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    • 8. 发明授权
    • Integrated circuit chip with modular design
    • 集成电路芯片采用模块化设计
    • US08032849B2
    • 2011-10-04
    • US12130268
    • 2008-05-30
    • Harm Peter HofsteeJames Allan KahleTakeshi Yamazaki
    • Harm Peter HofsteeJames Allan KahleTakeshi Yamazaki
    • G06F17/50
    • G06F17/5045
    • Disclosed is a procedure or design approach for functional modules that may be used in connection with a multiprocessor integrated circuit chip. The approach includes keeping the dimensions of each module substantially the same and having the bus, power, clock and I/O connection configured the same on all modules. Further requirements for ease of use are to generalize the capability of each module as much as possible and to decentralize functions such as testing to be primarily performed within each module. The use of such considerations or rules substantially eases the design of a given type of custom chips, and based upon an initial chip design greatly facilitates the design of further custom chips, similar in application, but subsequent to the successful completion of the initial chip. The standardization modules and replication of the modules on a given chip also reduces physical verification time in initial chip design as well as redesign time of the initial chip when requirements for chip capability are redefined or otherwise changed. Any subsequent or further custom chips can include more or less of specific modules based upon already established parameters.
    • 公开了可以与多处理器集成电路芯片结合使用的功能模块的过程或设计方法。 该方法包括保持每个模块的尺寸基本相同,并使总线,电源,时钟和I / O连接在所有模块上配置相同。 对易用性的进一步要求是尽可能地推广每个模块的能力,并将诸如测试之类的功能分散在每个模块内主要执行。 这种考虑或规则的使用大大简化了给定类型的定制芯片的设计,并且基于初始的芯片设计极大地促进了其他定制芯片的设计,其应用类似,但是在初始芯片的成功完成之后。 给定芯片上的标准化模块和模块的复制也减少了初始芯片设计中的物理验证时间,以及在重新定义或改变芯片能力要求时初始芯片的重新设计时间。 任何后续或进一步的定制芯片可以基于已经建立的参数包括或多或少的特定模块。
    • 10. 发明申请
    • MODULAR DESIGN METHOD AND APPARATUS
    • 模块化设计方法和装置
    • US20080235647A1
    • 2008-09-25
    • US12130268
    • 2008-05-30
    • Harm Peter HofsteeJames Allan KahleTakeshi Yamazaki
    • Harm Peter HofsteeJames Allan KahleTakeshi Yamazaki
    • G06F17/50
    • G06F17/5045
    • Disclosed is a procedure or design approach for functional modules that may be used in connection with a multiprocessor integrated circuit chip. The approach includes keeping the dimensions of each module substantially the same and having the bus, power, clock and I/O connection configured the same on all modules. Further requirements for ease of use are to generalize the capability of each module as much as possible and to decentralize functions such as testing to be primarily performed within each module. The use of such considerations or rules substantially eases the design of a given type of custom chips, and based upon an initial chip design greatly facilitates the design of further custom chips, similar in application, but subsequent to the successful completion of the initial chip. The standardization modules and replication of the modules on a given chip also reduces physical verification time in initial chip design as well as redesign time of the initial chip when requirements for chip capability are redefined or otherwise changed. Any subsequent or further custom chips can include more or less of specific modules based upon already established parameters.
    • 公开了可以与多处理器集成电路芯片结合使用的功能模块的过程或设计方法。 该方法包括保持每个模块的尺寸基本相同,并使总线,电源,时钟和I / O连接在所有模块上配置相同。 对易用性的进一步要求是尽可能地推广每个模块的能力,并将诸如测试之类的功能分散在每个模块内主要执行。 这种考虑或规则的使用大大简化了给定类型的定制芯片的设计,并且基于初始的芯片设计极大地促进了其他定制芯片的设计,其应用类似,但是在初始芯片的成功完成之后。 给定芯片上的标准化模块和模块的复制也减少了初始芯片设计中的物理验证时间,以及在重新定义或改变芯片能力要求时初始芯片的重新设计时间。 任何后续或进一步的定制芯片可以基于已经建立的参数包括或多或少的特定模块。