专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2006231517A Polishing device 有权
标题翻译：抛光装置
公开(公告)号：JP2006231517A
公开(公告)日：2006-09-07
申请号：JP2006139857
申请日：2006-05-19
申请人： Ebara Corp , Yuzo Mori , 株式会社荏原製作所 , 勇蔵森
发明人： MORI YUZO , KIMURA NORIO , SHIRAKASHI MICHIHIKO , TAIMA YASUSHI , FUKUNAGA AKIRA
IPC分类号： B24B37/00 , B24B57/02 , C25F7/00 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a polishing device, capable of reducing loads of wafer cleaning after polishing and waste fluid treatment, and efficiently performing polishing work while restricting use of chemicals. SOLUTION: This polishing device comprises a top ring 14 to hold the material to be polished, polishing members 10 and 24 having ion exchanger, polishing fluid supply means 32, 30, and 26 to supply polishing fluid, and a power source 20 to form an electric field in the polishing fluid. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种抛光装置，其能够减少抛光和废液处理后的晶片清洗负荷，并且有效地进行抛光工作同时限制化学品的使用。解决方案：该抛光装置包括用于保持待抛光材料的顶环14，具有离子交换器的抛光构件10和24，用于提供抛光流体的抛光液供给装置32,30和26，以及电源20 以在抛光液中形成电场。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2009045679A Polishing device 审中-公开
标题翻译：抛光装置
公开(公告)号：JP2009045679A
公开(公告)日：2009-03-05
申请号：JP2007212497
申请日：2007-08-16
申请人： Ebara Corp , 株式会社荏原製作所
发明人： KIMURA NORIO , ITO KENYA , TAKAHASHI YOSHIMIZU , SEKI MASAYA
IPC分类号： B24B21/18 , B24B9/00 , B24B21/00
CPC分类号： B24B9/065
摘要： PROBLEM TO BE SOLVED: To provide a polishing device capable of polishing the circumferential portion of a substrate at a high polishing rate. SOLUTION: This polishing device for polishing the circumferential portion (bevel portion, notch portion, edge cut portion) of the substrate W by sliding a polishing tool 41 on the circumferential portion. The polishing device comprises a substrate-holding portion 20 for holding the substrate W, and a polishing head 42 for polishing the circumferential portion of the substrate W held by the substrate-holding portion 20 by using the polishing tool 41. The polishing head 42 has a press pad 50 for pressing the polishing tool 41 against the circumferential portion of the substrate W, and a linear motor 90 for moving the press pad 50 reciprocally. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供能够以高抛光速率抛光基板的圆周部分的抛光装置。解决方案：该抛光装置用于通过在周向部分上滑动研磨工具41来研磨衬底W的周向部分（斜面部分，切口部分，边缘切割部分）。抛光装置包括用于保持基板W的基板保持部分20和用于通过使用抛光工具41抛光由基板保持部分20保持的基板W的圆周部分的抛光头42.抛光头42具有用于将抛光工具41压靠在基板W的圆周部分上的压板50以及用于使压板50往复移动的直线电动机90。版权所有（C）2009，JPO＆INPIT

3. 发明专利

JP2009004161A Method of removing foreign matter on sample surface and charged particle apparatus 有权
标题翻译：在样品表面和充电颗粒装置上移除外来物质的方法
公开(公告)号：JP2009004161A
公开(公告)日：2009-01-08
申请号：JP2007162528
申请日：2007-06-20
申请人： Ebara Corp , 株式会社荏原製作所
发明人： NAITO YOSHIHIKO , KIMURA NORIO , HATAKEYAMA MASAKI
IPC分类号： H01J37/20 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide a method of removing foreign matter on a sample surface which detects foreign matter on the sample surface and removes the detected foreign matter on the sample surface when having detected the foreign matter, and to provide a charged particle beam apparatus used for this method. SOLUTION: The method of removing foreign matter 160 on the sample 150 surface irradiated with a charged particle beam includes: a step of acquiring charge information on the sample surface; a step of detecting the foreign matter on the sample surface based on the acquired charge information; a step of moving the sample in a horizontal direction; and a step of charging adsorption electrodes 50, 50a, 50b facing and close to the sample surface with a polarity different from a charge polarity of the foreign matter, and thereby electrostatically adsorbing the foreign matter which approaches the adsorption electrodes. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种在检测到异物时检测样品表面上的异物的样品表面上除去杂质并除去检测到的异物的方法，并且提供带电的用于该方法的粒子束装置。解决方案：用带电粒子束照射的样品150表面上去除异物160的方法包括：获取样品表面上的电荷信息的步骤; 基于获取的电荷信息检测样品表面上的异物的步骤; 沿水平方向移动样品的步骤; 以与异物的电荷极性不同的方式对与样品表面贴合的吸附电极50,50a，50b进行充电的步骤，从而静电吸附接近吸附电极的异物。版权所有（C）2009，JPO＆INPIT

4. 发明专利

JP2007050506A Apparatus for electrochemical machining 审中-公开
标题翻译：电化学加工设备
公开(公告)号：JP2007050506A
公开(公告)日：2007-03-01
申请号：JP2006219808
申请日：2006-08-11
申请人： Ebara Corp , 株式会社荏原製作所
发明人： KUMEGAWA MASAYUKI , KIMURA NORIO , FUKUNAGA YUKIO , MUTSUHIRA KATSUYUKI
IPC分类号： B23H3/00 , B23H3/04 , B23H3/10
CPC分类号： C25D17/001 , C25D17/002 , C25D17/02
摘要： PROBLEM TO BE SOLVED: To provide an apparatus for electrochemical machining, which apparatus can flatten the surface of a metallic film at a low machining pressure, the metallic film being arranged on a substrate and having minute undulations, and further can machine the metallic film at a uniform machining speed over the whole area of the metallic film.
SOLUTION: The apparatus for electrochemical machining comprises a current supplying electrode 31 and a machining electrode 32, a substrate carrier 11 for holding the substrate W, a first supply passage 51 for supplying a first electrolytic solution between the current supplying electrode 31 and the substrate W, a second supply passage 52 for supplying a second electrolytic solution between the machining electrode 32 and the substrate W, an insulating body 36 for electrically insulating the first electrolytic solution and the second electrolytic solution, a table 12 on which the current supplying electrode 31, the machining electrode 32, and the insulating body 36 are arranged, an electric power source 33 for applying electric voltage between the current supplying electrode 31 and the machining electrode 32, and a relative motion mechanism 17 for relatively moving the table 12 and the substrate carrier 11 in the state that the insulating body 36 is brought into contact with the metallic film 6.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种用于电化学加工的装置，该装置可以在低加工压力下使金属膜的表面平坦化，金属膜布置在基板上并且具有微小的起伏，并且还可以加工金属膜在金属膜的整个区域上以均匀的加工速度。解决方案：用于电化学加工的装置包括供电电极31和加工电极32，用于保持基板W的基板载体11，用于在供电电极31和供电电极31之间提供第一电解液的第一供应通道51 基板W，用于在加工电极32和基板W之间供给第二电解液的第二供给通路52，将第一电解液和第二电解液电绝缘的绝缘体36，供给电流布置电极31，加工电极32和绝缘体36，用于在供电电极31和加工电极32之间施加电压的电源33和用于相对移动台12的相对运动机构17和基板载体11处于绝缘体36与金属接触的状态版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2006104581A Electroless plating apparatus and electroless plating method 审中-公开
标题翻译：电沉积装置和电镀法
公开(公告)号：JP2006104581A
公开(公告)日：2006-04-20
申请号：JP2005365630
申请日：2005-12-19
申请人： Ebara Corp , 株式会社荏原製作所
发明人： HONGO AKIHISA , MISHIMA KOJI , KIMURA NORIO , ABE KENICHI , O CHIKAAKI
IPC分类号： C23C18/31 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To provide an electroless plating apparatus which can easily form a plated film having more uniform thickness on a surface, to be plated, of a material to be plated, and an electroless plating method. SOLUTION: In the plating apparatus comprising a holding portion 10 for holding a material W to be plated, and a plating bath 24 for holding a plating liquid 22, wherein the material W to be plated is brought into contact with the plating liquid 22 in the plating bath 24 to be plated, the holding portion 10 has a heating portion 14. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种化学镀设备，其可以容易地形成具有更均匀厚度的镀膜，待镀覆的材料的被镀层和无电镀方法。解决方案：在包括用于保持待镀材料W的保持部分10和用于保持电镀液22的镀浴24的电镀装置中，其中待镀材料W与镀液接触在电镀槽24中，保持部分10具有加热部分14.版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2005264339A Electrolytic treatment method and apparatus therefor 审中-公开
标题翻译：电解处理方法及其设备
公开(公告)号：JP2005264339A
公开(公告)日：2005-09-29
申请号：JP2005161668
申请日：2005-06-01
申请人： Ebara Corp , Toshiba Corp , 株式会社東芝 , 株式会社荏原製作所
发明人： MATSUDA TETSURO , KANEKO HISAFUMI , MISHIMA KOJI , MAKINO NATSUKI , KUNISAWA JUNJI , INOUE HIROAKI , KIMURA NORIO , ODAGAKI MITSUKO , TSUJIMURA MANABU
IPC分类号： C25D7/12 , C25D17/00 , C25D17/10 , C25D17/12 , C25F7/00
摘要： PROBLEM TO BE SOLVED: To uniformly electrolyze over a substrate without varying thickness or materials of a conductive layer or an electrolytic solution such as a plating liquid.
SOLUTION: The apparatus is equipped with: a substrate mount 30 where a substrate W to be treated is horizontally mounted with the top surface facing upward; a lip seal 34 to be in contact with the surface peripheral edge of the objective substrate W mounted on the substrate mount 30 and to seal the peripheral edge; a contact point 36 disposed outside the lip seal 34 and in contact with the peripheral edge of the objective substrate W mounted on the substrate mount 30 so as to introduce the potential of either a cathode or an anode into the substrate W; the other electrode 38 disposed above the objective substrate W mounted on the substrate mount 30; and a high resistance structure 40 disposed between the objective substrate W mounted on the substrate mount 30 and the other electrode 38. Electrolytic treatment is carried out by filling the space between the objective substrate W mounted on the substrate mount 30 and the other electrode 38 with an electrolytic solution 10.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：在不改变导电层或诸如电镀液的电解液的厚度或材料的基板上均匀地电解。解决方案：该装置配备有：基板安装件30，其中要处理的基板W水平安装，顶表面面向上; 唇形密封件34，其与安装在基板安装件30上的物镜基板W的表面周缘接触并密封周边边缘; 接触点36，其设置在唇形密封件34的外侧并与安装在基板安装件30上的物镜基板W的周缘接触，以将阴极或阳极的电位引入基板W; 设置在安装在基板安装件30上的物镜基板W上方的另一电极38; 以及设置在安装在基板安装件30上的目标基板W与另一个电极38之间的高电阻结构40.电解处理通过将安装在基板安装件30上的目标基板W与另一个电极38之间的空间填充，电解液10.版权所有（C）2005，JPO＆NCIPI

7. 发明专利

JP2004209644A Substrate polishing method and device 有权
公开(公告)号：JP2004209644A
公开(公告)日：2004-07-29
申请号：JP2004121195
申请日：2004-04-16
申请人： Ebara Corp , 株式会社荏原製作所
发明人： SHIMIZU NOBU , KIMURA NORIO
IPC分类号： B24B37/00 , B24B37/005 , B24B37/12 , B24B37/16 , H01L21/304 , B24B37/04
摘要： PROBLEM TO BE SOLVED: To supply a substrate polishing method and device that can improve surface roughness, finish a polished face smoothly, and remove fine particles off the polishing face effectively by washing. SOLUTION: The substrate polishing method is to contact the polished face with a polishing tool face and polish and wash the polished face. The polished face of the substrate 1 is pressed by a specified pressure to the polishing tool face 59 that makes a circular and translational motion and has almost the same diameter as the substrate diameter plus the eccentric amount caused by the circular and translational motion. The polished face of the substrate is polished and washed by supplying liquid out of plural discharge holes 57 and 58 dispersed and opened in the polishing tool face. COPYRIGHT: (C)2004,JPO&NCIPI

8. 发明专利

JP2010027743A Glass substrate for imprint, resist pattern forming method, and method and apparatus for inspecting glass substrate for imprint 审中-公开
标题翻译：用于印刷的玻璃基板，电阻图案形成方法，以及用于检查玻璃基板的印刷方法和装置
公开(公告)号：JP2010027743A
公开(公告)日：2010-02-04
申请号：JP2008185236
申请日：2008-07-16
申请人： Ebara Corp , 株式会社荏原製作所
发明人： HATAKEYAMA MASAKI , KIMURA NORIO
IPC分类号： H01L21/027 , B29C33/38 , B29C59/02 , G01N23/225
CPC分类号： G01N23/2251
摘要： PROBLEM TO BE SOLVED: To provide a glass substrate for imprint, a resist pattern forming method, and a method and an apparatus for inspecting the glass substrate for imprint, with which high-sensitivity, high-inspection speed and high-throughput can be achieved with respect to a pattern and an extraneous substance with ultra fine size. SOLUTION: The glass substrate 30 for imprint has a glass substrate 10 having a pattern surface 11 where a fine pattern 15 for imprint is formed, and the pattern surface is coated with a transmissive conductive film 20. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供用于印刷的玻璃基板，抗蚀剂图案形成方法以及用于检查用于印刷的玻璃基板的方法和装置，其具有高灵敏度，高检查速度和高通量可以相对于具有超细尺寸的图案和外来物质来实现。解决方案：用于压印的玻璃基板30具有具有图案表面11的玻璃基板10，其中形成用于印记的精细图案15，并且图案表面涂覆有透射导电膜20.版权：（ C）2010，JPO＆INPIT

9. 发明专利

JP2008267835A Electron beam device and specimen observation method using this 有权
标题翻译：电子束装置和样本观测方法
公开(公告)号：JP2008267835A
公开(公告)日：2008-11-06
申请号：JP2007107564
申请日：2007-04-16
申请人： Ebara Corp , 株式会社荏原製作所
发明人： KAGA TORU , TERAO KENJI , HATAKEYAMA MASAKI , WATANABE KENJI , NAITO YOSHIHIKO , MURAKAMI TAKESHI , KIMURA NORIO
IPC分类号： G01N23/225 , G01B15/04 , H01J37/20 , H01J37/28 , H01J37/29 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide an electron beam device dispensing with the installation of a pre-charge unit by giving the function of pre-charge to a primary optical system while optimizing pre-charge in response to the specimen by controlling the area and amount of the pre-charge to the specimen. SOLUTION: This electron beam device is characterized by including: a stage 30 for mounting the specimen S thereon; the primary optical system 10 generating an electron beam having a prescribed application area 15 to apply the electron beam to the specimen; a secondary optical system 20 for detecting electrons which are generated by the application of the electron beam to the specimen and given structure information on the specimen, thereby acquiring an image of the specimen with respect to a prescribed view area 25; and application area changing means 13 and 14 capable of changing the position of the prescribed the application area relative to the prescribed view area. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种电子束装置，通过给初级光学系统提供预充电的功能来分配预充电单元的安装，同时通过控制该样品来优化响应于样品的预充电试样的预充电面积和数量。该电子束装置的特征在于包括：用于将试样S安装在其上的平台30; 主光学系统10产生具有规定的施加区域15的电子束，以将电子束施加到样本; 用于检测通过向样本施加电子束而产生的电子的二次光学系统20，并且给出了样本上的结构信息，从而获取相对于规定视野区域25的样本的图像; 以及能够改变规定的应用区域相对于规定视野区域的位置的应用区域改变装置13和14。版权所有（C）2009，JPO＆INPIT

10. 发明专利

JP2008210715A Charged particle beam device, and sample surface observation method using the same 审中-公开
标题翻译：充电颗粒光束装置和使用其的样品表面观察方法
公开(公告)号：JP2008210715A
公开(公告)日：2008-09-11
申请号：JP2007047999
申请日：2007-02-27
申请人： Ebara Corp , 株式会社荏原製作所
发明人： NAITO YOSHIHIKO , KIMURA NORIO , HATAKEYAMA MASAKI , TERAO KENJI
IPC分类号： H01J37/28 , H01J37/18 , H01J37/244
摘要： PROBLEM TO BE SOLVED: To provide a charged particle beam device capable of observing a sample surface by easily detecting potential contrast of the sample surface based on a capacitance difference of the sample by irradiating the sample with charged particles through a dielectric material, while the sample is arranged in the atmosphere; and to provide a sample observation method using the same. SOLUTION: The charged particle beam device 100 used for observing a sample surface by using a charged particle beam is characterized by including: vacuum housing 10 with internal pressure kept in a vacuum condition; a dielectric film 11 formed on part of the vacuum housing; a sample base 60 for mounting the sample 80 at a position facing the dielectric film; a dielectric material supply means 70 supplying a dielectric material 90 coming into contact with both the dielectric film and the sample, the supply means 70 being provided between the dielectric film and the sample; a charged particle beam source 20 irradiating the dielectric film with a charged particle beam from the vacuum housing side; and an electron detector 40 detecting electrons generated in the vacuum housing from the dielectric film. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决问题的方案为了提供一种带电粒子束装置，其能够通过容易地通过电介质材料照射带有粒子的样品，基于样品的电容差容易地检测样品表面的潜在对比度来观察样品表面，样品排列在大气中; 并提供使用其的样品观察方法。解决方案：用于通过使用带电粒子束观察样品表面的带电粒子束装置100的特征在于包括：内部压力保持在真空条件下的真空壳体10; 形成在真空壳体的一部分上的电介质膜11; 用于将样品80安装在面向电介质膜的位置的样品基底60; 介质材料供给装置70，供给与电介质膜和样品两者接触的电介质材料90，供给装置70设置在电介质膜和样品之间; 带电粒子束源20从真空容器侧照射带电粒子束的电介质膜; 以及电子检测器40，从电介质膜检测真空壳体中产生的电子。版权所有（C）2008，JPO＆INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式