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1. 发明申请

WO2004068529A3 MAPPING-PROJECTION-TYPE ELECTRON BEAM APPARATUS FOR INSPECTING SAMPLE BY USING ELECTRONS REFLECTED FROM THE SAMPLE 审中-公开
标题翻译：用于通过使用从样品反射的电子检查样品的映射型投影型电子束装置
公开(公告)号：WO2004068529A3
公开(公告)日：2004-12-09
申请号：PCT/JP2004000711
申请日：2004-01-27
申请人： EBARA CORP , TOSHIBA KK , WATANABE KENJI , MURAKAMI TAKESHI , HATAKEYAMA MASAHIRO , HIRABAYASHI YOSHINAO , SATAKE TOHRU , NOJI NOBUHARU , YAMAZAKI YUICHIRO , NAGAHAMA ICHIROTA
发明人： WATANABE KENJI , MURAKAMI TAKESHI , HATAKEYAMA MASAHIRO , HIRABAYASHI YOSHINAO , SATAKE TOHRU , NOJI NOBUHARU , YAMAZAKI YUICHIRO , NAGAHAMA ICHIROTA
IPC分类号： G01N23/225 , H01J37/32 , H01J37/244 , G01N23/203 , H01L21/66
CPC分类号： H01J37/32211 , G01N23/225 , H01J37/32357 , H01J2237/2441 , H01J2237/2446
摘要： An apparatus capable of detecting defects of a pattern on a sample with high accuracy and reliability and at a high throughput, and a semiconductor manufacturing method using the same are provided. The electron beam apparatus is a mapping-projection-type electron beam apparatus for observing or evaluating a surface of the sample by irradiating the sample with a primary electron beam and forming on a detector an image of reflected electrons emitted from the sample. An electron impact-type detector such as an electron impact-type CCD or an electron impact-type TDI is used as the detector for detecting the reflected electrons. The reflected electrons are selectively detected from an energy difference between the reflected electrons and secondary electrons emitted from the sample. To eliminate charge-up caused on the sample surface by irradiation with the primary electron beam, the surface of the sample is covered with a cover placed above the sample and a gas is supplied to the space above the sample covered with the cover. The gas is brought into contact with the sample surface to reduce charge-up on the sample surface.
摘要翻译：提供了能够以高精度和可靠性以高产量检测样品上的图案的缺陷的装置，以及使用该缺陷的半导体制造方法。电子束装置是用于通过用一次电子束照射样品来观察或评价样品的表面的映射投影型电子束装置，并在检测器上形成从样品发射的反射电子的图像。作为检测反射电子的检测器，使用电子碰撞型CCD或电子碰撞型TDI等电子轰击型检测器。从反射电子和从样品发射的二次电子之间的能量差选择性地检测反射电子。为了通过照射一次电子束来消除样品表面上产生的电荷，样品的表面被放置在样品上方的盖子覆盖，并将气体供应到覆盖有覆盖物的样品上方。气体与样品表面接触以减少样品表面的充电。

2. 发明申请

WO02056332A8 INSPECTION APPARATUS AND INSPECTION METHOD WITH ELECTRON BEAM, AND DEVICE MANUFACTURING METHOD COMPRISING THE INSPECTION APPARATUS 审中-公开
标题翻译：具有电子束的检查装置和检查方法以及包括检查装置的装置制造方法
公开(公告)号：WO02056332A8
公开(公告)日：2002-11-21
申请号：PCT/JP0109628
申请日：2001-11-02
申请人： EBARA CORP , TOSHIBA KK
发明人： YAMAZAKI YUICHIRO , WATANABE KENJI , SOBUKAWA HIROSI , NOJI NOBUHARU , SATAKE TOHRU , YOSHIKAWA SHOJI , KARIMATA TSUTOMU , NAKASUJI MAMORU , HATAKEYAMA MASAHIRO , MURAKAMI TAKESHI , NAGAHAMA ICHIROTA , NAGAI TAKAMITSU , SUGIHARA KAZUYOSHI
IPC分类号： H01J37/22 , H01J37/244 , H01J37/28 , H01J37/29 , H01L21/027 , H01L21/66
CPC分类号： H01J37/28 , H01J37/224 , H01J37/244 , H01J2237/006 , H01J2237/20221 , H01J2237/2445 , H01J2237/2817
摘要： An electron beam inspecting apparatus is a map projection type and comprises a primary electro-optical system which molds an electron beam emitted from an electron gun into a rectangular form and irradiates the surface of a sample to be inspected with the molded electron beam, a secondary electro-optical system which converges secondary electrons emitted from the sample, a detector which converts the converged secondary electrons into an optical image via a fluorescent plate to focus them to a line sensor, and a controller which controls the charge transfer time to transfer a line image captured by a pixel array provided in the line sensor by interlocking with the transfer speed of stage which moves the sample.
摘要翻译：电子束检查装置是映射投影型，包括：将从电子枪发射的电子束成形为矩形并用成形的电子束照射待检测样品的表面的主电子光学系统，次级会聚从样品发射的二次电子的电光系统，通过荧光板将会聚的二次电子转换成光学图像以将它们聚焦到线传感器的检测器，以及控制电荷转移时间以将线通过与移动样品的台的传送速度互锁，由设置在线传感器中的像素阵列捕捉的图像。

4. 发明公开

EP1296352A4 CHARGED PARTICLE BEAM INSPECTION APPARATUS AND METHOD FOR FABRICATING DEVICE USING THAT INSPECTION APPARATUS 审中-公开
标题翻译：检查设备的带电粒子和方法的用于制造部件与本次调查DEVICE
公开(公告)号：EP1296352A4
公开(公告)日：2007-04-18
申请号：EP01945627
申请日：2001-06-27
申请人： EBARA CORP , TOSHIBA KK
发明人： NAKASUJI MAMORU , NOJI NOBUHARU , SATAKE TOHRU , HATAKEYAMA MASAHIRO , KIMBA TOSHIFUMI , SOBUKAWA HIROSI , YOSHIKAWA SHOJI , MURAKAMI TAKESHI , WATANABE KENJI , KARIMATA TSUTOMU , OOWADA SHIN , SAITO MUTSUMI , YAMAZAKI YUICHIRO , NAGAI TAKAMITSU , NAGAHAMA ICHIROTA
IPC分类号： G01N23/225 , H01J37/06 , H01J37/073 , H01J37/18 , H01J37/20 , H01J37/22 , H01J37/244 , H01J37/28 , H01J37/29 , G01B15/00 , H01L21/66
CPC分类号： H01J29/70 , G01N23/225 , G01N23/2251 , G01N23/227 , H01J37/06 , H01J37/073 , H01J37/141 , H01J37/185 , H01J37/20 , H01J37/222 , H01J37/244 , H01J37/266 , H01J37/28 , H01J2237/082 , H01J2237/202 , H01J2237/20228 , H01J2237/204 , H01J2237/22 , H01J2237/24564 , H01J2237/2806 , H01J2237/2816 , H01J2237/2817 , H01L21/6719 , H01L21/67213
摘要： An electron beam inspection apparatus comprising an electrooptical unit (70) comprising an electrooptical system for irradiating an object with a primary electron beam from an electron source and projecting the image of secondary electrons emitted from the object and a detector for detecting the image of secondary electrons projected from the electrooptical system, a stage unit (50) for moving the object relatively to the electrooptical system while holding it a mini-environment unit (20) for blocking adhesion of dust to the object by supplying cleaning gas thereto, a working chamber (31) containing the stage unit and controllable to vacuum atmosphere, at least two loading chambers (41, 42) disposed between the mini-environment unit and the working chamber and controllable independently to vacuum atmosphere, and a loader (60) for feeding the object to the stage unit through the loading chambers.

5. 发明公开

EP1271604A4 INSPECTION APPARATUS AND INSPECTION METHOD WITH ELECTRON BEAM, AND DEVICE MANUFACTURING METHOD COMPRISING THE INSPECTION APPARATUS 审中-公开
标题翻译：检查设备及调查过程与调查装置中的电子和元器件制造工艺
公开(公告)号：EP1271604A4
公开(公告)日：2005-05-25
申请号：EP01978999
申请日：2001-11-02
申请人： EBARA CORP , TOSHIBA KK
发明人： YAMAZAKI YUICHIRO , WATANABE KENJI , SOBUKAWA HIROSI , NOJI NOBUHARU , SATAKE TOHRU , YOSHIKAWA SHOJI , KARIMATA TSUTOMU , NAKASUJI MAMORU , HATAKEYAMA MASAHIRO , MURAKAMI TAKESHI , NAGAHAMA ICHIROTA , NAGAI TAKAMITSU , SUGIHARA KAZUYOSHI
IPC分类号： H01J37/22 , H01J37/244 , H01J37/28 , G01N23/225
CPC分类号： H01J37/28 , H01J37/224 , H01J37/244 , H01J2237/006 , H01J2237/20221 , H01J2237/2445 , H01J2237/2817
摘要： An electron beam inspecting apparatus is a map projection type and comprises a primary electro-optical system which molds an electron beam emitted from an electron gun into a rectangular form and irradiates the surface of a sample to be inspected with the molded electron beam, a secondary electro-optical system which converges secondary electrons emitted from the sample, a detector which converts the converged secondary electrons into an optical image via a fluorescent plate to focus them to a line sensor, and a controller which controls the charge transfer time to transfer a line image captured by a pixel array provided in the line sensor by interlocking with the transfer speed of stage which moves the sample.
摘要翻译：图像投影类型的电子束检查系统包括：用于从在电子枪发射成矩形构型的电子束成形和施加成形电子束至试样表面待检查一次电子光学系统。的二次电子光学系统会聚从样品发射的二次电子。检测器通过荧光屏融合二次电子转换成光学图像上，并且所述图像聚焦到行传感器。控制器控制在哪的拾取线图像中的每对线传感器设置相关联地用于移动样品的阶段的移动速度的相邻像素行的之间传送的线传感器的电荷转移时间。

6. 发明申请

WO03038858A8 A SEMICONDUCTOR MANUFACTURING APPARATUS HAVING A BUILT-IN INSPECTION APPARATUS AND METHOD THEREFOR 审中-公开
标题翻译：具有内置检查装置的半导体制造装置及其方法
公开(公告)号：WO03038858A8
公开(公告)日：2004-02-19
申请号：PCT/JP0211450
申请日：2002-11-01
申请人： EBARA CORP , SATAKE TOHRU , NOJI NOBUHARU
发明人： SATAKE TOHRU , NOJI NOBUHARU
IPC分类号： H01L21/66 , B24B37/04 , G03F7/20 , H01J37/18 , H01J37/28 , H01J37/29 , H01L21/00
CPC分类号： H01L21/67219 , B24B37/005 , G03F7/70616 , G03F7/70991 , H01J37/28 , H01J2237/2817 , H01L21/67288 , Y10T29/41
摘要： According to the present invention, a chemical and mechanical polishing apparatus (100) for a sample such as a wafer includes a built-in inspection apparatus (25) incorporated therein. The polishing apparatus (100) further comprises a load unit (21), a chemical and mechanical polishing unit (22), a cleaning unit (23), a drying unit (24) and an unload unit (26). The chemical and mechanical polishing apparatus (100) receives a sample from a preceding step (107), carries out respective processes for the sample by said respective units disposed within the polishing apparatus (100) and then transfers the processed sample to a subsequent step (109). Sample loading and unloading means and a sample transfer means are no more necessary for transferring the sample between respective units.
摘要翻译：根据本发明，用于诸如晶片的样品的化学和机械抛光装置（100）包括结合在其中的内置检查装置（25）。抛光装置（100）还包括加载单元（21），化学和机械抛光单元（22），清洁单元（23），干燥单元（24）和卸载单元（26）。化学和机械抛光装置（100）从前面的步骤（107）接收样品，通过设置在抛光装置（100）内的各个单元对样品进行各自的处理，然后将处理的样品转移到随后的步骤 109）。样品装载和取样装置和样品转移装置不再需要在各个单元之间转移样品。

7. 发明申请

WO02103337A3 ELECTRON BEAM APPARATUS AND METHOD FOR USING SAID APPARATUS 审中-公开
标题翻译：电子束装置和使用装置的方法
公开(公告)号：WO02103337A3
公开(公告)日：2003-07-03
申请号：PCT/JP0205786
申请日：2002-06-11
申请人： EBARA CORP , NAKASUJI MAMORU , KATO TAKAO , NOJI NOBUHARU , SATAKE TOHRU , MURAKAMI TAKESHI , WATANABE KENJI
发明人： NAKASUJI MAMORU , KATO TAKAO , NOJI NOBUHARU , SATAKE TOHRU , MURAKAMI TAKESHI , WATANABE KENJI
IPC分类号： G01N23/225 , H01J3/02 , H01J3/10 , H01J37/04 , H01J37/06 , H01J37/063 , H01J37/073 , H01J37/12 , H01J37/147 , H01J37/28 , H01J37/317 , H01L21/66 , H01J37/26
CPC分类号： H01J3/10 , B82Y10/00 , B82Y40/00 , G01N23/225 , H01J3/021 , H01J37/063 , H01J37/073 , H01J37/1471 , H01J37/1472 , H01J37/3174 , H01J2237/06316 , H01J2237/2817
摘要： An electron beam apparatus, in which an electron beam emitted from an electron gun having a cathode and an anode is focused and irradiated onto a sample, and secondary electrons emanated from the sample are directed into a detector, the apparatus further comprising means for optimizing irradiation of the electron beam emitted from the electron gun onto the sample, the optimizing means may be two-stage deflectors disposed in proximity to the electron gun which deflects and directs the electron beam emitted in a specific direction so as to be in alignment with the optical axis direction of the electron beam apparatus, the electron beam emitted in the specific direction being at a certain angle with respect to the optical axis due to the fact that, among the crystal orientations of said cathode, a specific crystal orientation allowing a higher level of electron beam emission out of alignment with the optical axis direction.
摘要翻译：电子束装置，其中从具有阴极和阳极的电子枪发射的电子束被聚焦并照射到样品上，并且从样品发出的二次电子被引导到检测器中，该装置还包括用于优化照射的装置从电子枪发射到样品上的电子束的优化装置可以是设置在电子枪附近的两级偏转器，其偏转并引导沿特定方向发射的电子束以与光学器件对准电子束装置的轴方向，由于在所述阴极的晶体取向中具有更高水平的特定晶体取向的事实，在特定方向上发射的电子束相对于光轴成一定角度电子束发射与光轴方向不对准。

8. 发明申请

WO0237526A9 ELECTRON BEAM APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE COMPRISING THE APPARATUS 审中-公开
标题翻译：电子束装置及制造包含该装置的半导体装置的方法
公开(公告)号：WO0237526A9
公开(公告)日：2002-08-08
申请号：PCT/JP0109629
申请日：2001-11-02
申请人： EBARA CORP , NIPPON KOGAKU KK
发明人： NAKASUJI MAMORU , SATAKE TOHRU , WATANABE KENJI , MURAKAMI TAKESHI , NOJI NOBUHARU , SOBUKAWA HIROSI , KARIMATA TSUTOMU , YOSHIKAWA SHOJI , KIMBA TOSHIFUMI , OOWADA SHIN , SAITO MUTSUMI , HAMASHIMA MUNEKI , TAKAGI TORU , KIHARA NAOTO , NISHIMURA HIROSHI
IPC分类号： G01N23/225 , G01Q30/06 , H01J37/06 , H01J37/073 , H01J37/18 , H01J37/20 , H01J37/22 , H01J37/244 , H01J37/28 , H01J37/29 , H01L21/027 , H01L21/66
CPC分类号： H01J37/185 , G01N23/225 , G01N23/2251 , H01J37/06 , H01J37/073 , H01J37/20 , H01J37/222 , H01J37/244 , H01J37/28 , H01J2237/082 , H01J2237/202 , H01J2237/20228 , H01J2237/204 , H01J2237/22 , H01J2237/24564 , H01J2237/2806 , H01J2237/2816 , H01J2237/2817
摘要： An electron beam apparatus for evaluating a sample face which comprises a primary electro-optical system irradiating the sample with primary electron beams, a detection system, and a secondary electro-optical system directing the secondary electron beam generated from the sample face by irradiation with the primary electron beam to the detection system. The electron beam apparatus is characterized by comprising a multi-beam generator included in the primary electro-optical system to generate electrons emitted from an electron gun as primary electron beams, a scanning deflector included in the primary electro-optical system to scan the sample simultaneously with the primary electron beams, an objective lens included in common in the primary electro-optical system and the secondary electro-optical system to irradiate the sample with decelerated primary electron beams and to accelerate the secondary electron beams emitted from the irradiated point on the sample with the primary electron beams, a secondary electron beam separator included in the primary and secondary electro-optical systems to deflect the secondary electron beams passing through the objective lens from the primary electro-optical system to the secondary electro- optical system, a magnifying lens of at least one stage included in the secondary electro-optical lens to magnify the deflected secondary electron beams, and detectors included in the detection system and provided in accordance with the secondary electron beams for the secondary electro-optical system to detect secondary electron beams.
摘要翻译：一种电子束装置，用于评估样品面，该样品面包括用一次电子束照射样品的主电光系统，检测系统和二次电子光学系统，该样品面通过照射一次电子束到检测系统。电子束装置的特征在于包括：包含在主电光系统中的多束发生器，用于产生从电子枪发射的电子作为主电子束;包括在主电光系统中的扫描偏转器，用于同时扫描样品利用一次电子束在主电子光学系统和二次电子光学系统中共同包括的物镜照射具有减速的一次电子束的样品并且加速从样品上的照射点发射的二次电子束利用主电子束，包括在初级和次级电光系统中的次级电子束分离器，将通过物镜的次级电子束从初级电光系统偏转到次级电光系统，放大镜头包括在次级电光学透镜中的至少一个级的大小被偏转的二次电子束以及包括在检测系统中并且根据用于二次电子光学系统的二次电子束提供的检测器来检测二次电子束。

9. 发明专利

DE60229740D1 未知
公开(公告)号：DE60229740D1
公开(公告)日：2008-12-18
申请号：DE60229740
申请日：2002-05-14
申请人： EBARA CORP
发明人： HATAKEYAMA MASAHIRO , SATAKE TOHRU , MURAKAMI TAKESHI , WATANABE KENJI , NOJI NOBUHARU
IPC分类号： G03F7/20 , H04N3/15 , G01N21/956 , H01J37/22 , H01J37/244 , H01J37/26 , H01L21/027 , H01R13/00 , H01R13/24 , H04N5/225
摘要： An electron beam apparatus comprises a TDI sensor 64 and a feed-through device 50. The feed-through device has a socket contact 54 for interconnecting a pin 52 attached to a flanged 51 for separating different environments and the other pin 53 making a pair with the pin 52, in which the pin 52, the other pin 53 and the socket contact 54 together construct a connecting block, and the socket contact 54 has an elastic member 61. Accordingly, even if a large number of connecting blocks are provided, the connecting force may be kept to such a low level as to prevent the breakage in the sensor. The pin 53 is connected with the TDI sensor 64, in which a pixel array has been adaptively configured based on the optical characteristic of an image projecting optical system. That sensor has a number of integration stages that can reduce the field of view of the image projecting optical system to as small as possible so that a maximal acceptable distortion within the field of view may be set larger. Further, the number of integration stage may be determined such that the data rate of the TDI sensor would not be reduced but the number of pins would not be increased as much as possible. Preferably, the number of line count may be almost equal to the number of integration stages.

10. 发明专利

AT155922T 未知
公开(公告)号：AT155922T
公开(公告)日：1997-08-15
申请号：AT92106796
申请日：1992-04-21
申请人： EBARA CORP
发明人： NAGAI KAZUTOSHI , SATAKE TOHRU , HAYASHI HIDEAKI , HATADA YOSHIO
IPC分类号： C23C14/48 , G21K1/14 , H01J27/20 , H01J37/08
摘要： An ion neutralizer which neutralizes electric charges on ions and produces a fast atom beam in an ultra-high vacuum comprising: an ion source disposed in a vacuum container; a hollow container disposed in the vacuum container, the hollow container being closed at both ends thereof except for an ion beam entrance hole provided in one end portion thereof and a fast atom beam exit hole provided in the other end portion thereof; a metal vapor generating source comprising a filament wound with a fine wire or ribbon of a metal selected from titanium, magnesium and aluminum, the filament being disposed in the hollow container in such a manner as to surround an axis connecting the ion beam entrance hole and the fast atom beam exit hole; a vacuum pump connected to the vacuum container; and a filament heating power supply disposed outside the vacuum container and the hollow container and connected to the filament.

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