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1. 发明申请

WO2008070466A3 SHARING RESOURCES IN A SYSTEM FOR TESTING SEMICONDUCTOR DEVICES 审中-公开
标题翻译：在测试半导体器件的系统中共享资源
公开(公告)号：WO2008070466A3
公开(公告)日：2008-11-06
申请号：PCT/US2007085483
申请日：2007-11-25
申请人： FORMFACTOR INC , CHRAFT MATTHEW E , ELDRIDGE BENJAMIN N , HENSON ROY J , SPORCK A NICHOLAS
发明人： CHRAFT MATTHEW E , ELDRIDGE BENJAMIN N , HENSON ROY J , SPORCK A NICHOLAS
IPC分类号： G01R31/02
CPC分类号： G01R31/31926 , G01R31/318511
摘要： Probes in a plurality of DUT probe groups can be connected in parallel to a single tester channel. In one aspect, digital potentiometers can be used to effectively switch the tester channel from a probe in one DUT probe group to a probe in another DUT probe group. In another aspect, switches in parallel with a resistor can accomplish such switching. In yet another aspect, a chip select terminal on each DUT can be used to effectively connect and disconnect internal DUT circuitry to the tester channel. Multiple DUT probe groups so connected can be used to create different patterns of DUT probe groups for testing different patterns of DUTs and thus facilitate sharing tester channels.
摘要翻译：多个DUT探针组中的探针可以并行连接到单个测试器通道。在一个方面，可以使用数字电位计来有效地将测试器通道从一个DUT探针组中的探针切换到另一个DUT探针组中的探针。另一方面，与电阻器并联的开关可以完成这种切换。在又一方面，每个DUT上的芯片选择端子可以用于有效连接和断开内部DUT电路与测试器通道的连接。如此连接的多个DUT探针组可用于创建不同模式的DUT探针组，以测试不同DUT的模式，从而便于共享测试器通道。

2. 发明申请

WO2007146582A3 AC COUPLED PARAMETRIC TEST PROBE 审中-公开
标题翻译：交流耦合参数测试探头
公开(公告)号：WO2007146582A3
公开(公告)日：2009-03-19
申请号：PCT/US2007069806
申请日：2007-05-25
申请人： FORMFACTOR INC , MILLER CHARLES A , SPORCK A NICHOLAS , ELDRIDGE BENJAMIN N
发明人： MILLER CHARLES A , SPORCK A NICHOLAS , ELDRIDGE BENJAMIN N
IPC分类号： G01R31/02
CPC分类号： G01R1/06711 , G01R1/06727 , G01R1/07 , G01R31/3025
摘要： A probe for contacting and testing ICs on a semiconductor device includes a dielectric insulating material tip. The dielectric tip does not contaminate the surface being probed unlike metal probe tips. A contact scrub is further not required with signals being capacitively or inductively coupled from the probe tip to the IC. Testing can be performed during early fabrication steps of the wafer without the need for applying a metalization layer to the wafer to form bond pads. Testing can be performed by inductively coupling an AC signal to the probe tip, with coupling enhanced by including a magnetic material in the dielectric probe tip. Using an AC test signal enables testing of ICs without requiring separate power and ground connections.
摘要翻译：用于在半导体器件上接触和测试IC的探针包括介电绝缘材料尖端。与金属探针尖端不同，电介质尖端不会污染被探测的表面。进一步不需要接触擦洗，信号从探头尖端到IC电容或电感耦合。可以在晶片的早期制造步骤期间进行测试，而不需要将金属化层施加到晶片以形成接合焊盘。可以通过将AC信号电感耦合到探针尖端来进行测试，通过在介电探针尖端中包括磁性材料来增强耦合。使用AC测试信号可以测试IC，而不需要单独的电源和接地连接。

3. 发明申请

WO2006113708A3 APPARATUS AND METHOD FOR MANAGING THERMALLY INDUCED MOTION OF A PROBE CARD ASSEMBLY 审中-公开
标题翻译：用于管理探针卡组件的热诱导运动的装置和方法
公开(公告)号：WO2006113708A3
公开(公告)日：2009-05-07
申请号：PCT/US2006014554
申请日：2006-04-18
申请人： FORMFACTOR INC , ELDRIDGE BENJAMIN N , GRUBE GARY W , HOBBS ERIC D , MATHIEU GAETAN L , SHINDE MAKARAND S , SPORCK A NICHOLAS , WATSON THOMAS N , SLOCUM ALEXANDER N
发明人： ELDRIDGE BENJAMIN N , GRUBE GARY W , HOBBS ERIC D , MATHIEU GAETAN L , SHINDE MAKARAND S , SPORCK A NICHOLAS , WATSON THOMAS N , SLOCUM ALEXANDER N
IPC分类号： G01R31/02
CPC分类号： G01R31/2874 , G01R31/2863 , G01R31/2889 , Y10T29/5313
摘要： A probe card assembly can include a probe head assembly having probes for contacting an electronic device to be tested. The probe head assembly can be electrically connected to a wiring substrate and mechanically attached to a stiffener plate. The wiring substrate can provide electrical connections to a testing apparatus, and the stiffener plate can provide structure for attaching the probe card assembly to the testing apparatus. The stiffener plate can have a greater mechanical strength than the wiring substrate and can be less susceptible to thermally induced movement than the wiring substrate. The wiring substrate may be attached to the stiffener plate at a central location of the wiring substrate. Space may be provided at other locations where the wiring substrate is attached to the stiffener plate so that the wiring substrate can expand and contract with respect to the stiffener plate.
摘要翻译：探针卡组件可以包括具有用于接触要测试的电子设备的探针的探针头组件。探针头组件可以电连接到布线基板并且机械地附接到加强板。布线基板可以提供到测试装置的电连接，并且加强板可以提供用于将探针卡组件附接到测试装置的结构。加强板可以具有比布线基板更大的机械强度，并且可以比布线基板更不易受热引起的移动。布线基板可以在布线基板的中心位置处附接到加强板。可以在将布线基板附接到加强板的其他位置处设置空间，使得布线基板能够相对于加强板膨胀和收缩。

4. 发明申请

WO2008008570A3 SAWING TILE CORNERS ON PROBE CARD SUBSTRATES 审中-公开
标题翻译：在探针卡片基板上锯成角度
公开(公告)号：WO2008008570A3
公开(公告)日：2009-02-12
申请号：PCT/US2007069816
申请日：2007-05-25
申请人： FORMFACTOR INC , ELDRIDGE BENJAMIN N , MATHEWS PETER B , SHINDE MAKARAND S , HOBBS ERIC D , HENSON ROY J
发明人： ELDRIDGE BENJAMIN N , MATHEWS PETER B , SHINDE MAKARAND S , HOBBS ERIC D , HENSON ROY J
IPC分类号： H01L31/00
CPC分类号： G01R1/07342
摘要： A composite substrate for testing semiconductor devices is formed by selecting a plurality of substantially identical individual substrates, cutting a corner from at least some of the individual substrates in accordance with their position in a final array configuration, and then assembling the individual substrates into the final array configuration. The final array configuration of substrates with corners cut or sawed away conforms more closely to the surface area of a wafer being tested, and can easily fit within space limits of a test environment.
摘要翻译：用于测试半导体器件的复合衬底通过选择多个基本上相同的单独衬底形成，根据它们在最终阵列构型中的位置从至少一些单个衬底切割拐角，然后将各个衬底组装成最终阵列配置。具有切割或锯切的角落的基底的最终阵列配置更接近于正被测试的晶片的表面积，并且可以容易地配合在测试环境的空间极限内。

5. 发明申请

WO2007035664A3 APPARATUS AND METHOD OF TESTING SINGULATED DIES 审中-公开
标题翻译：装置和测试方法
公开(公告)号：WO2007035664A3
公开(公告)日：2009-04-30
申请号：PCT/US2006036336
申请日：2006-09-18
申请人： FORMFACTOR INC , DOZIER II THOMAS H , ELDRIDGE BENJAMIN N , HSU DAVID S , KHANDROS IGOR Y , MILLER CHARLES A
发明人： DOZIER II THOMAS H , ELDRIDGE BENJAMIN N , HSU DAVID S , KHANDROS IGOR Y , MILLER CHARLES A
IPC分类号： G01R31/02
CPC分类号： G01R31/2889 , G01R31/2893 , G01R31/31905
摘要： An exemplary die carrier is disclosed. In some embodiments, the die carrier can hold a plurality of singulated dies while the dies are tested. The dies can be arranged on the carrier in a pattern that facilities testing the dies. The carrier can be configured to allow interchangeable interfaces to different testers to be attached to and detached from the carrier. The carrier can also be configured as a shipping container for the dies.
摘要翻译：公开了一种示例性的模具载体。在一些实施例中，模具载体可以在测试模具的同时保持多个单个模具。模具可以以对模具进行测试的模式布置在载体上。载体可以被配置为允许不同的测试仪的可互换的接口被附接到载体上并与载体分离。载体也可以被配置为模具的运输容器。

6. 发明申请

WO2008082815A3 RESILIENT CONTACT ELEMENT AND METHODS OF FABRICATION 审中-公开
标题翻译：弹性接触元件和制造方法
公开(公告)号：WO2008082815A3
公开(公告)日：2008-08-28
申请号：PCT/US2007085481
申请日：2007-11-25
申请人： FORMFACTOR INC , GRITTERS JOHN K , ELDRIDGE BENJAMIN N , BREINLINGER KEITH J
发明人： GRITTERS JOHN K , ELDRIDGE BENJAMIN N , BREINLINGER KEITH J
IPC分类号： H01R12/00
CPC分类号： H01R31/02 , G01R1/06733 , G01R1/07342 , G01R3/00
摘要： Embodiments of resilient contact elements and methods for fabricating same are provided herein. In one embodiment, a resilient contact element for use in a probe card includes a lithographically formed resilient beam having a first end and an opposing second end; and a tip disposed proximate the first end of the beam and configured to break through an oxide layer of a surface of a device to be tested to establish a reliable electrical connection therewith; wherein at least a central portion of the beam has a continuous sloped profile defining, in a relaxed state, a height measured between the beam and a plane representing an upper surface of a device to be tested that is greater near the second end of the beam than near the first end of the beam.
摘要翻译：本文提供了弹性接触元件的实施例及其制造方法。在一个实施例中，用于探针卡中的弹性接触元件包括光刻成形的弹性梁，其具有第一端和相对的第二端; 以及尖端，所述尖端设置在所述梁的所述第一端附近并且被配置为突破待测试装置的表面的氧化物层以建立与其的可靠电连接; 其中所述梁的至少中心部分具有连续的倾斜轮廓，所述连续的倾斜轮廓在松弛状态下限定在所述梁与代表待测试设备的上表面的平面之间测量的高度，所述平面在所述梁的第二端附近更大比靠近光束的第一端。

7. 发明申请

WO2007008790A3 PROBE CARD ASSEMBLY WITH AN INTERCHANGEABLE PROBE INSERT 审中-公开
标题翻译：探针卡组装与可交换的探头插入
公开(公告)号：WO2007008790A3
公开(公告)日：2007-06-21
申请号：PCT/US2006026723
申请日：2006-07-07
申请人： FORMFACTOR INC , ELDRIDGE BENJAMIN N , REYNOLDS CARL V , KAWAMATA NOBUHIRO , SAEKI TAKAO
发明人： ELDRIDGE BENJAMIN N , REYNOLDS CARL V , KAWAMATA NOBUHIRO , SAEKI TAKAO
IPC分类号： G01R31/02
CPC分类号： G01R31/2889 , G01R31/31905
摘要： A probe card assembly includes an insert holder configured to hold a probe insert, which can include probes disposed in a particular configuration for probing a device to be tested. The probe card assembly provides an electrical interface to a tester that can control testing of the device, and while attached to the probe card assembly, the insert holder can hold the probe insert such that the probe insert is electrically connected to electrical paths within the probe card assembly that are part of the interface to the tester. The insert holder is detachable from the probe card assembly.
摘要翻译：探针卡组件包括被构造成保持探针插入件的插入物夹持器，其可以包括设置在特定构造中的探针，用于探测待测试的装置。探针卡组件提供到测试器的电接口，其可以控制设备的测试，并且在附接到探针卡组件时，插入物保持器可以保持探针插入件，使得探针插入件电连接到探针内的电气路径卡组件是测试仪接口的一部分。插入物保持器可从探针卡组件拆卸。

8. 发明申请

WO2005101038A3 WIRELESS TEST CASSETTE 审中-公开
标题翻译：无线测试CASSETTE
公开(公告)号：WO2005101038A3
公开(公告)日：2005-12-15
申请号：PCT/US2005011849
申请日：2005-04-08
申请人： FORMFACTOR INC , ELDRIDGE BENJAMIN N , KHANDROS IGOR Y , MILLER CHARLES A , SPORCK NICHOLAS A
发明人： ELDRIDGE BENJAMIN N , KHANDROS IGOR Y , MILLER CHARLES A , SPORCK NICHOLAS A
IPC分类号： G01R1/073 , G01R31/02 , G01R31/26
CPC分类号： G01R1/0491 , G01R1/073 , G01R31/3025
摘要： A base controller (210) disposed in a test cassette (110) receives test data for testing a plurality of electronic devices (236a,236b). The base controller wirelessly transmits the test data to a plurality of wireless test control chips (214a,214b,214c,214d,214e,214f,214g), which write the test data to each of the electronic devices. The wireless test control chips (214a,214b,214c,214d,214e,214f,214g), then read response data generated by the electronic devices (236a, 236b), and the wireless test control chips wirelessly transmit the response data to the base controller (210).
摘要翻译：设置在测试盒（110）中的基本控制器（210）接收用于测试多个电子设备（236a，236b）的测试数据。基站控制器将测试数据无线发送到多个无线测试控制芯片（214a，214b，214c，214d，214e，214f，214g），其将测试数据写入每个电子设备。无线测试控制芯片（214a，214b，214c，214d，214e，214f，214g）然后读取由电子设备（236a，236b）产生的响应数据，并且无线测试控制芯片将响应数据无线地发送到基站控制器（210）。

9. 发明申请

WO02084716A2 STACKED SEMICONDUCTOR DEVICE ASSEMBLY WITH MICROELECTRONIC SPRING CONTACTS 审中-公开
标题翻译：堆叠半导体器件组件与微电子弹簧联系
公开(公告)号：WO02084716A2
公开(公告)日：2002-10-24
申请号：PCT/US0211650
申请日：2002-04-11
申请人： FORMFACTOR INC , ELDRIDGE BENJAMIN N
发明人： ELDRIDGE BENJAMIN N
IPC分类号： H01L25/065 , H01L25/10 , H01L21/00
CPC分类号： H01L25/0657 , H01L25/105 , H01L2225/06572 , H01L2225/06589 , H01L2225/06593 , H01L2225/1023 , H01L2225/1082 , H01L2225/1094 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A three-dimensional, stacked semiconductor device assembly with microelectronic spring contacts, and components thereof, is disclosed. The assembly comprises a plurality of stacked modules, which are capable of being readily mounted to, and demounted from, one another. Each module of the assembly comprises a semiconductor device, comprising a die, mounted to a stacking substrate. The die and the stacking substrate are optionally capable of being readily mounted to, and demounted from one another. A bottommost module in the assembly is suitable for attaching directly to a substrate or other component, such as a printed circuit board, and a topmost component in the assembly preferably comprises a decoupling and/or termination substrate. Each semiconductor device in the assembly has terminals on a surface thereof, at least selected ones of which are provided with a contact element. Each device preferably comprises one or more stop structures for the microelectronic springs on its terminal surface. Contact elements on the semiconductor device and between adjacent modules preferably comprise microelectronic lithographic-type molded spring contacts.
摘要翻译：公开了一种具有微电子弹簧触点的三维叠层半导体器件组件及其部件。组件包括多个堆叠的模块，其能够容易地彼此安装和拆卸。组件的每个模块包括半导体器件，其包括安装到堆叠衬底的裸片。模具和堆叠衬底可选地能够容易地彼此安装和拆卸。组件中的最底部的模块适合于直接附接到衬底或其它部件，例如印刷电路板，并且组件中的最上面的组件优选地包括去耦和/或终止衬底。组件中的每个半导体器件在其表面上具有端子，其中至少选定的一个具有接触元件。每个装置优选地包括用于其终端表面上的微电子弹簧的一个或多个止动结构。半导体器件和相邻模块之间的接触元件优选地包括微电子光刻型模制弹簧触点。

10. 发明申请

WO2007081522A3 A PROBE ARRAY STRUCTURE AND A METHOD OF MAKING A PROBE ARRAY STRUCTURE 审中-公开
标题翻译：探索阵列结构和制作探测阵列结构的方法
公开(公告)号：WO2007081522A3
公开(公告)日：2009-02-12
申请号：PCT/US2006048723
申请日：2006-12-19
申请人： FORMFACTOR INC , ELDRIDGE BENJAMIN N , FANG TRELIANT , GRITTERS JOHN K , KHANDROS IGOR Y , MA LUNYU , MATHIEU GAETAN L
发明人： ELDRIDGE BENJAMIN N , FANG TRELIANT , GRITTERS JOHN K , KHANDROS IGOR Y , MA LUNYU , MATHIEU GAETAN L
IPC分类号： G01R31/02
CPC分类号： G01R3/00 , G01R1/06716 , G01R1/06727 , G01R1/06744
摘要： Probe array structures and methods of making probe array structures are disclosed. A plurality of electrically conductive elongate contact structures disposed on a first substrate can be provided. The contact structures can then be partially encased in a securing material such that ends of the contact structures extend from a surface of the securing material. The exposed portions of the contact structures can then be captured in a second substrate.
摘要翻译：公开了探针阵列结构和制造探针阵列结构的方法。可以提供设置在第一基板上的多个导电细长接触结构。然后可以将接触结构部分地包封在固定材料中，使得接触结构的端部从固定材料的表面延伸。然后接触结构的暴露部分可以在第二衬底中被捕获。

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