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1. 发明专利

JP2011121059A Solder paste flux and solder paste 有权
标题翻译：焊膏和焊膏
公开(公告)号：JP2011121059A
公开(公告)日：2011-06-23
申请号：JP2009278210
申请日：2009-12-08
申请人： Arakawa Chem Ind Co Ltd , Denso Corp , Fujitsu Ten Ltd , Harima Chemicals Inc , Koki:Kk , Toyota Motor Corp , トヨタ自動車株式会社 , ハリマ化成株式会社 , 富士通テン株式会社 , 株式会社デンソー , 株式会社弘輝 , 荒川化学工業株式会社
发明人： IWAMURA EIJI , GOTO KAZUYUKI , NAGASAKA SHINSUKE , YOSHIOKA TAKAYASU , UTSUNO KIMITAKA , NAKAMURA MITSUO , OKOCHI TERUO , MITSUHARU MASAKI , SUKEGAWA TAKUSHI , IKEDO KENJI , ANDO YOSHIYUKI , SHIRAI TAKESHI , MORI KIMIAKI , WADA RIE , NAKANISHI KENSUKE , AIHARA MASAMI , KUMAMOTO SATOSHI
IPC分类号： B23K35/363 , B23K35/22 , B23K35/26 , C22C13/00
CPC分类号： B23K35/362 , B23K35/0222 , B23K35/0244 , B23K35/025 , B23K35/3613 , C22C13/00 , H05K3/3489
摘要： PROBLEM TO BE SOLVED: To provide flux for solder paste and solder paste having adequate fluidity even when the shear force is repeatedly applied thereto, and capable of suppressing any fatigue degradation of the viscoelastic characteristic and various kinds of performance degradation due to the same.
SOLUTION: The flux for solder paste comprises acrylic resin which is obtained by the radical copolymerization of (meth)acrylic ester having a 6-15C alkyl group and (meth)acrylic ester other than that (meth)acrylic ester, and rosins. The weight ratio of the acrylic resin when that of rosins is 1 is 0.5-1.2, and the flux for solder paste is fluidized by applying the shear force of 10-150 Pa.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有足够的流动性的焊膏和焊膏的助焊剂，即使当反复施加剪切力时，也能够抑制粘弹性特性的疲劳劣化和各种性能下降相同。焊膏的焊剂包含通过使具有6-15C烷基的（甲基）丙烯酸酯与除（甲基）丙烯酸酯以外的（甲基）丙烯酸酯）和（甲基）丙烯酸酯的自由基共聚得到的丙烯酸树脂，以及松香。当松香的丙烯酸树脂为1时，丙烯酸树脂的重量比为0.5-1.2，通过施加10-150Pa的剪切力使焊膏的流量流动。版权所有（C）2011，JPO＆INPIT

2. 发明专利

JP2011121058A Solder paste 有权
标题翻译：焊膏
公开(公告)号：JP2011121058A
公开(公告)日：2011-06-23
申请号：JP2009278209
申请日：2009-12-08
申请人： Arakawa Chem Ind Co Ltd , Denso Corp , Fujitsu Ten Ltd , Harima Chemicals Inc , Koki:Kk , Toyota Motor Corp , トヨタ自動車株式会社 , ハリマ化成株式会社 , 富士通テン株式会社 , 株式会社デンソー , 株式会社弘輝 , 荒川化学工業株式会社
发明人： IWAMURA EIJI , GOTO KAZUYUKI , ISHIGA FUMIO , YOSHIOKA TAKAYASU , UTSUNO KIMITAKA , NAKAMURA MITSUO , OKOCHI TERUO , MITSUHARU MASAKI , SUKEGAWA TAKUSHI , IKEDO KENJI , ANDO YOSHIYUKI , SHIRAI TAKESHI , MORI KIMIAKI , WADA RIE , NAKANISHI KENSUKE , AIHARA MASAMI , KUMAMOTO SATOSHI
IPC分类号： B23K35/363 , B23K35/22 , B23K35/26 , C22C12/00 , C22C13/00 , H05K3/34
CPC分类号： B23K35/3613 , B23K35/362 , C22C12/00 , C22C13/00 , H05K3/3484
摘要： PROBLEM TO BE SOLVED: To provide solder paste for enhancing the heating sag resistance. SOLUTION: Solder paste contains in its flux an activator having dibasic acid having the molecular weight of ≤250, monobasic acid having the molecular weight of 150-300, and dibasic acid having the molecular weight of 300-600, and at least one kind of resin additive selected from among a group constituted of high-density polyethylene and polypropylene. The flux contains the resin additive by 4-12 wt.%. The viscosity of the resin additive at 80°C is ≥400 Pa s. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供用于提高加热抗流挂性的焊膏。解决方案：焊膏中含有分子量为≤250的二元酸，分子量为150-300的一元酸和分子量为300-600的二元酸的活化剂，至少一种选自高密度聚乙烯和聚丙烯的树脂添加剂。助熔剂含有4-12重量％的树脂添加剂。树脂添加剂在80℃下的粘度≥400Pa·s。版权所有（C）2011，JPO＆INPIT

3. 发明专利

JP2014237805A 放熱性粉体塗料組成物、放熱性塗膜、及び被塗装物审中-公开
标题翻译：热抛光粉末涂料组合物，热镀膜和被涂物
公开(公告)号：JP2014237805A
公开(公告)日：2014-12-18
申请号：JP2014039012
申请日：2014-02-28
申请人：荒川化学工業株式会社 , Arakawa Chem Ind Co Ltd , ペルノックス株式会社 , Pelnox Ltd
发明人： IWAMURA EIJI , KOBAYASHI MICHINORI , KOMIYAMA HIROFUMI , TAKAHASHI NAOYA
IPC分类号： C09D163/00 , C09D5/03 , C09D7/12 , C09D167/00
CPC分类号： C09K5/14 , B05D5/00 , B05D2401/32 , C08K3/16 , C08K3/22 , C08K3/26 , C08K3/34 , C08K3/346 , C08K3/36 , C08K7/26 , C08K2003/162 , C08K2003/2241 , C08K2003/265 , C08K2003/385 , C09D5/033 , C09D7/40 , C09D7/61 , C09D7/68 , C09D7/69 , C09D163/00 , C09D163/04 , C09D167/00
摘要：【課題】放熱性、密着性、耐候性などの塗膜性能、及び/又は粉体塗料としての塗装性に優れた放熱性粉体塗料を提供する。【解決手段】エポキシ樹脂(a1)と、水酸基及び/又はカルボキシル基を有するポリエステル樹脂(a2)とからなる群から選択される少なくとも1種のバインダー樹脂(A)を含み、かつ、熱伝導度が0.2W/mK以上100W/mK未満の放熱性フィラー(B)を10質量%以上40質量%以下と、を含有する放熱性粉体塗料組成物。【選択図】図1
摘要翻译：要解决的问题：提供一种散热性能，粘合性和耐候性等涂膜性能和/或作为粉末涂料的涂布性能优异的散热粉末涂料。解决方案：提供散热粉末涂料含有（A）至少一种选自环氧树脂（a1）和具有羟基和/或羧基（a2）的聚酯树脂的粘合剂树脂的组合物和（B）具有 0.2W / mK以上且小于100W / mK的热传导率为10质量％以上且40质量％以下。

4. 发明专利

JP2013209645A Heat-dissipating coating material composition, heat-dissipating coating film and coated article 有权
标题翻译：热消散涂料组合物，散热涂膜和涂层物品
公开(公告)号：JP2013209645A
公开(公告)日：2013-10-10
申请号：JP2013042247
申请日：2013-03-04
申请人： Arakawa Chem Ind Co Ltd , 荒川化学工業株式会社 , Pelnox Ltd , ペルノックス株式会社
发明人： IWAMURA EIJI , KOBAYASHI MICHINORI , MOROZUMI YASUTAKA , TAKAHASHI NAOYA
IPC分类号： C09D133/06 , C09D5/00 , C09D7/12 , C09D161/22 , C09D161/28 , C09D163/00 , C09D163/02
摘要： PROBLEM TO BE SOLVED: To provide a new coating material composition that can form, without using a heat-dissipating filler exhibiting excellent heat conduction such as silicon carbide or aluminum nitride, a coating film excellent in a heat-dissipating property, adhesion and mechanical strength compared with one formed using such filler, on the surface of various base materials.SOLUTION: A liquid or paste-like heat-dissipating coating material composition includes an organic solvent (D) and, incorporated thereinto, 10-70 vol.% of a binder resin composition (A) including an acrylic resin (a-1) obtained by reacting an alkyl (meth)acrylate bearing a 1-18C alkyl group with a styrene, an epoxy resin (a-2) and an amino resin (a-3), 90-30 vol.% of a heat-dissipating filler (B) having thermal conductivity of less than 100 W/mK and, as required, 0-20 vol.% of a coloring pigment (C).
摘要翻译：要解决的问题：提供一种新的涂料组合物，其可以在不使用显示出优异的热传导性的散热填料如碳化硅或氮化铝的情况下形成散热性，粘附性和机械强度优异的涂膜与使用这种填料形成的一种相比，在各种基材的表面上。溶液：液体或糊状散热涂料组合物包括有机溶剂（D），并加入10-70体积％的包含通过使含有1-18C烷基的（甲基）丙烯酸烷基酯与苯乙烯，环氧树脂（a-2）和氨基树脂（a-1）反应得到的丙烯酸树脂（a-1） 3），90-30体积％的热导率小于100W / mK的散热填料（B），根据需要，0-20体积％的着色颜料（C）。

5. 发明专利

JP2014169372A Heat-releasing powdery coating material composition and heat-releasing coating film 有权
标题翻译：热释放粉末涂料材料组合物和热释放涂膜
公开(公告)号：JP2014169372A
公开(公告)日：2014-09-18
申请号：JP2013041339
申请日：2013-03-02
申请人： Arakawa Chem Ind Co Ltd , 荒川化学工業株式会社 , Pelnox Ltd , ペルノックス株式会社
发明人： IWAMURA EIJI , KOBAYASHI MICHINORI , KOMIYAMA HIROFUMI , TAKAHASHI NAOYA
IPC分类号： C09D201/00 , C09D5/03 , C09D7/12 , C09D163/00 , C09D163/02 , C09D163/04
摘要： PROBLEM TO BE SOLVED: To provide a heat-releasing powdery coating material composition capable of forming, as a heat release countermeasure against various heat generating objects, a coating film having a high heat release efficiency within a specified thermal energy wavelength band over which the object generates heat; and a heat-releasing coating film obtained from the composition.SOLUTION: The provided heat-releasing powdery coating material composition is a heat-releasing powdery coating material composition applied to heat-generating objects and including an infrared-absorbing binder resin (A) and infrared-absorbing inorganic particles (B) in which the respective ratios of the component (A) and component (B) with respect to 100 vol.% of the combined sum of both components are 10-70 vol.% and 90-30 vol.% and specified conditions are satisfied.
摘要翻译：要解决的问题：为了提供一种散热粉末涂料组合物，其能够形成在各种发热体内作为放热对策的热释放效率的涂膜，所述涂膜在特定的热能波长带内，物体产生热量和由该组合物获得的散热涂膜。提供的散热粉末涂料组合物是用于发热物体的散热粉末涂料组合物，其包含红外线吸收性粘合剂树脂（A）和其中组分（A）和组分（B）的相对比例相对于两种组分的总和的100体积％的比例为10-70体积％和90-30体积％的红外线吸收无机颗粒（B）满足％和规定条件。

6. 发明专利

JP2010137283A Flux composition for lead-free solder and lead-free solder paste 有权
标题翻译：无铅焊料和无铅焊膏的焊剂组合物
公开(公告)号：JP2010137283A
公开(公告)日：2010-06-24
申请号：JP2009256633
申请日：2009-11-10
申请人： Arakawa Chem Ind Co Ltd , 荒川化学工業株式会社
发明人： IWAMURA EIJI , KUBO NATSUKI , NAGASAKA SHINSUKE , KITAURA TOMONORI
IPC分类号： B23K35/363 , B23K35/22
摘要： PROBLEM TO BE SOLVED: To provide a flux composition for lead-free solder, by which heating slump can be suppressed even at 180°C when it is generated by a solvent or fluid resin in solder paste in preheating the solder paste, and by which superior wettability can be manifested when halogenated compound more effective than organic acid for the solder wettability is extremely reduced (≤0.09 wt.% in terms of chlorine amount and bromine amount, with their total ≤0.15 wt.%). SOLUTION: The flux composition for lead-free solder is used which contains (A) polyamide resin with a melting point ≥200°C and (B) rosin esters (B1) and/or polymerized rosin (B2) and which has an acid number of the flux composition 40 to 100 mg-KOH/g. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种无铅焊料助焊剂组合物，即使在180℃时也可以通过焊料中的溶剂或流体树脂在预焊锡膏中产生加热坍落度，并且当焊料润湿性比有机酸更有效的卤化化合物极大地降低（以氯量和溴量计为0.09重量％，总共≤0.15重量％）时，可以表现出优异的润湿性。解决方案：使用含有（A）熔点≥200℃的聚酰胺树脂和（B）松香酯（B1）和/或聚合松香（B2）的聚酰胺树脂的无铅焊料助焊剂组合物，其具有助焊剂组合物的酸值为40〜100mg-KOH / g。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2008302407A Flux composition for soldering and solder paste composition 有权
标题翻译：用于焊接和焊膏组合物的焊剂组合物
公开(公告)号：JP2008302407A
公开(公告)日：2008-12-18
申请号：JP2007153420
申请日：2007-06-08
申请人： Arakawa Chem Ind Co Ltd , 荒川化学工業株式会社
发明人： SHIMAZU DAISUKE , IWAMURA EIJI
IPC分类号： B23K35/363 , B23K35/26 , C22C13/00 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a flux composition for soldering, which allow scattering of flux and solder during fusion of solder to be reduced while maintaining solderability when used in the surface mounting of electronic components on a substrate, and to provide a solder paste composition.
SOLUTION: The flux composition for soldering has a melt viscosity of 100-500 mPa s by a B-type viscometer at 200°C. It is preferable that the flux composition contain 30-120 weight parts of polyetherester amide (b) based on 100 weight parts of polyhydric alcohol ester (a) of rosins. The solder paste composition contains solder powder in this flux.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于焊接的焊剂组合物，其在焊料熔化期间散射焊剂并减少焊料，同时在用于基板上的电子部件的表面安装中保持可焊性，并且提供焊膏组成。解决方案：用于焊接的焊剂组合物通过B型粘度计在200℃下的熔融粘度为100-500mPa·s。焊剂组合物优选含有30〜120重量份的聚醚酯酰胺（b），基于100重量份的松香的多元醇酯（a）。该焊膏组合物在该焊剂中含有焊料粉末。版权所有（C）2009，JPO＆INPIT

8. 发明专利

JP2008110369A Flux for cream solder, and cream solder 有权
标题翻译：用于奶油焊接的焊剂，以及烧结焊料
公开(公告)号：JP2008110369A
公开(公告)日：2008-05-15
申请号：JP2006294234
申请日：2006-10-30
申请人： Arakawa Chem Ind Co Ltd , 荒川化学工業株式会社
发明人： IWAMURA EIJI , MASUDA YOSHINORI , MOMOKI MASAYOSHI
IPC分类号： B23K35/363
摘要： PROBLEM TO BE SOLVED: To provide a flux composition which does not cause cracks on a residual flux film after soldering even under the circumstances of large temperature difference, and can form the residual flux film having excellent insulating property, and further to provide a cream solder.
SOLUTION: The flux for the cream solder contains a flux base, a solvent, a thixotropic agent, and an active agent. In this case, the flux for the cream solder, which flux contains the flux base containing acrylic resin (A) having a glass transition temperature of -100 to -50°C, and the cream solder containing solder powder and the flux for the cream solder are used.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供即使在温差大的情况下也能够在焊接后残留的焊剂膜上产生裂纹的助焊剂组合物，并且可以形成具有优异绝缘性的剩余焊剂膜，并且还可以提供奶油焊膏。
解决方案：膏状焊剂的焊剂含有焊剂碱，溶剂，触变剂和活性剂。在这种情况下，该助焊剂含有含玻璃化转变温度为-100〜-50℃的含有丙烯酸树脂（A）的助熔剂基质和含有焊料粉末的膏状物的助焊剂，以及用于膏霜的助熔剂使用焊料。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2008110379A Flux for cream solder, and cream solder 审中-公开
标题翻译：用于奶油焊接的焊剂，以及烧结焊料
公开(公告)号：JP2008110379A
公开(公告)日：2008-05-15
申请号：JP2006295220
申请日：2006-10-31
申请人： Arakawa Chem Ind Co Ltd , 荒川化学工業株式会社
发明人： IWAMURA EIJI , MASUDA YOSHINORI , MOMOKI MASAYOSHI
IPC分类号： B23K35/363 , B23K35/22 , B23K35/26 , C22C13/00
摘要： PROBLEM TO BE SOLVED: To provide cream solder which can keep the flowability capable of sufficiently filling close pitch openings of an electronic component, and does not stick to a mask, and can keep the shape of a soldered joint portion without dripping and permeation, and further to provide the flux for composing the cream solder.
SOLUTION: The flux for the cream solder, which flux contains a fluorine compound therein, and the cream solder containing solder powder and the flux for the cream solder are used.
COPYRIGHT: (C)2008,JPO&INPIT

10. 发明专利

JP2008110365A Flux for cream solder, and cream solder 审中-公开
标题翻译：用于奶油焊接的焊剂，以及烧结焊料
公开(公告)号：JP2008110365A
公开(公告)日：2008-05-15
申请号：JP2006294008
申请日：2006-10-30
申请人： Arakawa Chem Ind Co Ltd , 荒川化学工業株式会社
发明人： IWAMURA EIJI , MASUDA YOSHINORI , MOMOKI MASAYOSHI
IPC分类号： B23K35/363 , B23K35/26 , C22C13/00 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a stable flux composition which does not cause cracks on a residual flux film after soldering even under the circumstances of large temperature difference, and can form the residual flux film showing a moisture proof effect by covering the surface of the solder and the surface of circuits, and further to provide cream solder.
SOLUTION: The flux for cream solder contains a copolymer (C) obtained by copolymerizing a compound (A) obtained by reacting a compound (a) having each at least one of (meth)acrylic radical and one vinylether radical with rosin (b) and an acrylic monomer (B).
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种稳定的助焊剂组合物，即使在温差大的情况下也不会在焊接后的剩余焊剂膜上产生裂纹，并且可以通过覆盖防护效果形成具有防潮效果的残留焊剂膜焊料表面和电路表面，并进一步提供膏状焊膏。解决方案：用于膏状焊料的助熔剂含有共聚物（C），该共聚物（C）通过使具有（甲基）丙烯酸基和一个乙烯基醚基中的至少一个的化合物（a）与松香（ b）和丙烯酸类单体（B）。版权所有（C）2008，JPO＆INPIT

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