JPH01195269A
公开(公告)日：1989-08-07
申请号：JP1725388
申请日：1988-01-29
申请人： FURUKAWA ELECTRIC CO LTD
发明人： KOMATSU MASAYA , KUMAZAWA KINYA , YAMANAKA NOBUMITSU , SEKI OSAMU
IPC分类号： C23C14/06 , C23C14/14 , C23C14/16 , C23C14/20
摘要： PURPOSE:To form a metallic film excellent in adhesive strength and oxidation resistance with high productivity by forming a thin metallic-film layer of the desired film thickness provided between the thin metallic-film layers formed by a sputtering method on the surface of a plastic film by a vacuum vapor deposition method. CONSTITUTION:A primary thin metallic-film layer 1 of Cu, etc., is directly formed on a plastic film 5 at least to 5Angstrom : film thickness, by a sputtering method. Subsequently, a thin metallic-film layer 2 of the desired film thickness is efficiently formed on the above primary thin metallic-film layer 1 by a vacuum vapor deposition method. Successively, a secondary thin metallic-film layer 3 of Cu, etc., of at least 50Angstrom film thickness is formed on the outermost surface of the above thin metallic-film layer 2 by a sputtering method. By this method, a metallic coating composed of a thin metallic-film 4 in which the adhesive strength of the thin metallic-film layer 2 to the plastic film 5 is improved by means of the above primary thin metallic-film layer 1 and also resistance to moisture and heat is improved by means of the above secondary thin metallic- film layer 3 can be formed.

3. 发明专利

JPS6412596A MANUFACTURE OF FLEXIBLE PRINTED SUBSTRATE 失效
公开(公告)号：JPS6412596A
公开(公告)日：1989-01-17
申请号：JP16841687
申请日：1987-07-06
申请人： FURUKAWA ELECTRIC CO LTD
发明人： KUMAZAWA KINYA , KOMATSU MASAYA , YAMANAKA NOBUMITSU
IPC分类号： H05K3/16
摘要： PURPOSE:To obtain a flexible substrate by a method wherein one or both surfaces of a plastic film are subjected to a low temperature plasma treatment in O2 or gas containing O2 and then a conductor thin film is formed by a sputtering method with a composite copper target containing 1-15wt.% of one of Ni, Cr, Ti, Al, Ag, Fe, Zn and Sn or alloy composed of two or more of them. CONSTITUTION:A plastic film such as a polyethylene terephthalate film is subjected to a low temperature plasma treatment in O2, CO2 or Ar or N2 containing O2 and the surface is subjected to a fine etching to clean and to form functional groups such as -CO, -COOH and -OH and the adhesiveness of the film surface is improved. Then a conductor thin film is formed by a sputtering method with a composite copper target containing 1-15wt.% of one of Ni, Cr, Ti, Al, Ag, Fe, Zn and Sn which are highly corrosion-resistant and form mixed crystal or eutectic easily or alloy composed of two or more of them, especially with a target thin film containing 5-10wt.% of Ni and Cr. With this constitution, a flexible substrate with excellent corrosion-resistant properties can be obtained without degrading other properties.

4. 发明专利

JPS61120491A Formation of circuit on ceramic substrate 失效
标题翻译：在陶瓷基板上形成电路
公开(公告)号：JPS61120491A
公开(公告)日：1986-06-07
申请号：JP24076884
申请日：1984-11-16
申请人： Furukawa Electric Co Ltd
发明人： HORIGUCHI MASAO , KUMAZAWA KINYA , YAMANAKA NOBUMITSU , NOJIRI AKIO
IPC分类号： H05K3/12 , C04B41/88 , H05K1/09 , H05K3/06
CPC分类号： H05K1/092 , H05K3/06

5. 发明专利

JPS6164011A Method of producing tape wire 失效
标题翻译：生产胶带的方法
公开(公告)号：JPS6164011A
公开(公告)日：1986-04-02
申请号：JP18508784
申请日：1984-09-04
申请人： Furukawa Electric Co Ltd
发明人： HORIGUCHI MASAO , KUMAZAWA KINYA , YAMANAKA NOBUMITSU , NOJIRI AKIO
IPC分类号： H01B13/00

6. 发明专利

JP2542428B2 失效
公开(公告)号：JP2542428B2
公开(公告)日：1996-10-09
申请号：JP23848988
申请日：1988-09-22
申请人： FURUKAWA ELECTRIC CO LTD
发明人： KUMAZAWA KINYA , SEKI OSAMU , SHIBUYA SEIJI
IPC分类号： H05K3/06 , H05K3/00

7. 发明专利

JPS6452335A MANUFACTURE OF OXIDE SUPERCONDUCTOR THIN FILM 失效
公开(公告)号：JPS6452335A
公开(公告)日：1989-02-28
申请号：JP20783087
申请日：1987-08-21
申请人： FURUKAWA ELECTRIC CO LTD
发明人： KOMATSU MASAYA , KUMAZAWA KINYA
IPC分类号： C23C14/02 , C23C14/08 , H01B12/06 , H01B13/00 , H01L39/24 , H05K1/09 , H05K3/16
摘要： PURPOSE:To form an oxide superconductor thin film with excellent superconductive characteristic on a plastic film by forming the oxide superconductor thin film via a similar intermediate layer then firing it while cooling the plastic film. CONSTITUTION:An oxide superconductor thin film is formed on a plastic film 4, then the oxide superconductor thin film is fired by a heater 8 while the plastic film 4 is cooled, thus the firing in the atmosphere containing oxygen can be performed at a sufficiently high temperature. If the oxide superconductor thin film is formed on the plastic film 4 via an intermediate layer with the lattice constant and/or thermal expansion coefficient similar to that of the oxide superconductor thin film, no lattice distortion is generated when a ceramic thin film is grown on the plastic film 4. The oxide superconductor thin film with excellent superconductive characteristic can be thereby formed on the plastic film.

8. 发明专利

JPS63303058A PRODUCTION OF METAL COATED PLASTIC FILM 失效
公开(公告)号：JPS63303058A
公开(公告)日：1988-12-09
申请号：JP13896187
申请日：1987-06-04
申请人： FURUKAWA ELECTRIC CO LTD
发明人： KUMAZAWA KINYA , YAMANAKA NOBUMITSU , KOMATSU MASAYA
IPC分类号： B32B15/082 , B32B15/08 , C23C14/20 , C23C14/58
摘要： PURPOSE:To produce a metal coated plastic film having superior adhesion by adhering a thin metal film on one side of a plastic film and subjecting the other side to surface fluorination treatment with low temp. plasma. CONSTITUTION:A thin film of a desired metal or alloy is adhered to one side of a plastic film such as a film of PE, PP or polyimide by physical vapor deposition. The other side is then subjected to surface fluorination treatment with low temp. plasma of a fluorine-contg. gas such as F2, CF4 or SF6 under 10Torr pressure to obtain a metal coated plastic film having very low gas permeability. Even when the film is allowed to stand in a hot humid gas over a long period, exfoliation is not caused on the interface between the metal film and the base plastic film.

9. 发明专利

JPS6357762B2 失效
公开(公告)号：JPS6357762B2
公开(公告)日：1988-11-14
申请号：JP8297783
申请日：1983-05-12
申请人： FURUKAWA ELECTRIC CO LTD
发明人： SHIRASAKA ARIO , FUSE KENICHI , KOKAYU MIKIO , KUMAZAWA KINYA
IPC分类号： G02B6/44

10. 发明专利

JPS63121651A PLASMA TREATMENT OF BASE MATERIAL 失效
公开(公告)号：JPS63121651A
公开(公告)日：1988-05-25
申请号：JP26683286
申请日：1986-11-10
申请人： FURUKAWA ELECTRIC CO LTD
发明人： KUMAZAWA KINYA , HORIGUCHI MASAO , KOMATSU MASAYA
IPC分类号： C23C14/02
摘要： PURPOSE:To obtain a base body material having high adhesiveness to metals, etc., by introducing a gaseous mixture having a specific compsn. composed of an active gas and inert gas into a vacuum, converting the same to plasma and treating the base body material by the ions in said plasma. CONSTITUTION:The gas introduced into the vacuum is converted to the plasma and the base body material such as plastic film is treated by the ions in said plasma, by which the adhesive power is improved. The gaseous mixture composed of the active gas and inert gas is used as the above-mentioned gas at this time and the ratio of the active gas in the gaseous mixture is set at 1-20mol%. The thin metallic film securely adhered to the above-mentioned base body material is thereby formed. Gaseous Ar or gaseous He alone or the mixture composed thereof is adequate as said inert gas. Independent gases such as O2, N2, CO2, CO, and CF4 or the mixtures composed thereof are used for said active gas.

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