专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2011066238A1 DATA DE-DUPLICATION IN A DISPERSED STORAGE NETWORK UTILIZING DATA CHARACTERIZATION 审中-公开
标题翻译：使用数据表征的分散式存储网络中的数据去重复
公开(公告)号：WO2011066238A1
公开(公告)日：2011-06-03
申请号：PCT/US2010/057691
申请日：2010-11-23
申请人： CLEVERSAFE, INC. , GLADWIN, S., Christopher , ABHIJEET, Kumar , DHUSE, Greg , RESCH, Jason, K. , GRUBE, Gary, W. , MARKISON, Timothy, W.
发明人： GLADWIN, S., Christopher , ABHIJEET, Kumar , DHUSE, Greg , RESCH, Jason, K. , GRUBE, Gary, W. , MARKISON, Timothy, W.
IPC分类号： G06F7/00
CPC分类号： G06F21/602 , G06F3/0608 , G06F3/0619 , G06F3/0641 , G06F3/067 , G06F11/1076 , G06F11/1092 , G06F17/30067 , G06F17/30159 , G06F17/30194 , G06F17/302 , G06F17/30283 , G06F21/6272 , G06F2211/1028 , G06F2221/2107 , H04L9/0861 , H04L63/0428 , H04L69/04
摘要： A method begins with a processing module receiving, from a requesting device, a data storage request that includes data for storage. The method continues with the processing module determining whether substantially identical data is currently stored in a dispersed storage network (DSN) memory. The method continues with the processing module encoding at least a portion of the data using an error coding dispersal storage function to produce a set of encoded data slices, sending the set of encoded data slices to the DSN memory for storage therein, and generating a unique retrieval matrix for the requesting device, wherein the unique retrieval matrix identifies a sub-set of encoded data slices of the set of encoded data slices for subsequent retrieval of the at least a portion of the data, when the substantially identical data is not stored in the DSN memory.
摘要翻译：方法开始于处理模块从请求设备接收包括用于存储的数据的数据存储请求。该方法继续处理模块确定当前是否将基本相同的数据存储在分散的存储网络（DSN）存储器中。该方法继续处理模块使用错误编码分散存储功能来编码数据的至少一部分，以产生一组编码数据片，将该组编码数据片段发送到DSN存储器以存储在其中，并产生唯一的用于所述请求设备的检索矩阵，其中所述唯一检索矩阵识别所述编码数据片段集合中的编码数据片段的子集，用于随后检索所述数据的至少一部分，当所述基本相同的数据未被存储在 DSN内存。

2. 发明申请

WO2006113708A3 APPARATUS AND METHOD FOR MANAGING THERMALLY INDUCED MOTION OF A PROBE CARD ASSEMBLY 审中-公开
标题翻译：用于管理探针卡组件的热诱导运动的装置和方法
公开(公告)号：WO2006113708A3
公开(公告)日：2009-05-07
申请号：PCT/US2006014554
申请日：2006-04-18
申请人： FORMFACTOR INC , ELDRIDGE BENJAMIN N , GRUBE GARY W , HOBBS ERIC D , MATHIEU GAETAN L , SHINDE MAKARAND S , SPORCK A NICHOLAS , WATSON THOMAS N , SLOCUM ALEXANDER N
发明人： ELDRIDGE BENJAMIN N , GRUBE GARY W , HOBBS ERIC D , MATHIEU GAETAN L , SHINDE MAKARAND S , SPORCK A NICHOLAS , WATSON THOMAS N , SLOCUM ALEXANDER N
IPC分类号： G01R31/02
CPC分类号： G01R31/2874 , G01R31/2863 , G01R31/2889 , Y10T29/5313
摘要： A probe card assembly can include a probe head assembly having probes for contacting an electronic device to be tested. The probe head assembly can be electrically connected to a wiring substrate and mechanically attached to a stiffener plate. The wiring substrate can provide electrical connections to a testing apparatus, and the stiffener plate can provide structure for attaching the probe card assembly to the testing apparatus. The stiffener plate can have a greater mechanical strength than the wiring substrate and can be less susceptible to thermally induced movement than the wiring substrate. The wiring substrate may be attached to the stiffener plate at a central location of the wiring substrate. Space may be provided at other locations where the wiring substrate is attached to the stiffener plate so that the wiring substrate can expand and contract with respect to the stiffener plate.
摘要翻译：探针卡组件可以包括具有用于接触要测试的电子设备的探针的探针头组件。探针头组件可以电连接到布线基板并且机械地附接到加强板。布线基板可以提供到测试装置的电连接，并且加强板可以提供用于将探针卡组件附接到测试装置的结构。加强板可以具有比布线基板更大的机械强度，并且可以比布线基板更不易受热引起的移动。布线基板可以在布线基板的中心位置处附接到加强板。可以在将布线基板附接到加强板的其他位置处设置空间，使得布线基板能够相对于加强板膨胀和收缩。

3. 发明申请

WO2006083862A1 METHOD AND APPARATUS FOR VERIFYING PLANARITY IN A PROBING SYSTEM 审中-公开
标题翻译：用于在探测系统中验证平面的方法和装置
公开(公告)号：WO2006083862A1
公开(公告)日：2006-08-10
申请号：PCT/US2006/003392
申请日：2006-01-30
申请人： FORMFACTOR, INC. , GRUBE, Gary, W. , WATSON, Thomas, N.
发明人： GRUBE, Gary, W. , WATSON, Thomas, N.
IPC分类号： G01R31/02
CPC分类号： G01B7/287 , G01B11/306 , G01R31/2886
摘要： An apparatus for determining a planarity of a first structure configured to hold a probing device to the planarity of a second structure configured to hold a device to be probed is disclosed. In one example of the apparatus, a plurality of moveable push rods are disposed in a substrate, which is attached to the first structure. In initial non-displaced positions, the push rods correspond to a planarity of the first structure. The second structure is then brought into contact with the push rods, displacing the push rods into second positions that correspond to a planarity of the second structure. In another example of the apparatus, beams of light are reflected off of reflectors disposed on the first structure and onto sensors disposed on the second structure. The locations of the reflected beams on the sensors are noted and used to determine the planarity of the first structure with respect to the second structure.
摘要翻译：公开了一种用于确定构造成将探测装置保持为构造成保持要探测的装置的第二结构的平面性的第一结构的平坦度的装置。在该装置的一个示例中，多个可移动的推杆设置在附接到第一结构的基板中。在初始非位移位置，推杆对应于第一结构的平面度。然后将第二结构与推杆接触，将推杆移位到与第二结构的平面度对应的第二位置。在该设备的另一示例中，光束从设置在第一结构上的反射器和设置在第二结构上的传感器上反射。注意反射光束在传感器上的位置并用于确定第一结构相对于第二结构的平面度。

4. 发明申请

WO2005104742A2 A METHOD TO BUILD ROBUST MECHANICAL STRUCTURES ON SUBSTRATE SURFACES 审中-公开
标题翻译：一种在基底表面上建立稳定的机械结构的方法
公开(公告)号：WO2005104742A2
公开(公告)日：2005-11-10
申请号：PCT/US2005/014377
申请日：2005-04-26
申请人： FORMFACTOR, INC. , GRUBE, Gary, W. , MATHIEU, Gaetan, L. , ELDRIDGE, Benjamin, N. , SOFIELD, Chadwick, D.
发明人： GRUBE, Gary, W. , MATHIEU, Gaetan, L. , ELDRIDGE, Benjamin, N. , SOFIELD, Chadwick, D.
IPC分类号： B32B9/00 , B32B15/04
CPC分类号： G01R3/00 , G01R1/06716 , G01R1/06744 , H01L24/80 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1461 , Y10T29/49117 , Y10T29/49147 , Y10T156/10 , Y10T428/12347 , Y10T428/12375 , Y10T428/12535 , Y10T428/12542 , Y10T428/12556 , Y10T428/12569 , Y10T428/31681 , H01L2924/00
摘要： A robust mechanical structure is provided to prevent small foundation structures formed on a substrate from detaching from the substrate surface. The strengthened structure is formed by plating a foundation metal layer on a seed layer and then embedding the plated foundation structure in an adhesive polymer material, such as epoxy. Components, such as spring probes, can then be constructed on the plated foundation. The adhesive polymer material better assures the adhesion of the metal foundation structure to the substrate surface by counteracting forces applied to an element, such as a spring probe, attached to the plated foundation.
摘要翻译：提供坚固的机械结构以防止形成在基板上的小基础结构从基板表面分离。强化结构通过在种子层上电镀基础金属层，然后将镀覆的基础结构嵌入诸如环氧树脂的粘合剂聚合物材料中而形成。然后可以在镀覆的基础上构造诸如弹簧探针的组件。粘合剂聚合物材料通过抵抗附着在镀覆基底上的诸如弹簧探针的元件的抵抗力，更好地保证金属基础结构与基底表面的粘附。

5. 发明申请

WO9900844A3 SOCKETS FOR SEMICONDUCTOR DEVICES WITH SPRING CONTACT ELEMENTS 审中-公开
标题翻译：具有弹簧触点元件的半导体器件插座
公开(公告)号：WO9900844A3
公开(公告)日：1999-04-29
申请号：PCT/US9813692
申请日：1998-06-30
申请人： FORMFACTOR INC , DOZIER THOMAS H II , ELDRIDGE BENJAMIN N , GRUBE GARY W , KHANDROS IGOR Y , MATHIEU GAETAN L , PEDERSEN DAVID V , STADT MICHAEL A
发明人： DOZIER THOMAS H II , ELDRIDGE BENJAMIN N , GRUBE GARY W , KHANDROS IGOR Y , MATHIEU GAETAN L , PEDERSEN DAVID V , STADT MICHAEL A
IPC分类号： G01R1/04 , H01L23/04 , H01L23/13 , H01L23/32 , H01L23/48 , H01L23/538 , H05K3/30 , H05K3/32
CPC分类号： G01R1/0408 , B23K3/087 , G01R1/0416 , G01R1/0466 , G01R31/2886 , H01L23/04 , H01L23/13 , H01L23/32 , H01L23/5385 , H01L24/72 , H01L2224/1134 , H01L2224/13099 , H01L2224/16 , H01L2224/16237 , H01L2224/73251 , H01L2224/8114 , H01L2224/81901 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01078 , H01L2924/01079 , H05K1/119 , H05K3/308 , H05K3/325 , H05K2201/0311 , H05K2201/09472 , H05K2201/09827 , Y10T29/49128 , Y10T29/4913 , Y10T29/49139 , Y10T29/4914 , Y10T29/49147 , Y10T29/49153 , Y10T29/49208 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , H01L2924/00014 , H01L2224/72
摘要： Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.
摘要翻译：通过迫使电子元件，因此弹簧接触元件的端部竖直地抵靠互连基板的端子，或者通过水平地推动互连基板的端子来形成从诸如半导体器件的电子部件延伸的弹簧接触元件的临时连接抵靠弹簧接触元件的端部。公开了各种终端配置。

6. 发明申请

WO1994003036A1 SEMICONDUCTOR CONNECTION COMPONENTS AND METHODS WITH RELEASABLE LEAD SUPPORT 审中-公开
标题翻译：半导体连接组件和方法与可释放的引线支持
公开(公告)号：WO1994003036A1
公开(公告)日：1994-02-03
申请号：PCT/US1993006930
申请日：1993-07-23
申请人： TESSERA, INC. , DISTEFANO, Thomas, H. , GRUBE, Gary, W. , KHANDROS, Igor, Y. , MATHIEW, Gaetan , SWEIS, Jason , UNION, Laurie , GIBSON, David
发明人： TESSERA, INC.
IPC分类号： H05K03/36
CPC分类号： H01L23/49572 , H01L23/3107 , H01L23/49838 , H01L23/4985 , H01L23/49861 , H01L24/01 , H01L2924/01082 , H01L2924/12042 , H05K3/361 , H05K3/4084 , Y10T29/49121 , Y10T29/4913 , Y10T29/49135 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A connection component for electrically connecting a semiconductor chip to support substrate incorporates a preferably dielectric supporting structure (70) defining gaps (40). Leads extend across these gaps so that the leads are supported on both sides of the gap (66, 70). The leads therefore can be positioned approximately in registration to contacts on the chip by aligning the connection component with the chip. Each lead is arranged so that one end can be displaced relative to the supporting structure when a downward force is applied to the lead. This allows the leads to be connected to the contacts on the chip by engaging each lead with a tool and forcing the lead downwardly against the contact. Preferably, each lead incorporates a frangible section (72) adjacent one side of the gap and the frangible section is broken when the lead is engaged with the contact. Final alignment of the leads with the contacts on the chip is provided by the bonding tool which has features adapted to control the position of the lead.
摘要翻译：用于将半导体芯片电连接到支撑衬底的连接部件包含限定间隙（40）的优选电介质支撑结构（70）。引线延伸穿过这些间隙，使得引线被支撑在间隙（66,70）的两侧。因此，引线可以通过将连接部件与芯片对准而大致对准芯片上的触点。每个引线被布置成使得当向引线施加向下的力时，一端可相对于支撑结构移位。这允许引线通过使每个引线与工具接合并将引线向下抵靠接触件而连接到芯片上的触点。优选地，每个引线包括与间隙的一侧相邻的易碎部分（72），并且当引线与触点接合时，易碎部分断裂。引线与芯片上的触点的最终对准由具有适于控制引线位置的特征的焊接工具提供。

7. 发明申请

WO2012106329A1 UTILIZING A DISPERSED STORAGE NETWORK ACCESS TOKEN MODULE TO STORE DATA IN A DISPERSED STORAGE NETWORK MEMORY 审中-公开
标题翻译：分散存储网络访问托盘模块以存储分布式存储网络存储器中的数据
公开(公告)号：WO2012106329A1
公开(公告)日：2012-08-09
申请号：PCT/US2012/023311
申请日：2012-01-31
申请人： CLEVERSAFE, INC. , GRUBE, Gary W. , MARKISON, Timothy W. , DHUSE, Greg , RESCH, Jason K. , VOLVOVSKI, Ilya , LEGGETTE, Wesley
发明人： GRUBE, Gary W. , MARKISON, Timothy W. , DHUSE, Greg , RESCH, Jason K. , VOLVOVSKI, Ilya , LEGGETTE, Wesley
IPC分类号： G06F12/00
CPC分类号： G06F11/1076 , G06F3/06 , G06F3/0604 , G06F3/0619 , G06F3/0665 , G06F3/067 , G06F11/00 , G06F11/1008 , G06F11/1402 , G06F11/1446 , G06F11/1448 , G06F15/17331 , G06F21/805 , H04L9/085 , H04L67/1097
摘要： A method for storing data begins with determining, by a computing device, where to store the data and continues with managing, by a dispersed storage network (DSN) access token module, a pairing between the DSN access token module and the computing device. The method continues with sending, by the computing device, at least a portion of the data to the DSN access token module and encoding, by the DSN access token module, the at least a portion of the data using a dispersed storage error encoding function to produce one or more sets of encoded data slices. The method continues with sending, by the DSN access token module, the one or more sets of encoded data slices and storage information to the computing device and sending, by the computing device, the one or more sets of encoded data slices to the DSN memory for storage therein.
摘要翻译：用于存储数据的方法开始于由计算设备确定在哪里存储数据，并继续通过分散的存储网络（DSN）访问令牌模块来管理DSN访问令牌模块和计算设备之间的配对。该方法继续由计算设备将数据的至少一部分发送到DSN访问令牌模块，并且由DSN访问令牌模块使用分散的存储错误编码功能对该数据的至少一部分进行编码，产生一组或多组编码数据片。该方法继续由DSN访问令牌模块将一组或多组编码数据片段和存储信息发送到计算设备，并由计算设备将一组或多组编码数据片段发送到DSN存储器用于存储。

8. 发明申请

WO2011066236A2 LOCALIZED DISPERSED STORAGE MEMORY SYSTEM 审中-公开
标题翻译：本地化分散存储系统
公开(公告)号：WO2011066236A2
公开(公告)日：2011-06-03
申请号：PCT/US2010/057675
申请日：2010-11-22
申请人： CLEVERSAFE, INC. , GLADWIN, S., Christopher , GRUBE, Gary, W. , MARKISON, Timothy, W.
发明人： GLADWIN, S., Christopher , GRUBE, Gary, W. , MARKISON, Timothy, W.
IPC分类号： G11B5/09
CPC分类号： G11B20/1889 , G06F3/0616 , G06F3/0653 , G06F3/0689 , G06F11/1076 , G06F11/1092 , G06F2211/1092 , G11B5/09 , G11B20/1252 , G11B20/1803
摘要： A method begins by a processing module receiving data to store and determining error coding dispersal storage function parameters. The method continues with the processing module encoding at least a portion of the data in accordance with the error coding dispersal storage function parameters to produce a set of data slices. The method continues with the processing module defining addressable storage sectors within the single hard drive based on a number of data slices within the set of data slices to produce a set of addressable storage sectors. The method continues with the processing module storing data slices of the set of data slices in corresponding addressable storage sectors of the set of addressable storage sectors.
摘要翻译：一种方法由处理模块开始，接收数据以存储和确定错误编码分散存储功能参数。该方法继续处理模块根据错误编码分散存储功能参数对数据的至少一部分进行编码以产生一组数据切片。该方法继续处理模块基于数据片段集合内的多个数据片段来定义单个硬盘驱动器内的可寻址存储扇区，以产生一组可寻址存储扇区。该方法继续处理模块将该组可寻址存储扇区的相应可寻址存储扇区中的数据片段集合的数据片段存储。

9. 发明申请

WO2011014823A1 MEMORY CONTROLLER UTILIZING DISTRIBUTED STORAGE 审中-公开
标题翻译：存储控制器利用分布式存储
公开(公告)号：WO2011014823A1
公开(公告)日：2011-02-03
申请号：PCT/US2010/043995
申请日：2010-07-30
申请人： CLEVERSAFE, INC. , GRUBE, Gary, W. , MARKISON, Timothy, W.
发明人： GRUBE, Gary, W. , MARKISON, Timothy, W.
IPC分类号： G06F11/30
CPC分类号： G06F11/1076 , G06F3/0619 , G06F3/064 , G06F3/067 , G06F9/30145 , G06F9/4401 , G06F11/0727 , G06F11/10 , G06F11/1016 , G06F11/1092 , G06F11/14 , G06F11/1666 , G06F12/14
摘要： A memory controller comprises at least a memory control processing module and/or a distributed storage processing module. A method begins by the memory control processing module receiving a memory access request regarding a data segment. The method continues with the memory control processing module interpreting the memory access request to determine whether an error coding dispersal function of the data segment is applicable. The method continues with the memory control processing module sending the memory access request to the distributed storage processing module when the error coding dispersal function is applicable. The method continues with the distributed storage processing module performing the error coding dispersal function on the data segment to produce an error coded processed data segment. The method continues with the distributed storage processing module sending the error coded processed data segment to the memory control processing module.
摘要翻译：存储器控制器至少包括存储器控制处理模块和/或分布式存储处理模块。存储器控制处理模块开始接收关于数据段的存储器访问请求的方法。该方法继续存储器控制处理模块解释存储器访问请求以确定数据段的错误编码分散功能是否适用。当适用错误编码分散功能时，该方法继续存储器控制处理模块向分布式存储处理模块发送存储器访问请求。该方法继续分布式存储处理模块对数据段执行错误编码分散功能，以产生经错误编码的处理数据段。该方法继续分布式存储处理模块将错误编码处理的数据段发送到存储器控制处理模块。

10. 发明申请

WO2003040734A3 METHOD AND SYSTEM FOR COMPENSATING THERMALLY INDUCED MOTION OF PROBE CARDS 审中-公开
公开(公告)号：WO2003040734A3
公开(公告)日：2003-05-15
申请号：PCT/US2002/035022
申请日：2002-11-01
申请人： FORMFACTOR, INC. , ELDRIDGE, Benjamin, N. , GRUBE, Gary, W. , MATSUBAYASHI, Ken, S. , LARDER, Richard, A. , SHINDE, Makarand, S. , MATHIEU, Gaetan, L. , MARTENS, Rod
发明人： ELDRIDGE, Benjamin, N. , GRUBE, Gary, W. , MATSUBAYASHI, Ken, S. , LARDER, Richard, A. , SHINDE, Makarand, S. , MATHIEU, Gaetan, L. , MARTENS, Rod
IPC分类号： G01R1/073
摘要： The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements or shaped memory allows wich response to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式