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1. 发明专利

JP2014216391A 基板処理装置及び処理基板の製造方法有权
标题翻译：基板加工装置及制造加工基板的方法
公开(公告)号：JP2014216391A
公开(公告)日：2014-11-17
申请号：JP2013090693
申请日：2013-04-23
申请人：株式会社荏原製作所 , Ebara Corp
发明人： YOKOYAMA TOSHIO , KUNISAWA JUNJI , MIYAZAKI MITSURU , HONBO MITSUAKI , TOYOMURA NAOKI
IPC分类号： H01L21/683
CPC分类号： H01L21/68
摘要：【課題】基板の跳ね上がりを回避することができる基板処理装置及び処理基板の製造方法を提供する。【解決手段】基板処理装置は、第1及び第2のローラ11A、11Bが基板Wを保持する第1の保持位置と、基板Wから離れた第1の解除位置と、の間を移動可能な第1の基板保持装置10と、第3のローラ23Aが第1及び第2のローラ11A、11Bと協働して基板Wを保持する第2の保持位置と、基板Wから離れた第2の解除位置と、の間を移動可能な第2の基板保持装置20と、基板Wの平面位置を所定の位置に維持する基板平面位置維持部31と、制御部61とを備える。第2の基板保持装置20は、第2の保持位置にあるときに基板Wに向けて第3のローラ23Aを押し付ける押し付け装置26を有する。制御部61は、基板Wの保持を解除する際に、第2の基板保持装置20の移動を開始させた後に、第1の基板保持装置10の移動を開始させる。【選択図】図2
摘要翻译：要解决的问题：提供一种基板处理装置和能够避免基板跳起的处理基板的制造方法。解决方案：基板处理装置包括第一基板保持装置10，其能够在第一保持位置第一和第二辊子11A，11B将衬底W和第一释放位置保持离开衬底W，第二衬底保持装置20可在第三辊23A与第一和第二辊11A，11B配合的第二保持位置之间移动将基板W和第二释放位置保持在远离基板W的位置，用于将基板W的顶视位置保持在预定位置的基板俯视位置保持部31和控制部61.第二基板保持装置20包含用于在位于第二保持位置时将第三辊23A朝向基板W按压的按压装置26。控制部61在剥离基板W的保持时开始第二基板保持装置20的移动，然后开始第一基板保持装置10的移动。

2. 发明专利

JP2014086666A Polishing device and polishing method 有权
标题翻译：抛光装置和抛光方法
公开(公告)号：JP2014086666A
公开(公告)日：2014-05-12
申请号：JP2012236654
申请日：2012-10-26
申请人： Ebara Corp , 株式会社荏原製作所
发明人： MIYAZAKI MITSURU , KOBAYASHI KENICHI , HONBO MITSUAKI , IMAMURA HAYAO , DONG BOYU , SHINOZAKI HIROYUKI
IPC分类号： H01L21/304 , B24B37/30 , B24B37/34
CPC分类号： H01L21/30625 , B24B37/30 , B24B37/34 , B24B37/345 , H01L21/67051 , H01L21/67219
摘要： PROBLEM TO BE SOLVED: To stabilize the polishing performance or the cleaning performance of a cleaning module for use in subsequent cleaning, by allowing efficient cleaning of a substrate held on the lower surface of a top ring along with the lower surface of a top ring.SOLUTION: A polishing device includes a polishing table having a polishing surface, a top ring 31A movable freely between a polishing position above the polishing table, a position of the polishing table side, and a cleaning position, and pressing a substrate W, while holding on the lower surface thereof, toward the polishing surface with the outer periphery of the substrate W being surrounded by a retainer ring 40, and an auxiliary cleaning section 100 located at the cleaning position, and cleaning the substrate W held by the top ring 31A, along with the lower surface of the top ring 31A, by jetting a cleaning solution toward the lower surface of the top ring 31A.
摘要翻译：要解决的问题：为了稳定用于后续清洁的清洁模块的抛光性能或清洁性能，通过允许有效地清洁保持在顶环的下表面上的基板以及顶环的下表面。解决方案：抛光装置包括具有抛光表面的抛光台，在抛光台上方的研磨位置之间可自由移动的顶环31A，抛光台侧的位置和清洁位置，同时按压基板W，同时保持在基板W的外周被保持环40包围的辅助清洁部100和位于清洗位置的辅助清洁部100进行清扫，并且，通过顶环31A保持基板W，与顶环31A的下表面一起，通过向顶环31A的下表面喷射清洁溶液。

3. 发明专利

JP2011181644A Method and apparatus for cleaning substrate 有权
标题翻译：清洗基板的方法和装置
公开(公告)号：JP2011181644A
公开(公告)日：2011-09-15
申请号：JP2010043784
申请日：2010-03-01
申请人： Ebara Corp , 株式会社荏原製作所
发明人： O CHIKAAKI , OIKAWA FUMITOSHI , ONO HARUKO , HONBO MITSUAKI
IPC分类号： H01L21/304
CPC分类号： H01L21/67046 , B08B1/04
摘要： PROBLEM TO BE SOLVED: To scrub all cleaning object surfaces of a substrate with further uniform cleaning intensity by considering cleaning intensity in respective locations (regions) along the radial direction of the cleaning object surface of the substrate. SOLUTION: In a method for cleaning a substrate, a cleaning object surface of a substrate is scrubbed by bringing a circumferential surface of a roll-shaped cleaning member 24 into contact with the cleaning object surface of the rotating substrate W at a predetermined contact width. During at least a part of the overall process of the scrub cleaning by the cleaning member 24, the scrub cleaning is performed by arranging the cleaning member 24 at an offset cleaning position where the axis O 5 of the cleaning member 24 is spaced from the rotating center line O 4 of the substrate W with a distance of 0.14-0.5 time of the contact width. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：通过考虑沿着基板的清洁对象表面的径向的各个位置（区域）中的清洁强度，以更均匀的清洁强度来清洗基板的所有清洁物体表面。解决方案：在清洗基板的方法中，通过使辊状清洁部件24的周面以预定的方式与旋转基板W的清洁对象面接触来洗涤基板的清洁对象面接触宽度在通过清洁构件24擦洗清洁的整个过程的至少一部分期间，擦洗清洁是通过将清洁构件24布置在偏移清洁位置来执行的，其中清洁的轴线O 5 构件24与接触宽度的0.14-0.5倍的距离与衬底W的旋转中心线O 4 间隔开。版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2003027288A Plating equipment and plating method 有权
标题翻译：镀层设备和镀层方法
公开(公告)号：JP2003027288A
公开(公告)日：2003-01-29
申请号：JP2001209679
申请日：2001-07-10
申请人： Ebara Corp , 株式会社荏原製作所
发明人： MATSUDA NAOKI , HONBO MITSUAKI
IPC分类号： C25D7/12 , C25D17/00 , C25D17/06 , C25D17/12
摘要： PROBLEM TO BE SOLVED: To plate a work while preventing air bubbles from remaining on the surface to be plated of the work, to make maintenance free and to prevent the work from acting as a source for generating particles.
SOLUTION: The plating equipment has a holding section 14 which freely attachably and detachably holds the work W and plates the work by contacting or immersing the surface to be plated of the work W with or into a plating solution 10 and an anode 16 which is arranged in a position confronting the work W held by the holding section 14. A liquid 38 which touches the periphery of the surface to be plated of the work W when the work W is held, is internally held and has electrical conductivity, and a plurality of power source contact sections 26 which are immersed into this liquid 38 and feed electricity to the surface to be plated of the work W through contacts 32 are arranged by being spaced from each other in the holding section 14.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：在防止气泡残留在要被电镀的表面上的工作时，进行平板化，以免维护，并防止工作作为产生颗粒的源。解决方案：电镀设备具有保持部分14，其可自由地安装和拆卸地保持工件W，并通过将工件W的待镀表面与镀液10和阳极16接触或浸渍而进行工件平铺，阳极16布置在与由保持部14保持的工件W相对的位置上。在保持工件W时，接触工件W的被镀面的周边的液体38被内部保持并具有导电性，浸入该液体38中的电源接触部26通过接点32向工件W的被镀面施加电力，在保持部14中彼此间隔设置。

5. 发明专利

JP2014082470A Substrate processing apparatus 审中-公开
标题翻译：基板加工设备
公开(公告)号：JP2014082470A
公开(公告)日：2014-05-08
申请号：JP2013193712
申请日：2013-09-19
申请人： Ebara Corp , 株式会社荏原製作所
发明人： MIYAZAKI MITSURU , KOBAYASHI KENICHI , HONBO MITSUAKI , IMAMURA HAYAO , DONG BOYU , SHINOZAKI HIROYUKI
IPC分类号： H01L21/304 , H01L21/677
CPC分类号： H01L21/6719 , H01L21/67046 , H01L21/67051 , H01L21/67178 , H01L21/67207 , H01L21/67745 , H01L21/68728
摘要： PROBLEM TO BE SOLVED: To enable flexible response to change in cleaning pattern corresponding to difference in the quality and the like of a film such as an oxide film while achieving improvement in throughput and space saving.SOLUTION: A substrate processing apparatus comprises: a first clean room 190 including at least one first cleaning module 200a and two second cleaning modules 201a, 201b which are arranged sequentially in a longitudinal direction; a second cleaning room 192 including two third cleaning modules 202a, 202b arranged in the longitudinal direction; and a first transfer robot 240 which is housed in a first transfer chamber 191 between the first cleaning room 190 and the second cleaning room 192, for transferring a substrate among the first cleaning module 200a, the second cleaning modules 201a, 201b and the third cleaning modules 202a, 202b.
摘要翻译：要解决的问题：为了实现对应于诸如氧化膜的膜的质量差异等的清洁图案的变化的灵活响应，同时实现了生产量和空间节省的改善。解决方案：一种基板处理装置，包括：第一清洁室190，其包括沿纵向依次布置的至少一个第一清洁模块200a和第二清洁模块201a，201b; 第二清洁室192，包括沿纵向布置的两个第三清洁模块202a，202b; 以及第一传送机械手240，其容纳在第一清洁室190和第二清洁室192之间的第一传送室191中，用于在第一清洁模块200a，第二清洁模块201a，201b和第三清洁模块201b之间传送基板模块202a，202b。

6. 发明专利

JP2008115457A Plating device and plating method 审中-公开
标题翻译：镀层装置和镀层方法
公开(公告)号：JP2008115457A
公开(公告)日：2008-05-22
申请号：JP2007167171
申请日：2007-06-26
申请人： Ebara Corp , 株式会社荏原製作所
发明人： KAWASHIMA KIYOTAKA , MUKOYAMA YOSHITAKA , KATSUOKA SEIJI , HONBO MITSUAKI , NAGAI MIZUKI
IPC分类号： C23C18/31 , C23C18/18
摘要： PROBLEM TO BE SOLVED: To form a metal film with a uniform film thickness on the surface of a glass substrate with rectangular, planar shape having a wide surface area by a series of operations. SOLUTION: The plating device comprises: a substrate holder 16 for holding a glass substrate carried into a load stage 14, while held between the edge faces of the glass substrate; a transporter 58 for carrying the substrate holder 16 holding the glass substrate while it is held; a plating tank 32 where the glass substrate is dipped into a plating liquid while held by the substrate holder 16, and the surface of the glass substrate is plated; post-cleaning tanks 34, 38 where the surface of the glass substrate after the plating held by the substrate holder 16 is cleaned while being held by the substrate holder; and a drying stage 54 where the glass substrate after the cleaning is taken out from the substrate holder 16 and is dried while being run to one direction, and the glass substrate after the drying is delivered to an unload stage 56. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：通过一系列操作在具有宽表面积的矩形平面形状的玻璃基板的表面上形成具有均匀膜厚度的金属膜。电镀装置包括：基板保持件16，用于将保持在玻璃基板的边缘面之间的玻璃基板保持在载置台14中; 用于在保持玻璃基板的同时承载保持玻璃基板的基板保持件16的运送器58; 电镀槽32，其中玻璃基板在由基板保持件16保持的同时浸入电镀液中，并且玻璃基板的表面被镀覆; 后清洗槽34,38，其中由衬底保持器16保持的镀覆后的玻璃基板的表面在被基板保持器保持的同时被清洁; 以及干燥台54，其中清洁后的玻璃基板从基板保持件16取出并沿一个方向进行干燥，干燥后的玻璃基板被输送到卸载台56.版权所有：（C）2008，JPO＆INPIT

7. 发明专利

JP2003253488A ELECTROLYTIC TREATMENT APPARATUS 审中-公开
公开(公告)号：JP2003253488A
公开(公告)日：2003-09-10
申请号：JP2002061699
申请日：2002-03-07
申请人： EBARA CORP
发明人： HONGO AKIHISA , SENDAI SATOSHI , TOMIOKA MASAYA , HONBO MITSUAKI
IPC分类号： C25D5/08 , C25D7/12 , C25F7/00 , H01L21/288
摘要： PROBLEM TO BE SOLVED: To provide an electrolytic treatment apparatus with which electrolytic treatment of the surface of a substrate can be uniformly carried out without generating defects. SOLUTION: A surface S to be plated is plated by filling a plating liquid Q between a base plate W having a contact point with a cathode and an anode 20 opposed to the base plate W. A rectification box 50 is provided between the base plate W and the anode 20 in the plating liquid Q. In the rectification box 50, a porous cathode side member 51 and a porous anode side member 55 are arranged opposed to each other through a gap 58, and plating liquid injection nozzles 65 are provided for inpouring the plating liquid toward central directions from a plurality of peripheral parts of the gap 58. The plating liquid Q is allowed to separately flow toward the both of the base plate W and the anode 20 through the faces of the porous cathode side member 51 and the porous anode side member 55 by inpouring the plating liquid Q into the rectification box 50 from the plating liquid injection nozzles 65. COPYRIGHT: (C)2003,JPO

8. 发明专利

JP2003183892A PLATING APPARATUS 审中-公开
公开(公告)号：JP2003183892A
公开(公告)日：2003-07-03
申请号：JP2001388157
申请日：2001-12-20
申请人： EBARA CORP
发明人： HONGO AKIHISA , HONBO MITSUAKI
IPC分类号： C25D5/08 , C25D7/12 , C25D17/00 , H01L21/288
摘要： PROBLEM TO BE SOLVED: To prevent the variation in within-plane uniformity of a plating film which is formed, by using a soluble anode as the anode, on the plane (surface) to be plated of a substrate accompanying the dissolution of the anode caused by the progress of plating. SOLUTION: This apparatus has a plating vessel 50 for holding a plating liquid Q; a substrate holder 52 arranged above the plating vessel 50 for freely detachably holding a substrate W with its plane to be plated kept downward; a plating liquid jet nozzle 60 for horizontally jetting the plating liquid from the periphery of the plating vessel 50 toward the center; a soluble anode 54 arranged and dipped in the plating liquid Q in the plating vessel 50; and a straightening plate 68 which is arranged above the anode 54 and below a plane formed by the plating liquid jet nozzle 60 and straightens the flow of the plating liquid Q. COPYRIGHT: (C)2003,JPO

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