专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2006196595A Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：JP2006196595A
公开(公告)日：2006-07-27
申请号：JP2005005326
申请日：2005-01-12
申请人： Denso Corp , 株式会社デンソー
发明人： NAGASAKA SHINSUKE , HIRANO NAOHIKO
IPC分类号： H01L23/29 , H01L25/04 , H01L25/18
CPC分类号： H01L24/33 , H01L2224/32245 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To maintain balance in stress in a semiconductor device in which two or more semiconductor elements are provided between both opposite metal bodies and the elements are molded by a resin. SOLUTION: The semiconductor device 100 is provided with a first metal body 20 and a second metal body 30 which are oppositely provided; a first semiconductor element 10 provided between both the metal bodies 20, 30 and thermally connected to both the metal bodies 20, 30; a second semiconductor element 11 provided between both the metal bodies 20, 30 and thermally connected to both the metal bodies 20, 30; and a molding resin 70 filled between both the metal objects 20, 30, and sealing the first semiconductor element 10 and the second semiconductor element 11. In this semiconductor device 100, the first semiconductor element 10 is arranged at a position closer to the first metal body 20 and the second semiconductor element 11 is arranged at a position closer to the second metal body 30, in the center of a distance between both the metal bodies 20, 30 in a direction where both the metal bodies 20, 30 are spaced. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了保持在两个相对的金属体之间设置两个或更多个半导体元件并且元件由树脂模制的半导体器件中的应力平衡。解决方案：半导体器件100设置有相对设置的第一金属体20和第二金属体30; 设置在两个金属体20,30之间并与金属体20,30热连接的第一半导体元件10; 设置在两个金属体20,30之间并与金属体20,30热连接的第二半导体元件11; 以及填充在两个金属物体20,30之间并且密封第一半导体元件10和第二半导体元件11的模制树脂70.在该半导体器件100中，第一半导体元件10布置在更接近第一金属主体20和第二半导体元件11被布置在更靠近第二金属体30的位置处，两个金属体20,30之间的距离在两个金属体20,30间隔开的方向上的中心。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2008141052A Electronic package 有权
标题翻译：电子包装
公开(公告)号：JP2008141052A
公开(公告)日：2008-06-19
申请号：JP2006327191
申请日：2006-12-04
申请人： Denso Corp , 株式会社デンソー
发明人： NAGASAKA SHINSUKE , KATO KAZUO , NIIOBI AKIRA , AOKI KOJI
IPC分类号： H01L23/29 , H01L23/31
CPC分类号： H01L23/3142 , H01L23/3107 , H01L24/32 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/8592 , H01L2924/181 , H01L2924/19041 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To achieve the reliability up to 200°C in an electronic package configured by sealing a mounted body in which an electronic element is fixed on a metal member with a molded resin composed of an epoxy resin. SOLUTION: The electronic package includes: a mounted body 50 having metal members 10, 11 composed of metal and a semiconductor element 20 bonded to the metal members 10, 11; a molded resin 60 which is composed of an epoxy resin and seals the mounted body 50; and a primer 70 composed of a resin that assures the adhesion between the mounted body 50 and the molded resin 60 by being interposed between the both 50, 60, wherein the glass transition temperatures of the molded resin 60 and of the primer 70 are 200°C or higher. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了通过将由电子元件固定在金属构件上的安装体与由环氧树脂组成的树脂密封而构成的电子封装中达到高达200℃的可靠性。电子封装包括：具有由金属构成的金属构件10,11和与金属构件10,11接合的半导体元件20的安装体50; 模制树脂60，其由环氧树脂组成并密封安装体50; 以及由树脂构成的底漆70，其通过插入在两者之间的两个50,60之间确保安装体50和模制树脂60之间的粘合，其中模制树脂60和底漆70的玻璃化转变温度为200° C以上。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2006120838A Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：JP2006120838A
公开(公告)日：2006-05-11
申请号：JP2004306781
申请日：2004-10-21
申请人： Denso Corp , 株式会社デンソー
发明人： NAGASAKA SHINSUKE , HIRANO NAOHIKO
IPC分类号： H01L23/29 , H01L23/31
CPC分类号： H01L2224/45124 , H01L2224/48091 , H01L2224/73265 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To cause as less cracks as possible in a solder layer due to a temperature cycle in a semiconductor device which is such that a semiconductor element is bonded on a metal body by solder and then is sealed by a molding resin. SOLUTION: The semiconductor device 100 comprises the metal body 10, the semiconductor element 20 mounted on one face of the metal body 10, the solder layer 30 which exists between the metal body 10 and the semiconductor element 20 to bond these together, and a first resin 40 which seals the metal body 10 and the semiconductor element 20 as if wrapping around them. In the periphery of the solder layer 30, a second resin 70 formed of epoxy resin, etc. which has a coefficient of thermal expansion closer to that of the solder layer 30 than to that of the first resin 40 is formed along the entire circumference of the solder layer 30 in contact with an end of it. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：由于半导体器件中的温度循环导致焊料层中尽可能少的裂纹，使得半导体元件通过焊料接合在金属体上，然后通过模制来密封树脂。解决方案：半导体器件100包括金属体10，安装在金属体10的一个面上的半导体元件20，存在于金属体10和半导体元件20之间以将它们结合在一起的焊料层30，以及第一树脂40，其密封金属体10和半导体元件20，就像围绕它们一样缠绕。在焊料层30的周围，沿着整个周边形成有比环氧树脂等形成的第二树脂70的热膨胀系数比第一树脂40的热膨胀系数更接近于焊料层30的热膨胀系数焊料层30与其端部接触。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2014162334A Resin molding 审中-公开
标题翻译：树脂成型
公开(公告)号：JP2014162334A
公开(公告)日：2014-09-08
申请号：JP2013034452
申请日：2013-02-25
申请人： Denso Corp , 株式会社デンソー
发明人： NAGASAKA SHINSUKE , URUSHIBARA MASARU , OKA HIDEKI
IPC分类号： B60R13/02
摘要： PROBLEM TO BE SOLVED: To provide a resin molding effectively securing a tensile strength in the resin molding used as car components.SOLUTION: A resin molding 10 of a cantilever beam structure comprises a base plate 11, and a beam plate 14 supported on the base plate 11 on one end. A force receiving surface 15 on which an external force F acts protrudes to a side of receiving the external force F than an imaginary reference surface V15, toward a connection part 19 from a general part 16 of the beam plate 14. The beam plate 14 is gradually increased in the plate thickness from the general part 16 toward the connection part 19 so as to thicken the side of receiving the external force F. As a result of this, a tensile stress T occurring in the resin molding 10 by the external force F can be effectively decreased without equally increasing the plate thickness of the base plate 11 and the beam plate 14, and thereby, in resinification of car components, a tensile strength of the resin molding 10 can be effectively secured while retaining a merit of weight reduction.
摘要翻译：要解决的问题：提供有效地确保用作汽车部件的树脂模制品中的拉伸强度的树脂模制品。解决方案：悬臂梁结构的树脂模制件10包括基板11和支撑在基座上的梁板14 板11在一端。外力F作用的力接收表面15从一个虚拟参考表面V15向接收外力F的一侧向梁板14的一般部分16朝向连接部分19突出。梁板14是从一般部分16向连接部分19逐渐增加板厚度，从而增加接受外力F的一侧。结果，通过外力F在树脂模制件10中产生的拉伸应力T 可以有效地降低基板11和梁板14的平板厚度，从而在汽车部件的树脂化中可以有效地确保树脂成型体10的拉伸强度，同时保持重量减轻的优点。

5. 发明专利

JP2013166902A Nanocomposite composition 审中-公开
标题翻译：纳米复合材料
公开(公告)号：JP2013166902A
公开(公告)日：2013-08-29
申请号：JP2012032509
申请日：2012-02-17
申请人： Denso Corp , 株式会社デンソー
发明人： NAGASAKA SHINSUKE , KATO KAZUO
IPC分类号： C08J3/12
摘要： PROBLEM TO BE SOLVED: To provide an improved composition for obtaining a plastic molded product in which an additive is not aggregated and an anisotropic property is hardly exhibited after molding.SOLUTION: A nanocomposite composition contains nano particles 23 obtained by subjecting a preform 13 of a resin composition to nano-pulverization, wherein the resin composition contains: an additive 11 having a shape anisotropy; and a resin 12.
摘要翻译：要解决的问题：提供一种改进的组合物，用于获得其中添加剂不聚集的塑料模塑产品，并且成型后几乎不显示各向异性特性。解决方案：纳米复合材料组合物含有通过使预成型体13 树脂组合物进行纳米粉碎，其中所述树脂组合物包含：具有形状各向异性的添加剂11; 和树脂12。

6. 发明专利

JP2011121059A Solder paste flux and solder paste 有权
标题翻译：焊膏和焊膏
公开(公告)号：JP2011121059A
公开(公告)日：2011-06-23
申请号：JP2009278210
申请日：2009-12-08
申请人： Arakawa Chem Ind Co Ltd , Denso Corp , Fujitsu Ten Ltd , Harima Chemicals Inc , Koki:Kk , Toyota Motor Corp , トヨタ自動車株式会社 , ハリマ化成株式会社 , 富士通テン株式会社 , 株式会社デンソー , 株式会社弘輝 , 荒川化学工業株式会社
发明人： IWAMURA EIJI , GOTO KAZUYUKI , NAGASAKA SHINSUKE , YOSHIOKA TAKAYASU , UTSUNO KIMITAKA , NAKAMURA MITSUO , OKOCHI TERUO , MITSUHARU MASAKI , SUKEGAWA TAKUSHI , IKEDO KENJI , ANDO YOSHIYUKI , SHIRAI TAKESHI , MORI KIMIAKI , WADA RIE , NAKANISHI KENSUKE , AIHARA MASAMI , KUMAMOTO SATOSHI
IPC分类号： B23K35/363 , B23K35/22 , B23K35/26 , C22C13/00
CPC分类号： B23K35/362 , B23K35/0222 , B23K35/0244 , B23K35/025 , B23K35/3613 , C22C13/00 , H05K3/3489
摘要： PROBLEM TO BE SOLVED: To provide flux for solder paste and solder paste having adequate fluidity even when the shear force is repeatedly applied thereto, and capable of suppressing any fatigue degradation of the viscoelastic characteristic and various kinds of performance degradation due to the same.
SOLUTION: The flux for solder paste comprises acrylic resin which is obtained by the radical copolymerization of (meth)acrylic ester having a 6-15C alkyl group and (meth)acrylic ester other than that (meth)acrylic ester, and rosins. The weight ratio of the acrylic resin when that of rosins is 1 is 0.5-1.2, and the flux for solder paste is fluidized by applying the shear force of 10-150 Pa.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有足够的流动性的焊膏和焊膏的助焊剂，即使当反复施加剪切力时，也能够抑制粘弹性特性的疲劳劣化和各种性能下降相同。焊膏的焊剂包含通过使具有6-15C烷基的（甲基）丙烯酸酯与除（甲基）丙烯酸酯以外的（甲基）丙烯酸酯）和（甲基）丙烯酸酯的自由基共聚得到的丙烯酸树脂，以及松香。当松香的丙烯酸树脂为1时，丙烯酸树脂的重量比为0.5-1.2，通过施加10-150Pa的剪切力使焊膏的流量流动。版权所有（C）2011，JPO＆INPIT

7. 发明专利

JP2007073583A Manufacturing method of semiconductor device 审中-公开
标题翻译：半导体器件的制造方法
公开(公告)号：JP2007073583A
公开(公告)日：2007-03-22
申请号：JP2005256102
申请日：2005-09-05
申请人： Denso Corp , 株式会社デンソー
发明人： NAGASAKA SHINSUKE , HIRANO NAOHIKO , MASAMITSU KUNIAKI , OKUMURA TOMOMI
IPC分类号： H01L23/29
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To prevent a semiconductor element in a molding process from being damaged in a manufacturing method of a semiconductor device where a semiconductor element is sandwiched between a pair of metal plates and is sealed with resin. SOLUTION: The manufacturing method is constituted in such a way that the semiconductor element 1 is interposed between a pair of facing metal plates 2, 3, and a member 110 connecting internal surfaces 2a, 3a of the metal plates 2, 3 and the semiconductor element 1 is set in a metal mold 200 into which resin 5 is injected, to mold the member 110. In the molding process, an external surface 2b of the one metal plate 2 and the metal mold 200 are brought into close contact, and there is provided, between an external surface 3b of the other metal plate 3 and the metal mold 200, a gap 230 with such a size that the injected resin 5 is flowable. In this state, the resin 5 is injected and filled in the gap 230, and then the resin 5 covering the external surface 3b of the other metal plate 3 is removed to expose the external surface 3b. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了防止在半导体元件夹在一对金属板之间并用树脂密封的半导体器件的制造方法中模制工艺中的半导体元件被损坏。解决方案：制造方法以这样的方式构成，使得半导体元件1插入在一对相对的金属板2,3和连接金属板2,3的内表面2a，3a的构件110和将半导体元件1设置在注入树脂5的金属模具200中，以模制构件110.在模制过程中，一个金属板2的外表面2b和金属模具200紧密接触，并且在另一金属板3的外表面3b和金属模具200之间设置具有使注入树脂5可流动的尺寸的间隙230。在这种状态下，将树脂5注入填充在间隙230中，然后除去覆盖另一金属板3的外表面3b的树脂5，露出外表面3b。版权所有（C）2007，JPO＆INPIT

8. 发明专利

JP2013217445A Refrigerant transportation hose 有权
标题翻译：制冷运输软管
公开(公告)号：JP2013217445A
公开(公告)日：2013-10-24
申请号：JP2012088489
申请日：2012-04-09
申请人： Denso Corp , 株式会社デンソー
发明人： NAGASAKA SHINSUKE , KATO KAZUO , URUSHIBARA MASARU , KOJIMA KAZUE , SHIBATA HARUHISA , OKA HIDEKI
IPC分类号： F16L11/08 , B32B1/08 , B32B25/08
CPC分类号： F16L11/085 , B60H1/00571
摘要： PROBLEM TO BE SOLVED: To improve a crack life of a resin layer in a refrigerant transportation hose in comparison with a conventional hose.SOLUTION: In a refrigerant transporting hose 1 which has a resin layer 2, an intermediate rubber layer 3, a reinforcement layer 4, and an outer face rubber layer 5 in order from inside to outside, an elastic modulus in a part on a side brought into contact with at least an inner face rubber layer 3 of the resin layer 2 is set from 100 MPa to 450 MPa. In concrete, the resin layer 2 is formed of first and second resin layers 2a, 2b. In the first resin layer 2a inside, both phenolic and phosphorus antioxidant are added to resin. In the second resin layer 2b of the outermost layer, no antioxidant is added to the resin.
摘要翻译：要解决的问题：与传统的软管相比，提高制冷剂输送软管中的树脂层的裂纹寿命。解决方案：在具有树脂层2，中间橡胶层3，增强层 4和外表面橡胶层5的从内到外的顺序，与至少树脂层2的内表面橡胶层3接触的一侧的部分的弹性模量设定为100MPa〜450MPa 。具体地，树脂层2由第一和第二树脂层2a，2b形成。在第一树脂层2a内，将酚类和磷类抗氧化剂添加到树脂中。在最外层的第二树脂层2b中，树脂中不添加抗氧化剂。

9. 发明专利

JP2005142258A Manufacturing method of semiconductor device 有权
标题翻译：半导体器件的制造方法
公开(公告)号：JP2005142258A
公开(公告)日：2005-06-02
申请号：JP2003375319
申请日：2003-11-05
申请人： Denso Corp , 株式会社デンソー
发明人： HIRANO NAOHIKO , NAGASAKA SHINSUKE
IPC分类号： H01L23/29 , H01L21/56 , H01L23/31
CPC分类号： H01L2224/32245 , H01L2224/48247 , H01L2224/73265 , H01L2224/8592 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To uniformly form solvent content resin on a semiconductor device in a manufacturing method of the device, with which substantially the device is molded with molded resin, after solvent content resin has been applied to the device where a pair of heatsinks are arranged on both faces of a semiconductor chip. SOLUTION: A method includes processes, wherein solvent content resin is dried by heating the device 100 by using a thermostatic oven and a drier to eliminate a temperature slope between a pair of heatsinks 20 and 30, after a process of applying a solvent content resin prior to the process of performing molding by molded resin 60. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了在该装置的制造方法中在半导体器件上均匀地形成溶剂含量的树脂，通过将该溶剂含量树脂施加到成对的器件上，将该器件基本上用模制树脂模制，的散热器布置在半导体芯片的两个面上。解决方案：一种方法包括通过使用恒温炉和干燥器加热装置100来干燥溶剂含量的树脂，以消除一对散热器20和30之间的温度斜率，在施加溶剂之后在通过模制树脂60进行模制的过程之前的内容物树脂。（C）2005年，JPO和NCIPI

10. 发明公开

EP2511043A4 FLUX FOR SOLDER PASTE, AND SOLDER PASTE 有权转让
标题翻译：助焊剂焊膏焊膏和
公开(公告)号：EP2511043A4
公开(公告)日：2016-06-29
申请号：EP10835926
申请日：2010-12-06
申请人： ARAKAWA CHEM IND , TOYOTA MOTOR CO LTD , DENSO CORP , FUJITSU TEN LTD , KOKI COMPANY LTD , HARIMA CHEMICALS INC
发明人： IWAMURA EIJI , GOTOH KAZUSHI , NAGASAKA SHINSUKE , YOSHIOKA TAKAYASU , UTSUNO MASAYOSHI , NAKAMURA ATSUO , OKOCHI TERUO , SANJI MASAKI , SUKEKAWA TAKUJI , IKEDO KENSHI , ANDOH YOSHIYUKI , SHIRAI TAKESHI , MORI KIMIAKI , WADA RIE , NAKANISHI KENSUKE , AIHARA MASAMI , KUMAMOTO SEISHI
IPC分类号： B23K35/363 , B23K35/02 , B23K35/26 , B23K35/36 , B23K35/362 , C22C13/00
CPC分类号： B23K35/362 , B23K35/0222 , B23K35/0244 , B23K35/025 , B23K35/3613 , C22C13/00 , H05K3/3489
摘要： Disclosed is a solder paste which has adequate fluidity even after a shear force is repeatedly applied thereto by a screen printing method or the like. Specifically disclosed is a flux for a solder paste, which contains: an acrylic resin that is obtained by radically copolymerizing a (meth)acrylic acid ester having a C 6 -C 15 alkyl group and a (meth)acrylic acid ester other than the above-mentioned (meth)acrylic acid ester; and a rosin. When the weight of the rosin is taken as 1, the weight ratio of the acrylic resin is 0.5-1.2 (inclusive), and the flux for a solder paste is fluidized by the application of a shear force of 10-150 Pa (inclusive).

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式