专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06742279B2 Apparatus and method for rinsing substrates 失效
标题翻译：用于漂洗底物的装置和方法
公开(公告)号：US06742279B2
公开(公告)日：2004-06-01
申请号：US10052015
申请日：2002-01-16
申请人： Dmitry Lubomirsky , Joseph J. Stevens
发明人： Dmitry Lubomirsky , Joseph J. Stevens
IPC分类号： F26B508
CPC分类号： H01L21/67028 , Y10S134/902
摘要： Embodiments of the invention provide a spin rinse dry (SRD) chamber for a semiconductor processing system. The SRD chamber includes a selectively rotatable substrate support member having an upper substrate receiving surface formed thereon, and a selectively rotatable shield member positioned above the upper substrate receiving surface, the rotatable shield member having a substantially planar lower surface that may be selectively positioned proximate the upper substrate. Embodiments of the invention further provide a method for rinsing semiconductor substrates, including the steps of positioning the substrate on a substrate support member, positioning a shield member having a substantially planar lower surface in a processing position above the substrate such that the substantially planar lower surface is in parallel orientation with an upper surface of the substrate, and flowing a fluid solution into a processing region defined by the upper surface of the substrate and the substantially planar lower surface via a fluid aperture in the substantially planar lower surface.
摘要翻译：本发明的实施例提供了一种用于半导体处理系统的旋转冲洗干燥（SRD）室。 SRD室包括一个有选择地旋转的基板支撑件，其具有形成在其上的上基板接收表面，以及位于上基板接收表面上方的可选择地旋转的屏蔽件，该可旋转屏蔽件具有基本平坦的下表面，上基板。本发明的实施例还提供了一种用于冲洗半导体衬底的方法，包括以下步骤：将衬底定位在衬底支撑构件上，将具有基本平坦的下表面的屏蔽构件定位在衬底上方的处理位置，使得基本平坦的下表面与基底的上表面平行取向，并且使流体溶液经由基本平坦的下表面中的流体孔流动到由基底的上表面和基本上平坦的下表面限定的处理区域中。

2. 发明授权

US07138014B2 Electroless deposition apparatus 有权
公开(公告)号：US07138014B2
公开(公告)日：2006-11-21
申请号：US10059572
申请日：2002-01-28
申请人： Joseph J. Stevens , Dmitry Lubomirsky , Ian Pancham , Donald J. K. Olgado , Howard E. Grunes , Yeuk-Fai Edwin Mok
发明人： Joseph J. Stevens , Dmitry Lubomirsky , Ian Pancham , Donald J. K. Olgado , Howard E. Grunes , Yeuk-Fai Edwin Mok
IPC分类号： C23C14/00 , B05C11/00 , B05C3/00
CPC分类号： H01L21/67126 , C23C18/1607 , C23C18/1619 , C23C18/1628 , C23C18/165 , C23C18/1653 , C23C18/1678 , C25D7/123 , C25D17/001
摘要： An apparatus and a method of depositing a catalytic layer comprising at least one metal selected from the group consisting of noble metals, semi-noble metals, alloys thereof, and combinations thereof in sub-micron features formed on a substrate. Examples of noble metals include palladium and platinum. Examples of semi-noble metals include cobalt, nickel, and tungsten. The catalytic layer may be deposited by electroless deposition, electroplating, or chemical vapor deposition. In one embodiment, the catalytic layer may be deposited in the feature to act as a barrier layer to a subsequently deposited conductive material. In another embodiment, the catalytic layer may be deposited over a barrier layer. In yet another embodiment, the catalytic layer may be deposited over a seed layer deposited over the barrier layer to act as a “patch” of any discontinuities in the seed layer. Once the catalytic layer has been deposited, a conductive material, such as copper, may be deposited over the catalytic layer. In one embodiment, the conductive material is deposited over the catalytic layer by electroless deposition. In another embodiment, the conductive material is deposited over the catalytic layer by electroless deposition followed by electroplating or followed by chemical vapor deposition. In still another embodiment, the conductive material is deposited over the catalytic layer by electroplating or by chemical vapor deposition.

3. 发明授权

US06824612B2 Electroless plating system 有权
标题翻译：无电镀系统
公开(公告)号：US06824612B2
公开(公告)日：2004-11-30
申请号：US10036321
申请日：2001-12-26
申请人： Joseph J. Stevens , Dmitry Lubomirsky , Ian Pancham , Donald J. Olgado , Howard E. Grunes , Yeuk-Fai Edwin Mok , Girish Dixit
发明人： Joseph J. Stevens , Dmitry Lubomirsky , Ian Pancham , Donald J. Olgado , Howard E. Grunes , Yeuk-Fai Edwin Mok , Girish Dixit
IPC分类号： B05C502
CPC分类号： H01L21/67167 , C23C18/1632 , C23C18/1692 , H01L21/6723
摘要： A method and apparatus for plating substrates, wherein the apparatus includes a central substrate transfer enclosure having at least one substrate transfer robot positioned therein. A substrate activation chamber in communication with the central substrate transfer enclosure is provided and is accessible to the at least one substrate transfer robot. A substrate plating chamber in communication with the central substrate transfer enclosure is provided and is accessible to the at least one substrate transfer robot. A substrate spin rinse dry chamber in communication with the central substrate transfer enclosure is provided and is accessible to the at least one substrate transfer robot, and an annealing chamber in communication with the central substrate transfer enclosure is provided and is accessible to the at least one substrate transfer robot. At least one substrate pod loader in communication with the substrate transfer chamber and accessible to the at least one substrate transfer robot is also provided.
摘要翻译：一种用于电镀基板的方法和装置，其中所述装置包括具有至少一个基板传送机器人的中央基板传送外壳。提供与中心基板传送外壳连通的基板激活室，并且可由至少一个基板传送机器人访问。提供与中心基板传送外壳连通的基板电镀室，并且可由至少一个基板传送机器人访问。提供与中央基板传送外壳连通的基板旋转漂洗干燥室，并且可由至少一个基板传送机器人访问，并且提供与中央基板传送外壳连通的退火室，并且可由至少一个基板传送机器人。还提供了至少一个与基板传送室连通并且可由至少一个基板传送机器人访问的基板盒装载器。

4. 发明授权

US08801909B2 Polymetal hydroxychloride processes and compositions: enhanced efficacy antiperspirant salt compositions 有权
标题翻译：多金属羟氯化物方法和组合物：增强功效止汗剂盐组合物
公开(公告)号：US08801909B2
公开(公告)日：2014-08-12
申请号：US11619478
申请日：2007-01-03
申请人： William E. Pratt , Joseph J. Stevens , Peter G. Symons
发明人： William E. Pratt , Joseph J. Stevens , Peter G. Symons
IPC分类号： B01D61/46
CPC分类号： C01F7/56 , A61K8/26 , A61K8/28 , A61K8/44 , A61Q15/00 , B01D61/44 , C01B7/035 , C01G25/006 , C01P2002/87
摘要： The invention describes processes for the production of basic aluminum compounds, including aluminum chlorohydrate, basic zirconium compounds, and basic aluminum zirconium compounds. The process produces products of a wide range of basicities. The products formed by the present invention are comprised of low molecular weight species characteristic of enhanced efficacy antiperspirant salt compositions. The products of this process are suitable for use as water purification agents, as binders in catalyst applications, and in antiperspirant applications. In addition, the invention is directed to the products made by the disclosed process.
摘要翻译：本发明描述了生产碱性铝化合物的方法，包括氯化铝水合物，碱性锆化合物和碱性锆锆化合物。该过程产生广泛基础的产品。由本发明形成的产品由具有增强的功效止汗剂盐组合物特征的低分子量物质组成。该方法的产品适用于作为水净化剂，作为催化剂应用中的粘合剂和止汗剂应用。此外，本发明涉及通过公开的方法制造的产品。

5. 发明授权

US07005046B2 Apparatus for electro chemical deposition 失效
标题翻译：电化学沉积装置
公开(公告)号：US07005046B2
公开(公告)日：2006-02-28
申请号：US10217872
申请日：2002-08-13
申请人： Joseph J. Stevens , Yevgeniy Rabinovich , Sandy S. Chao , Mark R. Denome , Allen L. D'Ambra , Donald J. Olgado
发明人： Joseph J. Stevens , Yevgeniy Rabinovich , Sandy S. Chao , Mark R. Denome , Allen L. D'Ambra , Donald J. Olgado
IPC分类号： C25D17/00
CPC分类号： C25D21/14 , C25D7/123 , C25D17/001 , C25D21/18
摘要： A system is provided in which a smaller flow of deposition solution is diverted from a larger flow of deposition solution flowing on an electrochemical deposition tool platform. The smaller flow is diverted to a dosing unit which may be on a separate platform. The dosing unit in one embodiment comprises a pressurized flow line.
摘要翻译：提供了一种系统，其中较小的沉积溶液流从在电化学沉积工具平台上流动的较大流动的沉积溶液转移。较小的流量被转移到可以在单独平台上的计量单元。在一个实施例中的计量单元包括加压流动管线。

6. 发明授权

US06720263B2 Planarization of metal layers on a semiconductor wafer through non-contact de-plating and control with endpoint detection 失效
标题翻译：通过非接触式去镀层和端点检测来控制半导体晶片上的金属层的平面化
公开(公告)号：US06720263B2
公开(公告)日：2004-04-13
申请号：US09981505
申请日：2001-10-16
申请人： Donald J. K. Olgado , Joseph J. Stevens , Alexander Lerner
发明人： Donald J. K. Olgado , Joseph J. Stevens , Alexander Lerner
IPC分类号： H01L21302
CPC分类号： H01L21/32115 , C25F7/00 , H01L21/32134 , H01L21/6708 , H01L21/7684
摘要： A non-contact apparatus and method for removing a metal layer from a substrate are provided. The apparatus includes a rotatable anode substrate support member configured to support a substrate in a face-up position and to electrically contact the substrate positioned thereon. A pivotally mounted cathode fluid dispensing nozzle assembly positioned above the anode substrate support member is also provided. A power supply in electrical communication with the anode substrate support member and the cathode fluid dispensing nozzle is provided, and a system controller configured to regulate at least one of a rate of rotation of the anode substrate support member, a radial position of the cathode fluid dispensing nozzle, and an output power of the power supply is provided. The method provides for the removal of a metal layer from a substrate by rotating the substrate in a face up position on a rotatable substrate support member. A cathode fluid dispensing nozzle is positioned over a central portion of the substrate and a metal removing solution is dispensed from the cathode fluid dispensing nozzle onto the central portion of the substrate. An electrical bias is applied between the substrate and the cathode fluid dispensing nozzle, which operates to deplate the metal layer below the fluid dispensing nozzle.
摘要翻译：提供了一种用于从基板去除金属层的非接触式设备和方法。该装置包括可旋转的阳极基板支撑构件，其构造成将基板支撑在面朝上的位置并且电接触定位在其上的基板。还提供了一种位于阳极基板支撑构件上方的枢转安装的阴极流体分配喷嘴组件。提供与阳极基板支撑构件和阴极流体分配喷嘴电连通的电源，以及系统控制器，被配置为调节阳极基板支撑构件的旋转速率，阴极流体的径向位置分配喷嘴，并且提供电源的输出功率。该方法通过在可旋转的基板支撑构件上面向上的位置旋转基板来提供从基板移除金属层。阴极流体分配喷嘴位于衬底的中心部分上方，金属去除溶液从阴极流体分配喷嘴分配到衬底的中心部分上。在衬底和阴极流体分配喷嘴之间施加电偏压，其用于使流体分配喷嘴下方的金属层脱落。

7. 发明授权

US06454927B1 Apparatus and method for electro chemical deposition 有权
标题翻译：电化学沉积的装置和方法
公开(公告)号：US06454927B1
公开(公告)日：2002-09-24
申请号：US09603791
申请日：2000-06-26
申请人： Joseph J. Stevens , Yevgeniy Rabinovich , Sandy S. Chao , Mark R. Denome , Allen L. D'Ambra , Donald J. Olgado
发明人： Joseph J. Stevens , Yevgeniy Rabinovich , Sandy S. Chao , Mark R. Denome , Allen L. D'Ambra , Donald J. Olgado
IPC分类号： C25B1500
CPC分类号： C25D21/14 , C25D7/123 , C25D17/001 , C25D21/18
摘要： A system is provided in which a smaller flow of deposition solution is diverted from a larger flow of deposition solution flowing on an electro-chemical deposition tool platform. The smaller flow is diverted to a dosing unit which may be on a separate platform. The dosing unit in one embodiment comprises a pressurized flow line.
摘要翻译：提供了一种系统，其中较小的沉积溶液流从在电化学沉积工具平台上流动的较大流动的沉积溶液转移。较小的流量被转移到可以在单独平台上的计量单元。在一个实施例中的计量单元包括加压流动管线。

8. 发明授权

US09510679B2 Drawer mechanism 有权
标题翻译：抽屉机构
公开(公告)号：US09510679B2
公开(公告)日：2016-12-06
申请号：US14077027
申请日：2013-11-11
申请人： Ravi Nikhil Bhatt , Mira Nicole Bhatt , Joshua P. Kannankunni , Clayton D. Stevens , Logan Alastair John Wallace , Olivia May Wallace , Nikhil Mahesh Bhatt , Alexander D. Wallace , Seejo K. Pylappan , Joseph J. Stevens
发明人： Ravi Nikhil Bhatt , Mira Nicole Bhatt , Joshua P. Kannankunni , Clayton D. Stevens , Logan Alastair John Wallace , Olivia May Wallace , Nikhil Mahesh Bhatt , Alexander D. Wallace , Seejo K. Pylappan , Joseph J. Stevens
IPC分类号： G06Q50/00 , G05B15/02 , A47B88/00 , G01G21/23 , F16H21/04
CPC分类号： A47B88/00 , A47B2088/901 , F16H21/04 , G01G21/23 , Y10T74/18168
摘要： Embodiments of the present invention generally relate to a drawer lifting mechanism, and more particularly to a mechanism that is adapted to bring stored items that are disposed on a supporting surface of a drawer lifting mechanism to a user. The drawer lifting mechanism may be actuated by human power or by use of one or more actuators. In some configurations, the drawer lifting mechanism is disposed and used in the kitchen to enable the delivery of the contents of a kitchen cabinet to a user that is disposed proximate to the cabinet.
摘要翻译：本发明的实施例总体上涉及抽屉提升机构，更具体地涉及一种适于将设置在抽屉提升机构的支撑表面上的存储物品带到使用者的机构。抽屉提升机构可以由人力或通过使用一个或多个致动器来致动。在一些配置中，抽屉提升机构被布置和使用在厨房中，以使厨房橱柜的内容物能够传递到靠近机柜的用户。

9. 发明授权

US07846318B2 Polyaluminum chloride and aluminum chlorohydrate, processes and compositions: high-basicity and ultra high-basicity products 有权
标题翻译：聚氯化铝和氯化铝水合物，工艺和组成：高碱度和超高碱度的产品
公开(公告)号：US07846318B2
公开(公告)日：2010-12-07
申请号：US11619483
申请日：2007-01-03
申请人： William E. Pratt , Joseph J. Stevens , Peter G. Symons
发明人： William E. Pratt , Joseph J. Stevens , Peter G. Symons
IPC分类号： C25D5/34 , C25B1/24 , B01D61/00 , C01B17/45 , C01B17/46
CPC分类号： C01F7/56 , A61K8/26 , A61Q15/00 , B01D61/44 , C01B9/02 , C01G23/02 , C01G25/04 , C01G49/10
摘要： The invention relates generally to processes for the production of high-basicity and ultra-high basicity polyaluminum chlorides including aluminum chlorohydrate. The processes can produce products of a wide range of basicities and are particularly useful in producing high basicity products. The process can produce a wide range of solution concentrations and are particularly useful in producing high solution concentrations. The processes described generate high purity products, which are free of by-product salt(s). The processes described herein can also be utilized to produce enhanced efficacy polyaluminum chlorides including aluminum chlorohydrate. When compared to conventional processes for manufacturing these compounds the processes disclosed herein are unique in so far as the disclosed processes do not require aluminum metal as a starting material. The products of the processes are suitable in applications including water purification, catalysts, and antiperspirants. In addition, the invention is directed to the products prepared by the processes described herein.
摘要翻译：本发明一般涉及生产包括氯化铝水合物在内的高碱度和超高碱性聚氯化铝的方法。该工艺可生产各种碱性产品，特别适用于生产高碱度产品。该方法可产生大范围的溶液浓度，特别适用于生产高溶液浓度。所述方法产生不含副产物盐的高纯度产物。本文所述的方法也可用于产生包括氯化铝水合物的增强效力的聚氯化铝。与用于制造这些化合物的常规方法相比，本文公开的方法是独特的，只要所公开的方法不需要铝金属作为起始材料即可。该方法的产品适用于包括水净化，催化剂和止汗剂在内的应用。此外，本发明涉及通过本文所述方法制备的产品。

10. 发明授权

US06582578B1 Method and associated apparatus for tilting a substrate upon entry for metal deposition 失效
标题翻译：用于在进入金属沉积时使衬底倾斜的方法和相关设备
公开(公告)号：US06582578B1
公开(公告)日：2003-06-24
申请号：US09678947
申请日：2000-10-03
申请人： Yezdi N. Dordi , Joseph J. Stevens , Michael N. Sugarman
发明人： Yezdi N. Dordi , Joseph J. Stevens , Michael N. Sugarman
IPC分类号： C25D500
CPC分类号： H01L21/67167 , C25D7/123 , C25D17/001 , C25D21/00 , C25D21/04 , H01L21/2885 , H01L21/67028 , H01L21/67051 , H01L21/6723 , H05K3/241
摘要： An electro-chemical plating system is described. A method is performed by the electro-chemical plating system in which a seed layer formed on a substrate is immersed into an electrolyte solution. In one aspect, a substrate is immersed in the electrochemical plating system by tilting the substrate as it enters the electrolyte solution to limit the trapping or formation of air bubbles in the electrolyte solution between the substrate and the substrate holder. In another aspect, an apparatus is provided for electroplating that comprises a cell, a substrate holder, and an actuator. The actuator can displace the substrate holder assembly in the x and z directions and also tilt the substrate. In another aspect, a method is provided of driving a meniscus formed by electrolyte solution across a surface of a substrate. The method comprises enhancing the interaction between the electrolyte solution meniscus and the surface as the substrate is immersed into the electrolyte solution.
摘要翻译：描述了电化学电镀系统。通过将形成在基板上的籽晶层浸渍在电解液中的电化学电镀系统进行。一方面，当基板进入电解质溶液时，通过使基板倾斜以限制基板和基板支架之间的电解液中的气泡的捕获或形成，将基板浸入电化学电镀系统中。在另一方面，提供一种用于电镀的设备，其包括电池，衬底保持器和致动器。致动器可以在x和z方向上移动基板保持器组件，并且还使基板倾斜。在另一方面，提供一种驱动由电解质溶液形成的弯液面跨越衬底的表面的方法。该方法包括当基底浸入电解质溶液时增强电解液溶液弯液面与表面之间的相互作用。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式