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1. 发明授权

US07042015B2 Semi-transparent power monitor integrated with a light producing module 有权
公开(公告)号：US07042015B2
公开(公告)日：2006-05-09
申请号：US09924840
申请日：2001-08-08
申请人： Decai Sun , Eric Peeters , Christopher L. Chua , Francesco Lemmi , Patrick Y. Maeda , Scott Solberg
发明人： Decai Sun , Eric Peeters , Christopher L. Chua , Francesco Lemmi , Patrick Y. Maeda , Scott Solberg
IPC分类号： H01L31/12
CPC分类号： H01L31/1055 , B41J2/45 , H01L25/0753 , H01L31/1016 , H01L2924/0002 , H01L2924/3011 , H01S5/02 , H01S5/0262 , H01S5/4025 , H01L2924/00
摘要： A light-producing device integrated with a power monitoring system include a light-producing device from which light is emitted in wavelengths that can range from approximately 700 nm to approximately 3 microns. A semi-transparent sensor is located such that at least a portion of the light emitted passes through the semi-transparent sensor and at least a portion of light is absorbed by the semi-transparent sensor. The semi-transparent sensor is configured to be semi-transparent at wavelengths that can range from 700 nm to 3 microns. The semi-transparent sensor may also be used with an external light source, for example with fiber-optic cables.

2. 发明授权

US06706202B1 Method for shaped optical MEMS components with stressed thin films 失效
标题翻译：具有应力薄膜的成形光学MEMS部件的方法
公开(公告)号：US06706202B1
公开(公告)日：2004-03-16
申请号：US09672386
申请日：2000-09-28
申请人： Decai Sun , Michel A. Rosa , Eric Peeters , Francesco Lemmi , Patrick Y. Maeda , Christopher L. Chua
发明人： Decai Sun , Michel A. Rosa , Eric Peeters , Francesco Lemmi , Patrick Y. Maeda , Christopher L. Chua
IPC分类号： B81B702
CPC分类号： B81C1/00666 , B81B2201/047 , B81C2201/017
摘要： A method is disclosed for making shaped optical moems components with stressed thin films. In particular, stressed thin films are used to make mirror structures.
摘要翻译：公开了一种用于制造具有应力薄膜的成形光学元件的方法。特别地，应力薄膜用于制造镜面结构。

3. 发明授权

US07000315B2 Method of making photolithographically-patterned out-of-plane coil structures 有权
公开(公告)号：US07000315B2
公开(公告)日：2006-02-21
申请号：US10387203
申请日：2003-03-11
申请人： Christopher L. Chua , Francesco Lemmi , Koenraad F. Van Schuylenbergh , Jeng Ping Lu , David K. Fork , Eric Peeters , Decai Sun , Donald L. Smith , Linda T. Romano
发明人： Christopher L. Chua , Francesco Lemmi , Koenraad F. Van Schuylenbergh , Jeng Ping Lu , David K. Fork , Eric Peeters , Decai Sun , Donald L. Smith , Linda T. Romano
IPC分类号： H01R43/16
CPC分类号： H01L24/13 , G01R1/06727 , G01R3/00 , H01F17/0033 , H01F17/02 , H01F41/041 , H01L21/76838 , H01L21/7688 , H01L23/498 , H01L23/49811 , H01L23/5227 , H01L24/11 , H01L24/16 , H01L24/48 , H01L28/10 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/13099 , H01L2224/4847 , H01L2224/8592 , H01L2924/0001 , H01L2924/00014 , H01L2924/00015 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01042 , H01L2924/01047 , H01L2924/01057 , H01L2924/01058 , H01L2924/01061 , H01L2924/01068 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/12034 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , Y10T29/4902 , Y10T29/49071 , Y10T29/49147 , Y10T29/49204 , Y10T29/49208 , Y10T29/4921 , Y10T29/49218 , H01L2924/00 , H01L2224/05599 , H01L2224/85399 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.

4. 发明授权

US06856225B1 Photolithographically-patterned out-of-plane coil structures and method of making 有权
标题翻译：光刻图案的平面外线圈结构和制造方法
公开(公告)号：US06856225B1
公开(公告)日：2005-02-15
申请号：US09573815
申请日：2000-05-17
申请人： Christopher L. Chua , Francesco Lemmi , Koenraad F. Van Schuylenbergh , Jeng Ping Lu , David K. Fork , Eric Peeters , Decai Sun , Donald L. Smith , Linda T. Romano
发明人： Christopher L. Chua , Francesco Lemmi , Koenraad F. Van Schuylenbergh , Jeng Ping Lu , David K. Fork , Eric Peeters , Decai Sun , Donald L. Smith , Linda T. Romano
IPC分类号： H01F41/04 , G01R1/067 , G01R3/00 , G03C5/00 , H01F17/00 , H01F17/02 , H01F27/29 , H01L21/02 , H01L21/60 , H01L21/768 , H01L23/485 , H01L23/49 , H01L23/498 , H01L23/522 , H01R9/03 , H05K7/02
CPC分类号： H01L24/13 , G01R1/06727 , G01R3/00 , H01F17/0033 , H01F17/02 , H01F41/041 , H01L21/76838 , H01L21/7688 , H01L23/498 , H01L23/49811 , H01L23/5227 , H01L24/11 , H01L24/16 , H01L24/48 , H01L28/10 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/13099 , H01L2224/4847 , H01L2224/8592 , H01L2924/0001 , H01L2924/00014 , H01L2924/00015 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01042 , H01L2924/01047 , H01L2924/01057 , H01L2924/01058 , H01L2924/01061 , H01L2924/01068 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/12034 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , Y10T29/4902 , Y10T29/49071 , Y10T29/49147 , Y10T29/49204 , Y10T29/49208 , Y10T29/4921 , Y10T29/49218 , H01L2924/00 , H01L2224/05599 , H01L2224/85399 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.
摘要翻译：可以用于高Q电感和变压器的片上集成的平面外微结构使得磁场方向平行于衬底平面而不需要高纵横比处理。光刻图案的线圈结构包括具有固有应力分布的弹性构件。固有的应力分布使形成环绕的基板远离基板偏移。锚固部分保持固定到基底上。自由部分端部成为可以通过焊接或电镀而连接到基板的第二锚固部分。一系列单独的线圈结构可以通过它们的锚定部分接合以形成电感器和变压器。

5. 发明授权

US07284324B2 Method of making photolithographically-patterned out-of-plane coil structures 有权
标题翻译：制造光刻图案的平面外线圈结构的方法
公开(公告)号：US07284324B2
公开(公告)日：2007-10-23
申请号：US11197675
申请日：2005-08-04
申请人： Christopher L. Chua , Francesco Lemmi , Koenraad F. Van Schuylenbergh , Jeng Ping Lu , David K. Fork , Eric Peeters , Decai Sun , Donald L. Smith , Linda T. Romano
发明人： Christopher L. Chua , Francesco Lemmi , Koenraad F. Van Schuylenbergh , Jeng Ping Lu , David K. Fork , Eric Peeters , Decai Sun , Donald L. Smith , Linda T. Romano
IPC分类号： H01R43/16
CPC分类号： H01L24/13 , G01R1/06727 , G01R3/00 , H01F17/0033 , H01F17/02 , H01F41/041 , H01L21/76838 , H01L21/7688 , H01L23/498 , H01L23/49811 , H01L23/5227 , H01L24/11 , H01L24/16 , H01L24/48 , H01L28/10 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/13099 , H01L2224/4847 , H01L2224/8592 , H01L2924/0001 , H01L2924/00014 , H01L2924/00015 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01042 , H01L2924/01047 , H01L2924/01057 , H01L2924/01058 , H01L2924/01061 , H01L2924/01068 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/12034 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , Y10T29/4902 , Y10T29/49071 , Y10T29/49147 , Y10T29/49204 , Y10T29/49208 , Y10T29/4921 , Y10T29/49218 , H01L2924/00 , H01L2224/05599 , H01L2224/85399 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.
摘要翻译：可以用于高Q电感和变压器的片上集成的平面外微结构使得磁场方向平行于衬底平面而不需要高纵横比处理。光刻图案的线圈结构包括具有固有应力分布的弹性构件。固有的应力分布使形成环绕的基板远离基板偏移。锚固部分保持固定到基底上。自由部分端部成为可以通过焊接或电镀而连接到基板的第二锚固部分。一系列单独的线圈结构可以通过它们的锚定部分接合以形成电感器和变压器。

6. 发明授权

US06947291B2 Photolithographically-patterned out-of-plane coil structures and method of making 有权
公开(公告)号：US06947291B2
公开(公告)日：2005-09-20
申请号：US10154555
申请日：2002-05-23
申请人： Christopher L. Chua , Francesco Lemmi , Koenraad F. Van Schuylenbergh , Jeng Ping Lu , David K. Fork , Eric Peeters , Decai Sun , Donald L. Smith , Linda T. Romano
发明人： Christopher L. Chua , Francesco Lemmi , Koenraad F. Van Schuylenbergh , Jeng Ping Lu , David K. Fork , Eric Peeters , Decai Sun , Donald L. Smith , Linda T. Romano
IPC分类号： H01F41/04 , G01R1/067 , G01R3/00 , G03C5/00 , H01F17/00 , H01F17/02 , H01F27/29 , H01L21/02 , H01L21/60 , H01L21/768 , H01L23/485 , H01L23/49 , H01L23/498 , H01L23/522 , H01R9/03 , H05K7/02
CPC分类号： H01L24/13 , G01R1/06727 , G01R3/00 , H01F17/0033 , H01F17/02 , H01F41/041 , H01L21/76838 , H01L21/7688 , H01L23/498 , H01L23/49811 , H01L23/5227 , H01L24/11 , H01L24/16 , H01L24/48 , H01L28/10 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/13099 , H01L2224/4847 , H01L2224/8592 , H01L2924/0001 , H01L2924/00014 , H01L2924/00015 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01042 , H01L2924/01047 , H01L2924/01057 , H01L2924/01058 , H01L2924/01061 , H01L2924/01068 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/12034 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , Y10T29/4902 , Y10T29/49071 , Y10T29/49147 , Y10T29/49204 , Y10T29/49208 , Y10T29/4921 , Y10T29/49218 , H01L2924/00 , H01L2224/05599 , H01L2224/85399 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.

7. 发明申请

US20050270135A1 Method of making photolithographically-patterned out-of-plane coil structures 有权
标题翻译：制造光刻图案的平面外线圈结构的方法
公开(公告)号：US20050270135A1
公开(公告)日：2005-12-08
申请号：US11197675
申请日：2005-08-04
申请人： Christopher Chua , Francesco Lemmi , Koenraad Van Schuylenbergh , Jeng Lu , David Fork , Eric Peeters , Decai Sun , Donald Smith , Linda Romano
发明人： Christopher Chua , Francesco Lemmi , Koenraad Van Schuylenbergh , Jeng Lu , David Fork , Eric Peeters , Decai Sun , Donald Smith , Linda Romano
IPC分类号： H01F41/04 , G01R1/067 , G01R3/00 , G03C5/00 , H01F17/00 , H01F17/02 , H01F27/29 , H01L21/02 , H01L21/60 , H01L21/768 , H01L23/485 , H01L23/49 , H01L23/498 , H01L23/522 , H01R9/03 , H05K7/02
CPC分类号： H01L24/13 , G01R1/06727 , G01R3/00 , H01F17/0033 , H01F17/02 , H01F41/041 , H01L21/76838 , H01L21/7688 , H01L23/498 , H01L23/49811 , H01L23/5227 , H01L24/11 , H01L24/16 , H01L24/48 , H01L28/10 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/13099 , H01L2224/4847 , H01L2224/8592 , H01L2924/0001 , H01L2924/00014 , H01L2924/00015 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01042 , H01L2924/01047 , H01L2924/01057 , H01L2924/01058 , H01L2924/01061 , H01L2924/01068 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/12034 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , Y10T29/4902 , Y10T29/49071 , Y10T29/49147 , Y10T29/49204 , Y10T29/49208 , Y10T29/4921 , Y10T29/49218 , H01L2924/00 , H01L2224/05599 , H01L2224/85399 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.
摘要翻译：可以用于高Q电感和变压器的片上集成的平面外微结构使得磁场方向平行于衬底平面而不需要高纵横比处理。光刻图案的线圈结构包括具有固有应力分布的弹性构件。固有的应力分布使形成环绕的基板远离基板偏移。锚固部分保持固定到基底上。自由部分端部成为可以通过焊接或电镀而连接到基板的第二锚固部分。一系列单独的线圈结构可以通过它们的锚定部分接合以形成电感器和变压器。

8. 发明授权

US06794725B2 Amorphous silicon sensor with micro-spring interconnects for achieving high uniformity in integrated light-emitting sources 有权
标题翻译：具有微弹簧互连的非晶硅传感器，用于实现集成发光源的高均匀性
公开(公告)号：US06794725B2
公开(公告)日：2004-09-21
申请号：US09469122
申请日：1999-12-21
申请人： Francesco Lemmi , Christopher L. Chua , Ping Mei , JengPing Lu , David K. Fork , Harry J. McIntyre
发明人： Francesco Lemmi , Christopher L. Chua , Ping Mei , JengPing Lu , David K. Fork , Harry J. McIntyre
IPC分类号： H01L3100
CPC分类号： H01L31/1055 , B41J2/45 , H01L25/0753 , H01L31/1016 , H01L2924/0002 , H01L2924/3011 , H01S5/02 , H01S5/0262 , H01S5/4025 , H01L2924/00
摘要： A hybrid structure or device is provided wherein carried on a single substrate is at least one micro-spring interconnect having an elastic material that is initially fixed to a surface of the substrate, an anchor portion which is fixed to the substrate surface and a free portion. The spring contact is self-assembling in that as the free portion is released it moves out of the plane of the substrate. Also integrated on the substrate is a sensor having an active layer and contacts. The substrate and sensor may be formed of materials which are somewhat partially transparent to light at certain infrared wavelengths. The integrated sensor/spring contact configuration may be used in an imaging system to sense output from a light source which is used for image formation. The light source may be a laser array, LED array or other appropriate light source. The sensor is appropriately sized to sense all or some part of light from the light source. The sensor may also be sufficiently transparent so that light is not blocked from its emission path, with a contrast ratio such that it only absorbs a small fraction of light passing therethrough. An additional characteristic is that the manufacturing process is compatible with the manufacturing process for the micro-spring interconnects. Data from the sensor is used as light source correction information. This information is provided to a calibration configuration which allows for calibration of high-speed systems.
摘要翻译：提供了一种混合结构或装置，其中承载在单个基板上的是具有弹性材料的至少一个微弹簧互连，弹性材料最初固定到基板的表面，固定到基板表面的锚定部分和自由部分。弹簧接触件是自组装的，因为随着自由部分的释放，它移出基板的平面。还集成在基板上的是具有有源层和触点的传感器。衬底和传感器可以由对某些红外波长的光稍微部分透明的材料形成。集成的传感器/弹簧接触配置可用于成像系统中以感测用于图像形成的光源的输出。光源可以是激光阵列，LED阵列或其他合适的光源。传感器的尺寸适当，可以感测来自光源的全部或部分光线。传感器也可以是足够透明的，使得光不被其发射路径阻挡，对比度使得其仅吸收通过其中的一小部分光。另外的特征是制造工艺与微弹簧互连的制造工艺兼容。来自传感器的数据用作光源校正信息。该信息被提供给允许校准高速系统的校准配置。

9. 发明申请

US20080305619A1 METHOD OF FORMING GROUP IV SEMICONDUCTOR JUNCTIONS USING LASER PROCESSING 审中-公开
标题翻译：使用激光加工形成IV族半导体结的方法
公开(公告)号：US20080305619A1
公开(公告)日：2008-12-11
申请号：US12114141
申请日：2008-05-02
申请人： Francesco Lemmi , Andreas Meisel , Homer Antoniadis
发明人： Francesco Lemmi , Andreas Meisel , Homer Antoniadis
IPC分类号： H01L21/20 , H01L21/02
CPC分类号： H01L31/182 , H01L21/0237 , H01L21/02524 , H01L21/02532 , H01L21/02601 , H01L21/02628 , H01L21/02675 , H01L31/03682 , H01L31/03921 , H01L31/068 , H01L31/077 , Y02E10/546 , Y02E10/547 , Y02P70/521
摘要： A method forming a Group IV semiconductor junction on a substrate is disclosed. The method includes depositing a first set Group IV semiconductor nanoparticles on the substrate. The method also includes applying a first laser at a first laser wavelength, a first fluence, a first pulse duration, a first number of repetitions, and a first repetition rate to the first set Group IV semiconductor nanoparticles to form a first densified film with a first thickness, wherein the first laser wavelength and the first fluence are selected to limit a first depth profile of the first laser to the first thickness. The method further includes depositing a second set Group IV semiconductor nanoparticles on the first densified film. The method also includes applying a second laser at a second laser wavelength, a second fluence, a second pulse duration, a second number of repetitions, and a second repetition rate to the second set Group IV semiconductor nanoparticles to form a second densified film with a second thickness, wherein the second laser wavelength and the second fluence are selected to limit a second depth profile of the second laser to the second thickness.
摘要翻译：公开了一种在衬底上形成IV族半导体结的方法。该方法包括在衬底上沉积第一组IV族半导体纳米颗粒。该方法还包括将第一激光波长的第一激光，第一注量，第一脉冲持续时间，第一次重复和第一重复率应用于第一组IV族半导体纳米颗粒，以形成第一致密化膜，其具有第一厚度，其中选择第一激光波长和第一注量以将第一激光器的第一深度分布限制到第一厚度。该方法还包括在第一致密化膜上沉积第二组IV族半导体纳米颗粒。该方法还包括将第二激光器以第二激光波长，第二注量，第二脉冲持续时间，第二数量的重复和第二重复率施加到第二组IV族半导体纳米颗粒以形成第二致密化膜，其具有第二厚度，其中选择第二激光波长和第二注量以将第二激光器的第二深度分布限制到第二厚度。

10. 发明申请

US20080138966A1 METHOD OF FABRICATING A DENSIFIED NANOPARTICLE THIN FILM WITH A SET OF OCCLUDED PORES 审中-公开
标题翻译：用一组封闭的聚四氟乙烯薄膜制造方法
公开(公告)号：US20080138966A1
公开(公告)日：2008-06-12
申请号：US11940056
申请日：2007-11-14
申请人： Elena V. Rogojina , Francesco Lemmi , Maxim Kelman , Xuegeng Li , Pingrong Yu
发明人： Elena V. Rogojina , Francesco Lemmi , Maxim Kelman , Xuegeng Li , Pingrong Yu
IPC分类号： H01L21/208
CPC分类号： H01L31/1804 , H01L21/02422 , H01L21/02425 , H01L21/02488 , H01L21/02491 , H01L21/02532 , H01L21/02576 , H01L21/02579 , H01L21/02628 , H01L21/02664 , H01L31/06 , Y02E10/547 , Y02P70/521
摘要： A method of fabricating a densified nanoparticle thin film with a set of occluded pores in a chamber is disclosed. The method includes positioning a substrate in the chamber; and depositing a nanoparticle ink, the nanoparticle ink including a set of Group IV semiconductor particles and a solvent. The method further includes heating the nanoparticle ink to a first temperature between about 30° C. and about 300° C., and for a first time period between about 5 minutes and about 60 minutes, wherein the solvent is substantially removed, and a porous compact with a set of pores is formed. The method also includes heating the porous compact to a second temperature between about 300° C. and about 900° C., and for a second time period of between about 5 minutes and about 15 minutes, and flowing a precursor gas into the chamber at a partial pressure between about 0.1 Torr and about 50 Torr, wherein the precursor gas substantially fills the set of pores, and wherein the densified nanoparticle film with the set of occluded pores is formed.
摘要翻译：公开了一种在腔室中制造具有一组闭塞孔的致密纳米颗粒薄膜的方法。该方法包括将衬底定位在腔室中; 以及沉积纳米颗粒油墨，所述纳米颗粒油墨包括一组IV族半导体颗粒和溶剂。该方法还包括将纳米颗粒油墨加热至约30℃至约300℃之间的第一温度和约5分钟至约60分钟的第一时间，其中基本上除去溶剂，并且将多孔形成一组细孔。该方法还包括将多孔压块加热至约300℃至约900℃之间的第二温度和约5分钟至约15分钟的第二时间段，并将前体气体流入室中在约0.1托和约50托之间的分压，其中前体气体基本上填充该组孔，并且其中形成具有该组闭塞孔的致密纳米颗粒膜。

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