专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2005101038A3 WIRELESS TEST CASSETTE 审中-公开
标题翻译：无线测试CASSETTE
公开(公告)号：WO2005101038A3
公开(公告)日：2005-12-15
申请号：PCT/US2005011849
申请日：2005-04-08
申请人： FORMFACTOR INC , ELDRIDGE BENJAMIN N , KHANDROS IGOR Y , MILLER CHARLES A , SPORCK NICHOLAS A
发明人： ELDRIDGE BENJAMIN N , KHANDROS IGOR Y , MILLER CHARLES A , SPORCK NICHOLAS A
IPC分类号： G01R1/073 , G01R31/02 , G01R31/26
CPC分类号： G01R1/0491 , G01R1/073 , G01R31/3025
摘要： A base controller (210) disposed in a test cassette (110) receives test data for testing a plurality of electronic devices (236a,236b). The base controller wirelessly transmits the test data to a plurality of wireless test control chips (214a,214b,214c,214d,214e,214f,214g), which write the test data to each of the electronic devices. The wireless test control chips (214a,214b,214c,214d,214e,214f,214g), then read response data generated by the electronic devices (236a, 236b), and the wireless test control chips wirelessly transmit the response data to the base controller (210).
摘要翻译：设置在测试盒（110）中的基本控制器（210）接收用于测试多个电子设备（236a，236b）的测试数据。基站控制器将测试数据无线发送到多个无线测试控制芯片（214a，214b，214c，214d，214e，214f，214g），其将测试数据写入每个电子设备。无线测试控制芯片（214a，214b，214c，214d，214e，214f，214g）然后读取由电子设备（236a，236b）产生的响应数据，并且无线测试控制芯片将响应数据无线地发送到基站控制器（210）。

2. 发明申请

WO2007035664A3 APPARATUS AND METHOD OF TESTING SINGULATED DIES 审中-公开
标题翻译：装置和测试方法
公开(公告)号：WO2007035664A3
公开(公告)日：2009-04-30
申请号：PCT/US2006036336
申请日：2006-09-18
申请人： FORMFACTOR INC , DOZIER II THOMAS H , ELDRIDGE BENJAMIN N , HSU DAVID S , KHANDROS IGOR Y , MILLER CHARLES A
发明人： DOZIER II THOMAS H , ELDRIDGE BENJAMIN N , HSU DAVID S , KHANDROS IGOR Y , MILLER CHARLES A
IPC分类号： G01R31/02
CPC分类号： G01R31/2889 , G01R31/2893 , G01R31/31905
摘要： An exemplary die carrier is disclosed. In some embodiments, the die carrier can hold a plurality of singulated dies while the dies are tested. The dies can be arranged on the carrier in a pattern that facilities testing the dies. The carrier can be configured to allow interchangeable interfaces to different testers to be attached to and detached from the carrier. The carrier can also be configured as a shipping container for the dies.
摘要翻译：公开了一种示例性的模具载体。在一些实施例中，模具载体可以在测试模具的同时保持多个单个模具。模具可以以对模具进行测试的模式布置在载体上。载体可以被配置为允许不同的测试仪的可互换的接口被附接到载体上并与载体分离。载体也可以被配置为模具的运输容器。

3. 发明申请

WO2007081522A3 A PROBE ARRAY STRUCTURE AND A METHOD OF MAKING A PROBE ARRAY STRUCTURE 审中-公开
标题翻译：探索阵列结构和制作探测阵列结构的方法
公开(公告)号：WO2007081522A3
公开(公告)日：2009-02-12
申请号：PCT/US2006048723
申请日：2006-12-19
申请人： FORMFACTOR INC , ELDRIDGE BENJAMIN N , FANG TRELIANT , GRITTERS JOHN K , KHANDROS IGOR Y , MA LUNYU , MATHIEU GAETAN L
发明人： ELDRIDGE BENJAMIN N , FANG TRELIANT , GRITTERS JOHN K , KHANDROS IGOR Y , MA LUNYU , MATHIEU GAETAN L
IPC分类号： G01R31/02
CPC分类号： G01R3/00 , G01R1/06716 , G01R1/06727 , G01R1/06744
摘要： Probe array structures and methods of making probe array structures are disclosed. A plurality of electrically conductive elongate contact structures disposed on a first substrate can be provided. The contact structures can then be partially encased in a securing material such that ends of the contact structures extend from a surface of the securing material. The exposed portions of the contact structures can then be captured in a second substrate.
摘要翻译：公开了探针阵列结构和制造探针阵列结构的方法。可以提供设置在第一基板上的多个导电细长接触结构。然后可以将接触结构部分地包封在固定材料中，使得接触结构的端部从固定材料的表面延伸。然后接触结构的暴露部分可以在第二衬底中被捕获。

4. 发明申请

WO9638858A3 CONTACT CARRIERS (TILES) FOR POPULATING LARGER SUBSTRATES WITH SPRING CONTACTS 审中-公开
标题翻译：联系人（TILES）用于具有弹簧触点的人口大型基底
公开(公告)号：WO9638858A3
公开(公告)日：1997-03-20
申请号：PCT/US9608117
申请日：1996-05-24
申请人： FORMFACTOR INC , KHANDROS IGOR Y , ELDRIDGE BENJAMIN N , MATHIEU GAETEAN L , DOZIER THOMAS H , SMITH WILLIAM D
发明人： KHANDROS IGOR Y , ELDRIDGE BENJAMIN N , MATHIEU GAETEAN L , DOZIER THOMAS H , SMITH WILLIAM D
IPC分类号： B23K20/00 , C23C18/16 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/067 , G01R1/073 , G01R3/00 , G01R31/28 , H01L21/00 , H01L21/48 , H01L21/56 , H01L21/60 , H01L21/603 , H01L21/66 , H01L21/68 , H01L23/48 , H01L23/485 , H01L23/49 , H01L23/498 , H01L25/065 , H01L25/16 , H01R33/76 , H05K1/14 , H05K3/20 , H05K3/32 , H05K3/40 , H01L
CPC分类号： B23K20/004 , B23K2201/40 , C25D5/08 , C25D5/22 , C25D21/02 , G01R1/06711 , G01R1/06716 , G01R1/06744 , G01R1/07342 , G01R3/00 , G01R31/2884 , G01R31/2886 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L22/20 , H01L23/49811 , H01L24/11 , H01L24/13 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/13099 , H01L2224/131 , H01L2224/16145 , H01L2224/45144 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/0001 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1532 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H05K1/141 , H05K3/20 , H05K3/326 , H05K3/4015 , H01L2924/00
摘要： A plurality of contact elements, such as contact bumps or free-standing spring contacts (710) including both monolithic and composite interconnection elements, are mounted to relatively small tile substrates (702) which, in turn, are mounted and connected to a relatively large electronic component substrate (706), thereby populating the electronic component with a plurality of contact elements while avoiding the necessity of yielding the contact elements directly upon the electronic component. The relatively large electronic component is suitably a space transformer component of a probe card assembly. In this manner, pressure connections can be made to an entire semiconductor wafer, at once, to provide for wafer-level bum-in, and the like. Solder balls, z-axis conductive adhesive, or compliant connections are suitably employed for making electrical connections between the tile substrates and the electronic component. Multiple die sites on a semiconductor wafer are readily probed using the disclosed techniques, and the tiles can be arranged to optimize probing of an entire wafer. Composite interconnection elements having a relatively soft core overcoated by a relatively hard shell, as the resilient contact structures are described. Techniques for maintaining a prescribed x-y and z-axis alignment of the tiles to the relatively large substrate are disclosed.

5. 发明申请

WO2006068939A3 REMOTE TEST FACILITY WITH WIRELESS INTERFACE TO LOCAL TEST FACILITIES 审中-公开
标题翻译：远程测试设施与无线接口到本地测试设备
公开(公告)号：WO2006068939A3
公开(公告)日：2006-12-28
申请号：PCT/US2005045611
申请日：2005-12-15
申请人： FORMFACTOR INC , KHANDROS IGOR Y , ELDRIDGE BENJAMIN N
发明人： KHANDROS IGOR Y , ELDRIDGE BENJAMIN N
IPC分类号： G01R31/26 , G01R31/28
CPC分类号： G01R31/2884 , G01R31/3025 , G01R31/31907
摘要： A central test facility transmits wirelessly test data to a local test facility, which tests electronic devices using the test data. The local test facility transmits wirelessly response data generated by the electronic devices back to the central test facility, which analyzes the response data to determine which electronic devices passed the testing. The central test facility may provide the results of the testing to other entities, such as a design facility where the electronic devices were designed or a manufacturing facility where the electronic devices where manufactured. The central test facility may accept requests for test resources from any of a number of local test facilities, schedule test times corresponding to each test request, and at a scheduled test time, wirelessly transmits test data to a corresponding local test facility.
摘要翻译：中央测试设备将无线测试数据传输到本地测试设备，该设备使用测试数据测试电子设备。本地测试设施将由电子设备生成的无线响应数据发送回中央测试设施，中央测试设施分析响应数据以确定哪些电子设备通过了测试。中央测试设施可以将测试结果提供给其他实体，例如设计电子设备的设计设施或制造电子设备的制造设施。中央测试设施可以接受来自多个本地测试设施中的任何一个的测试资源的请求，调度对应于每个测试请求的测试时间，并且在预定的测试时间，将测试数据无线传输到相应的本地测试设施。

6. 发明申请

WO9900844A3 SOCKETS FOR SEMICONDUCTOR DEVICES WITH SPRING CONTACT ELEMENTS 审中-公开
标题翻译：具有弹簧触点元件的半导体器件插座
公开(公告)号：WO9900844A3
公开(公告)日：1999-04-29
申请号：PCT/US9813692
申请日：1998-06-30
申请人： FORMFACTOR INC , DOZIER THOMAS H II , ELDRIDGE BENJAMIN N , GRUBE GARY W , KHANDROS IGOR Y , MATHIEU GAETAN L , PEDERSEN DAVID V , STADT MICHAEL A
发明人： DOZIER THOMAS H II , ELDRIDGE BENJAMIN N , GRUBE GARY W , KHANDROS IGOR Y , MATHIEU GAETAN L , PEDERSEN DAVID V , STADT MICHAEL A
IPC分类号： G01R1/04 , H01L23/04 , H01L23/13 , H01L23/32 , H01L23/48 , H01L23/538 , H05K3/30 , H05K3/32
CPC分类号： G01R1/0408 , B23K3/087 , G01R1/0416 , G01R1/0466 , G01R31/2886 , H01L23/04 , H01L23/13 , H01L23/32 , H01L23/5385 , H01L24/72 , H01L2224/1134 , H01L2224/13099 , H01L2224/16 , H01L2224/16237 , H01L2224/73251 , H01L2224/8114 , H01L2224/81901 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01078 , H01L2924/01079 , H05K1/119 , H05K3/308 , H05K3/325 , H05K2201/0311 , H05K2201/09472 , H05K2201/09827 , Y10T29/49128 , Y10T29/4913 , Y10T29/49139 , Y10T29/4914 , Y10T29/49147 , Y10T29/49153 , Y10T29/49208 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , H01L2924/00014 , H01L2224/72
摘要： Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.
摘要翻译：通过迫使电子元件，因此弹簧接触元件的端部竖直地抵靠互连基板的端子，或者通过水平地推动互连基板的端子来形成从诸如半导体器件的电子部件延伸的弹簧接触元件的临时连接抵靠弹簧接触元件的端部。公开了各种终端配置。

7. 发明申请

WO2006002046A3 MECHANICALLY RECONFIGURABLE VERTICAL TESTER INTERFACE FOR IC PROBING 审中-公开
标题翻译：用于IC探测的机械可重构垂直测试界面
公开(公告)号：WO2006002046A3
公开(公告)日：2006-05-18
申请号：PCT/US2005020949
申请日：2005-06-15
申请人： FORMFACTOR INC , ELDRIDGE BENJAMIN N , VASQUEZ BARBARA , SHINDE MAKARAND S , MATHIEU GAETAN L , SPORCK NICHOLAS A
发明人： ELDRIDGE BENJAMIN N , VASQUEZ BARBARA , SHINDE MAKARAND S , MATHIEU GAETAN L , SPORCK NICHOLAS A
IPC分类号： H01R11/18 , G01R1/04 , G01R1/073 , G01R31/28
CPC分类号： G01R31/2889 , G01R1/0416 , G01R1/07307
摘要： A wafer test assembly includes multiple probe head substrates arranged like tiles with connectors attached to one side and probes supported on the opposing side. In one embodiment, flexible cable connectors directly connect the connectors on the probe head tile to a test head, while in another embodiment the flexible cables connect the probe head tile to a PCB providing horizontal routing to test head connectors. In one embodiment, leveling pins provide a simplified support structure connecting to a retaining element attached to the tiles to provide for applying a push-pull leveling force. A test head connector interface frame enables rearrangement of connectors between the test head and the probe card to provide for both full wafer contact or partial wafer contact. The test head connectors are rearranged by being slidable on rails, or pluggable and unpluggable enabling movement over a range of positions.
摘要翻译：晶片测试组件包括多个探针头基板，其布置为像瓷砖一样的连接器和支撑在相对侧的探针。在一个实施例中，柔性电缆连接器直接将探头磁贴上的连接器连接到测试头，而在另一实施例中，柔性电缆将探头磁头连接到提供水平布线到测试头连接器的PCB。在一个实施例中，调平销提供了简化的支撑结构，该支撑结构连接到附接到瓷砖的保持元件以提供施加推拉调平力。测试头连接器接口框架可重新布置测试头和探针卡之间的连接器，以提供全晶片接触或部分晶片接触。测试头连接器通过可滑动的轨道进行重新布置，或者可插拔和不可插拔，从而可在一系列位置上移动。

8. 发明申请

WO2007146582A3 AC COUPLED PARAMETRIC TEST PROBE 审中-公开
标题翻译：交流耦合参数测试探头
公开(公告)号：WO2007146582A3
公开(公告)日：2009-03-19
申请号：PCT/US2007069806
申请日：2007-05-25
申请人： FORMFACTOR INC , MILLER CHARLES A , SPORCK A NICHOLAS , ELDRIDGE BENJAMIN N
发明人： MILLER CHARLES A , SPORCK A NICHOLAS , ELDRIDGE BENJAMIN N
IPC分类号： G01R31/02
CPC分类号： G01R1/06711 , G01R1/06727 , G01R1/07 , G01R31/3025
摘要： A probe for contacting and testing ICs on a semiconductor device includes a dielectric insulating material tip. The dielectric tip does not contaminate the surface being probed unlike metal probe tips. A contact scrub is further not required with signals being capacitively or inductively coupled from the probe tip to the IC. Testing can be performed during early fabrication steps of the wafer without the need for applying a metalization layer to the wafer to form bond pads. Testing can be performed by inductively coupling an AC signal to the probe tip, with coupling enhanced by including a magnetic material in the dielectric probe tip. Using an AC test signal enables testing of ICs without requiring separate power and ground connections.
摘要翻译：用于在半导体器件上接触和测试IC的探针包括介电绝缘材料尖端。与金属探针尖端不同，电介质尖端不会污染被探测的表面。进一步不需要接触擦洗，信号从探头尖端到IC电容或电感耦合。可以在晶片的早期制造步骤期间进行测试，而不需要将金属化层施加到晶片以形成接合焊盘。可以通过将AC信号电感耦合到探针尖端来进行测试，通过在介电探针尖端中包括磁性材料来增强耦合。使用AC测试信号可以测试IC，而不需要单独的电源和接地连接。

9. 发明申请

WO03001223A3 HIGH DENSITY PLANAR ELECTRICAL INTERFACE 审中-公开
标题翻译：高密度平面电气接口
公开(公告)号：WO03001223A3
公开(公告)日：2003-05-30
申请号：PCT/US0219347
申请日：2002-06-18
申请人： FORMFACTOR INC , ELDRIDGE BENJAMIN N , MILLER CHARLES A
发明人： ELDRIDGE BENJAMIN N , MILLER CHARLES A
IPC分类号： G01R1/04 , G01R1/067 , G01R1/073 , G01R31/26 , H01B1/00
CPC分类号： G01R1/0466 , H01R13/025 , H01R13/40 , H01R2201/20
摘要： An apparatus including a substrate having a plurality of through holes and a plurality of cables, including wires and/or coaxial cables, extending through respective ones of the plurality of through holes of the substrate. Each of the cables comprises a conductor and terminates about a surface of the substrate such that the conductors of respective ones of plurality of cables are planarly aligned and available for electrical contact. A system including a cable interface extending through respective ones of a plurality of through holes of a body of the interface; an interconnection component comprising a first plurality of contact points aligned with respective ones of conductors of the plurality of cables and a second plurality of contact points aligned to corresponding contact points of a device to be tested. Also, a method of routing signals through the conductors of the plurality of cables between electronic components.
摘要翻译：一种设备，包括具有多个通孔的基板和包括电线和/或同轴电缆的多根电缆，延伸穿过基板的多个通孔中的相应的通孔。每个电缆包括导体并围绕基板的表面终止，使得多个电缆中的相应电缆的导体平面对准并且可用于电接触。一种系统，包括延伸穿过所述界面的主体的多个通孔中的相应一个的电缆接口; 互连部件，其包括与所述多根电缆中的相应导体对准的第一多个接触点以及与要测试的设备的相应接触点对准的第二多个接触点。而且，一种通过电子部件之间的多根电缆的导线路由信号的方法。

10. 发明申请

WO2008070466A3 SHARING RESOURCES IN A SYSTEM FOR TESTING SEMICONDUCTOR DEVICES 审中-公开
标题翻译：在测试半导体器件的系统中共享资源
公开(公告)号：WO2008070466A3
公开(公告)日：2008-11-06
申请号：PCT/US2007085483
申请日：2007-11-25
申请人： FORMFACTOR INC , CHRAFT MATTHEW E , ELDRIDGE BENJAMIN N , HENSON ROY J , SPORCK A NICHOLAS
发明人： CHRAFT MATTHEW E , ELDRIDGE BENJAMIN N , HENSON ROY J , SPORCK A NICHOLAS
IPC分类号： G01R31/02
CPC分类号： G01R31/31926 , G01R31/318511
摘要： Probes in a plurality of DUT probe groups can be connected in parallel to a single tester channel. In one aspect, digital potentiometers can be used to effectively switch the tester channel from a probe in one DUT probe group to a probe in another DUT probe group. In another aspect, switches in parallel with a resistor can accomplish such switching. In yet another aspect, a chip select terminal on each DUT can be used to effectively connect and disconnect internal DUT circuitry to the tester channel. Multiple DUT probe groups so connected can be used to create different patterns of DUT probe groups for testing different patterns of DUTs and thus facilitate sharing tester channels.
摘要翻译：多个DUT探针组中的探针可以并行连接到单个测试器通道。在一个方面，可以使用数字电位计来有效地将测试器通道从一个DUT探针组中的探针切换到另一个DUT探针组中的探针。另一方面，与电阻器并联的开关可以完成这种切换。在又一方面，每个DUT上的芯片选择端子可以用于有效连接和断开内部DUT电路与测试器通道的连接。如此连接的多个DUT探针组可用于创建不同模式的DUT探针组，以测试不同DUT的模式，从而便于共享测试器通道。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式