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1. 发明申请

WO0237526A9 ELECTRON BEAM APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE COMPRISING THE APPARATUS 审中-公开
标题翻译：电子束装置及制造包含该装置的半导体装置的方法
公开(公告)号：WO0237526A9
公开(公告)日：2002-08-08
申请号：PCT/JP0109629
申请日：2001-11-02
申请人： EBARA CORP , NIPPON KOGAKU KK
发明人： NAKASUJI MAMORU , SATAKE TOHRU , WATANABE KENJI , MURAKAMI TAKESHI , NOJI NOBUHARU , SOBUKAWA HIROSI , KARIMATA TSUTOMU , YOSHIKAWA SHOJI , KIMBA TOSHIFUMI , OOWADA SHIN , SAITO MUTSUMI , HAMASHIMA MUNEKI , TAKAGI TORU , KIHARA NAOTO , NISHIMURA HIROSHI
IPC分类号： G01N23/225 , G01Q30/06 , H01J37/06 , H01J37/073 , H01J37/18 , H01J37/20 , H01J37/22 , H01J37/244 , H01J37/28 , H01J37/29 , H01L21/027 , H01L21/66
CPC分类号： H01J37/185 , G01N23/225 , G01N23/2251 , H01J37/06 , H01J37/073 , H01J37/20 , H01J37/222 , H01J37/244 , H01J37/28 , H01J2237/082 , H01J2237/202 , H01J2237/20228 , H01J2237/204 , H01J2237/22 , H01J2237/24564 , H01J2237/2806 , H01J2237/2816 , H01J2237/2817
摘要： An electron beam apparatus for evaluating a sample face which comprises a primary electro-optical system irradiating the sample with primary electron beams, a detection system, and a secondary electro-optical system directing the secondary electron beam generated from the sample face by irradiation with the primary electron beam to the detection system. The electron beam apparatus is characterized by comprising a multi-beam generator included in the primary electro-optical system to generate electrons emitted from an electron gun as primary electron beams, a scanning deflector included in the primary electro-optical system to scan the sample simultaneously with the primary electron beams, an objective lens included in common in the primary electro-optical system and the secondary electro-optical system to irradiate the sample with decelerated primary electron beams and to accelerate the secondary electron beams emitted from the irradiated point on the sample with the primary electron beams, a secondary electron beam separator included in the primary and secondary electro-optical systems to deflect the secondary electron beams passing through the objective lens from the primary electro-optical system to the secondary electro- optical system, a magnifying lens of at least one stage included in the secondary electro-optical lens to magnify the deflected secondary electron beams, and detectors included in the detection system and provided in accordance with the secondary electron beams for the secondary electro-optical system to detect secondary electron beams.
摘要翻译：一种电子束装置，用于评估样品面，该样品面包括用一次电子束照射样品的主电光系统，检测系统和二次电子光学系统，该样品面通过照射一次电子束到检测系统。电子束装置的特征在于包括：包含在主电光系统中的多束发生器，用于产生从电子枪发射的电子作为主电子束;包括在主电光系统中的扫描偏转器，用于同时扫描样品利用一次电子束在主电子光学系统和二次电子光学系统中共同包括的物镜照射具有减速的一次电子束的样品并且加速从样品上的照射点发射的二次电子束利用主电子束，包括在初级和次级电光系统中的次级电子束分离器，将通过物镜的次级电子束从初级电光系统偏转到次级电光系统，放大镜头包括在次级电光学透镜中的至少一个级的大小被偏转的二次电子束以及包括在检测系统中并且根据用于二次电子光学系统的二次电子束提供的检测器来检测二次电子束。

2. 发明专利

SG11201708029SA FILM-THICKNESS MEASURING METHOD, FILM-THICKNESS MEASURING APPARATUS, POLISHING METHOD, AND POLISHING APPARATUS 未知
公开(公告)号：SG11201708029SA
公开(公告)日：2017-10-30
申请号：SG11201708029S
申请日：2016-04-05
申请人： EBARA CORP
发明人： KIMBA TOSHIFUMI
IPC分类号： G01B11/06 , B24B37/013 , B24B49/04 , B24B49/12 , H01L21/304
摘要： The present invention relates to a film-thickness measuring method for detecting a film thickness by analyzing optical information contained in a reflected light from a substrate. The film-thickness measuring method includes producing a spectral waveform indicating a relationship between intensity and wavelength of reflected light from a substrate; performing Fourier transform processing on the spectral waveform to determine strengths of frequency components and corresponding film thicknesses; determining local maximum values (M1, M2) of the strengths of the frequency components; and selecting, according to a preset selection rule, one film thickness from film thicknesses (t1, t2) corresponding respectively to the local maximum values (M1, M2). The selection rule is either to select an N-th largest film thickness or to select an N-th smallest film thickness, and N is a predetermined natural number.

3. 发明专利

DE60028709T2 未知
公开(公告)号：DE60028709T2
公开(公告)日：2007-05-24
申请号：DE60028709
申请日：2000-12-13
申请人： EBARA CORP
发明人： KIMBA TOSHIFUMI , NAKAI SHUNSUKE
IPC分类号： B24B37/013 , B24B49/12 , B24D7/12 , G01B11/06 , H01L21/304 , H01L21/306 , H01L21/66
摘要： A jet of water in a cylindrical form is supplied from a jet nozzle onto a measurement surface of a substrate to form a column of the water extending between the nozzle and the measurement surface. Light is emitted from an irradiation fiber and transmitted through the column of water to the measurement surface. The light reflected by the measurement surface is received by a light-receiving fiber through the column of water. A measurement calculation unit measures the thickness of a film formed on the substrate, based on the intensity of the reflected light.

4. 发明公开

EP1261016A4 ELECTRON BEAM DEVICE AND SEMICONDUCTOR DEVICE PRODUCTION METHOD USING THE DEVICE 审中-公开
标题翻译： ELECTRON DEVICE而那些使用的半导体模块的制造方法
公开(公告)号：EP1261016A4
公开(公告)日：2007-06-27
申请号：EP01980965
申请日：2001-11-02
申请人： EBARA CORP
发明人： NAKASUJI MAMORU , NOJI NOBUHARU , SATAKE TOHRU , HAMASHIMA MUNEKI , HATAKEYAMA MASAHIRO , WATANABE KENJI , KATO TAKAO , SOBUKAWA HIROSI , KARIMATA TSUTOMU , YOSHIKAWA SHOJI , KIMBA TOSHIFUMI , OOWADA SHIN , SAITO MUTSUMI
IPC分类号： G01N23/225 , H01J37/06 , H01J37/063 , H01J37/073 , H01J37/18 , H01J37/20 , H01J37/22 , H01J37/244 , H01J37/28 , H01J37/29 , H01L21/027 , H01L21/66
CPC分类号： B82Y10/00 , B82Y40/00 , G01N23/225 , H01J37/06 , H01J37/063 , H01J37/073 , H01J37/185 , H01J37/20 , H01J37/222 , H01J37/244 , H01J37/28 , H01J37/3174 , H01J2237/0435 , H01J2237/0635 , H01J2237/082 , H01J2237/202 , H01J2237/20228 , H01J2237/204 , H01J2237/22 , H01J2237/2446 , H01J2237/24485 , H01J2237/24564 , H01J2237/2806 , H01J2237/2816 , H01J2237/2817
摘要： An electron beam device for applying a primary electron beam onto a sample, and detecting a secondary electron beam produced from a sample surface by the irradiation to evaluate the sample surface, characterized in that the cathode of an electron gun for emitting primary electron beam have a plurality of emitters disposed at intervals on one circle centered on the optical axis of a primary electron optical system and emitting a primary electron beam, and the plurality of emitters are disposed so that points projected on a line parallel to the scanning direction of the primary electron beam are arranged at equal intervals.

6. 发明公开

EP1296352A4 CHARGED PARTICLE BEAM INSPECTION APPARATUS AND METHOD FOR FABRICATING DEVICE USING THAT INSPECTION APPARATUS 审中-公开
标题翻译：检查设备的带电粒子和方法的用于制造部件与本次调查DEVICE
公开(公告)号：EP1296352A4
公开(公告)日：2007-04-18
申请号：EP01945627
申请日：2001-06-27
申请人： EBARA CORP , TOSHIBA KK
发明人： NAKASUJI MAMORU , NOJI NOBUHARU , SATAKE TOHRU , HATAKEYAMA MASAHIRO , KIMBA TOSHIFUMI , SOBUKAWA HIROSI , YOSHIKAWA SHOJI , MURAKAMI TAKESHI , WATANABE KENJI , KARIMATA TSUTOMU , OOWADA SHIN , SAITO MUTSUMI , YAMAZAKI YUICHIRO , NAGAI TAKAMITSU , NAGAHAMA ICHIROTA
IPC分类号： G01N23/225 , H01J37/06 , H01J37/073 , H01J37/18 , H01J37/20 , H01J37/22 , H01J37/244 , H01J37/28 , H01J37/29 , G01B15/00 , H01L21/66
CPC分类号： H01J29/70 , G01N23/225 , G01N23/2251 , G01N23/227 , H01J37/06 , H01J37/073 , H01J37/141 , H01J37/185 , H01J37/20 , H01J37/222 , H01J37/244 , H01J37/266 , H01J37/28 , H01J2237/082 , H01J2237/202 , H01J2237/20228 , H01J2237/204 , H01J2237/22 , H01J2237/24564 , H01J2237/2806 , H01J2237/2816 , H01J2237/2817 , H01L21/6719 , H01L21/67213
摘要： An electron beam inspection apparatus comprising an electrooptical unit (70) comprising an electrooptical system for irradiating an object with a primary electron beam from an electron source and projecting the image of secondary electrons emitted from the object and a detector for detecting the image of secondary electrons projected from the electrooptical system, a stage unit (50) for moving the object relatively to the electrooptical system while holding it a mini-environment unit (20) for blocking adhesion of dust to the object by supplying cleaning gas thereto, a working chamber (31) containing the stage unit and controllable to vacuum atmosphere, at least two loading chambers (41, 42) disposed between the mini-environment unit and the working chamber and controllable independently to vacuum atmosphere, and a loader (60) for feeding the object to the stage unit through the loading chambers.

7. 发明公开

EP1304717A4 SHEET BEAM TEST APPARATUS 审中-公开
标题翻译： SHEET-BEAM试验装置
公开(公告)号：EP1304717A4
公开(公告)日：2009-12-09
申请号：EP01945626
申请日：2001-06-27
申请人： EBARA CORP
发明人： NAKASUJI MAMORU , NOJI NOBUHARU , SATAKE TOHRU , KIMBA TOSHIFUMI , SOBUKAWA HIROSI , KARIMATA TSUTOMU , OOWADA SHIN , YOSHIKAWA SHOJI , SAITO MUTSUMI
IPC分类号： G01N23/225 , G03F1/76 , G03F1/78 , H01J37/06 , H01J37/073 , H01J37/18 , H01J37/20 , H01J37/22 , H01J37/244 , H01J37/28 , H01J37/29 , G01B15/00 , H01L21/30
CPC分类号： G01N23/225 , H01J37/06 , H01J37/073 , H01J37/185 , H01J37/20 , H01J37/222 , H01J37/244 , H01J37/28 , H01J2237/082 , H01J2237/202 , H01J2237/20228 , H01J2237/204 , H01J2237/22 , H01J2237/24564 , H01J2237/2806 , H01J2237/2816 , H01J2237/2817

8. 发明公开

EP1273907A4 WAFER INSPECTING METHOD, WAFER INSPECTING INSTRUMENT, AND ELECTRON BEAM APPARATUS 审中-公开
标题翻译：手段和工具晶片检测和ELECTRON DEVICE
公开(公告)号：EP1273907A4
公开(公告)日：2006-08-30
申请号：EP01980963
申请日：2001-11-02
申请人： EBARA CORP
发明人： NAKASUJI MAMORU , NOJI NOBUHARU , SATAKE TOHRU , HAMASHIMA MUNEKI , KIMBA TOSHIFUMI , HATAKEYAMA MASAHIRO , WATANABE KENJI , SOBUKAWA HIROSI , KARIMATA TSUTOMU , YOSHIKAWA SHOJI , OOWADA SHIN , SAITO MUTSUMI
IPC分类号： G01N23/225 , H01J37/06 , H01J37/073 , H01J37/18 , H01J37/20 , H01J37/22 , H01J37/244 , H01J37/28
CPC分类号： G01N23/225 , H01J37/06 , H01J37/073 , H01J37/185 , H01J37/20 , H01J37/222 , H01J37/244 , H01J37/28 , H01J2237/082 , H01J2237/202 , H01J2237/20228 , H01J2237/204 , H01J2237/22 , H01J2237/24564 , H01J2237/2806 , H01J2237/2816 , H01J2237/2817
摘要： A wafer inspecting instrument for inspecting a pattern formed on a wafer by irradiating the wafer with a charged particle beams. The wafer inspecting instrument comprises a charged particle beam generating means, a primary optical system including a means for irradiating a multi-aperture plate having a plurality of apertures with a charged particle beam generated from the beam generating means and for focusing a plurality of charged particle beams having passed through the apertures in the wafer surface, a secondary optical system which secondary charged particle beams radiated from the wafer enter, an electron beam apparatus including a detection system for detecting the secondary charged particle beam to output an electric signal and a processing control system for processing and evaluating the electric signal, a stage apparatus for holding and moving the wafer, and a working chamber which can be controlled to a desired atmosphere.

9. 发明专利

SG10201604365YA POLISHING APPARATUS 未知
公开(公告)号：SG10201604365YA
公开(公告)日：2017-01-27
申请号：SG10201604365Y
申请日：2016-05-30
申请人： EBARA CORP
发明人： KIMBA TOSHIFUMI
摘要： A polishing apparatus capable of measuring a film thickness of a wafer using a plurality of optical sensors, without using an optical-path switching device for optical fibers, is disclosed. The polishing apparatus includes: an illuminating fiber having a plurality of distal ends arranged at different locations in a polishing table; a spectrometer configured to break up reflected light from a wafer in accordance with wavelength and measure an intensity of the reflected light at each of wavelengths; a light-receiving fiber having a plurality of distal ends arranged at the different locations in the polishing table; and a processor configured to generate a spectral waveform indicating a relationship between the intensity and wavelength of the reflected light and determine a film thickness based on the spectral waveform.

10. 发明专利

DE60028709D1 未知
公开(公告)号：DE60028709D1
公开(公告)日：2006-07-27
申请号：DE60028709
申请日：2000-12-13
申请人： EBARA CORP
发明人： KIMBA TOSHIFUMI , NAKAI SHUNSUKE
IPC分类号： B24B37/013 , B24B49/12 , B24D7/12 , G01B11/06 , H01L21/304 , H01L21/306 , H01L21/66
摘要： A jet of water in a cylindrical form is supplied from a jet nozzle onto a measurement surface of a substrate to form a column of the water extending between the nozzle and the measurement surface. Light is emitted from an irradiation fiber and transmitted through the column of water to the measurement surface. The light reflected by the measurement surface is received by a light-receiving fiber through the column of water. A measurement calculation unit measures the thickness of a film formed on the substrate, based on the intensity of the reflected light.

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