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1. 发明授权

US06794725B2 Amorphous silicon sensor with micro-spring interconnects for achieving high uniformity in integrated light-emitting sources 有权
标题翻译：具有微弹簧互连的非晶硅传感器，用于实现集成发光源的高均匀性
公开(公告)号：US06794725B2
公开(公告)日：2004-09-21
申请号：US09469122
申请日：1999-12-21
申请人： Francesco Lemmi , Christopher L. Chua , Ping Mei , JengPing Lu , David K. Fork , Harry J. McIntyre
发明人： Francesco Lemmi , Christopher L. Chua , Ping Mei , JengPing Lu , David K. Fork , Harry J. McIntyre
IPC分类号： H01L3100
CPC分类号： H01L31/1055 , B41J2/45 , H01L25/0753 , H01L31/1016 , H01L2924/0002 , H01L2924/3011 , H01S5/02 , H01S5/0262 , H01S5/4025 , H01L2924/00
摘要： A hybrid structure or device is provided wherein carried on a single substrate is at least one micro-spring interconnect having an elastic material that is initially fixed to a surface of the substrate, an anchor portion which is fixed to the substrate surface and a free portion. The spring contact is self-assembling in that as the free portion is released it moves out of the plane of the substrate. Also integrated on the substrate is a sensor having an active layer and contacts. The substrate and sensor may be formed of materials which are somewhat partially transparent to light at certain infrared wavelengths. The integrated sensor/spring contact configuration may be used in an imaging system to sense output from a light source which is used for image formation. The light source may be a laser array, LED array or other appropriate light source. The sensor is appropriately sized to sense all or some part of light from the light source. The sensor may also be sufficiently transparent so that light is not blocked from its emission path, with a contrast ratio such that it only absorbs a small fraction of light passing therethrough. An additional characteristic is that the manufacturing process is compatible with the manufacturing process for the micro-spring interconnects. Data from the sensor is used as light source correction information. This information is provided to a calibration configuration which allows for calibration of high-speed systems.
摘要翻译：提供了一种混合结构或装置，其中承载在单个基板上的是具有弹性材料的至少一个微弹簧互连，弹性材料最初固定到基板的表面，固定到基板表面的锚定部分和自由部分。弹簧接触件是自组装的，因为随着自由部分的释放，它移出基板的平面。还集成在基板上的是具有有源层和触点的传感器。衬底和传感器可以由对某些红外波长的光稍微部分透明的材料形成。集成的传感器/弹簧接触配置可用于成像系统中以感测用于图像形成的光源的输出。光源可以是激光阵列，LED阵列或其他合适的光源。传感器的尺寸适当，可以感测来自光源的全部或部分光线。传感器也可以是足够透明的，使得光不被其发射路径阻挡，对比度使得其仅吸收通过其中的一小部分光。另外的特征是制造工艺与微弹簧互连的制造工艺兼容。来自传感器的数据用作光源校正信息。该信息被提供给允许校准高速系统的校准配置。

2. 发明授权

US07284324B2 Method of making photolithographically-patterned out-of-plane coil structures 有权
标题翻译：制造光刻图案的平面外线圈结构的方法
公开(公告)号：US07284324B2
公开(公告)日：2007-10-23
申请号：US11197675
申请日：2005-08-04
申请人： Christopher L. Chua , Francesco Lemmi , Koenraad F. Van Schuylenbergh , Jeng Ping Lu , David K. Fork , Eric Peeters , Decai Sun , Donald L. Smith , Linda T. Romano
发明人： Christopher L. Chua , Francesco Lemmi , Koenraad F. Van Schuylenbergh , Jeng Ping Lu , David K. Fork , Eric Peeters , Decai Sun , Donald L. Smith , Linda T. Romano
IPC分类号： H01R43/16
CPC分类号： H01L24/13 , G01R1/06727 , G01R3/00 , H01F17/0033 , H01F17/02 , H01F41/041 , H01L21/76838 , H01L21/7688 , H01L23/498 , H01L23/49811 , H01L23/5227 , H01L24/11 , H01L24/16 , H01L24/48 , H01L28/10 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/13099 , H01L2224/4847 , H01L2224/8592 , H01L2924/0001 , H01L2924/00014 , H01L2924/00015 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01042 , H01L2924/01047 , H01L2924/01057 , H01L2924/01058 , H01L2924/01061 , H01L2924/01068 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/12034 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , Y10T29/4902 , Y10T29/49071 , Y10T29/49147 , Y10T29/49204 , Y10T29/49208 , Y10T29/4921 , Y10T29/49218 , H01L2924/00 , H01L2224/05599 , H01L2224/85399 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.
摘要翻译：可以用于高Q电感和变压器的片上集成的平面外微结构使得磁场方向平行于衬底平面而不需要高纵横比处理。光刻图案的线圈结构包括具有固有应力分布的弹性构件。固有的应力分布使形成环绕的基板远离基板偏移。锚固部分保持固定到基底上。自由部分端部成为可以通过焊接或电镀而连接到基板的第二锚固部分。一系列单独的线圈结构可以通过它们的锚定部分接合以形成电感器和变压器。

3. 发明授权

US07000315B2 Method of making photolithographically-patterned out-of-plane coil structures 有权
公开(公告)号：US07000315B2
公开(公告)日：2006-02-21
申请号：US10387203
申请日：2003-03-11
申请人： Christopher L. Chua , Francesco Lemmi , Koenraad F. Van Schuylenbergh , Jeng Ping Lu , David K. Fork , Eric Peeters , Decai Sun , Donald L. Smith , Linda T. Romano
发明人： Christopher L. Chua , Francesco Lemmi , Koenraad F. Van Schuylenbergh , Jeng Ping Lu , David K. Fork , Eric Peeters , Decai Sun , Donald L. Smith , Linda T. Romano
IPC分类号： H01R43/16
CPC分类号： H01L24/13 , G01R1/06727 , G01R3/00 , H01F17/0033 , H01F17/02 , H01F41/041 , H01L21/76838 , H01L21/7688 , H01L23/498 , H01L23/49811 , H01L23/5227 , H01L24/11 , H01L24/16 , H01L24/48 , H01L28/10 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/13099 , H01L2224/4847 , H01L2224/8592 , H01L2924/0001 , H01L2924/00014 , H01L2924/00015 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01042 , H01L2924/01047 , H01L2924/01057 , H01L2924/01058 , H01L2924/01061 , H01L2924/01068 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/12034 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , Y10T29/4902 , Y10T29/49071 , Y10T29/49147 , Y10T29/49204 , Y10T29/49208 , Y10T29/4921 , Y10T29/49218 , H01L2924/00 , H01L2224/05599 , H01L2224/85399 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.

4. 发明授权

US06856225B1 Photolithographically-patterned out-of-plane coil structures and method of making 有权
标题翻译：光刻图案的平面外线圈结构和制造方法
公开(公告)号：US06856225B1
公开(公告)日：2005-02-15
申请号：US09573815
申请日：2000-05-17
申请人： Christopher L. Chua , Francesco Lemmi , Koenraad F. Van Schuylenbergh , Jeng Ping Lu , David K. Fork , Eric Peeters , Decai Sun , Donald L. Smith , Linda T. Romano
发明人： Christopher L. Chua , Francesco Lemmi , Koenraad F. Van Schuylenbergh , Jeng Ping Lu , David K. Fork , Eric Peeters , Decai Sun , Donald L. Smith , Linda T. Romano
IPC分类号： H01F41/04 , G01R1/067 , G01R3/00 , G03C5/00 , H01F17/00 , H01F17/02 , H01F27/29 , H01L21/02 , H01L21/60 , H01L21/768 , H01L23/485 , H01L23/49 , H01L23/498 , H01L23/522 , H01R9/03 , H05K7/02
CPC分类号： H01L24/13 , G01R1/06727 , G01R3/00 , H01F17/0033 , H01F17/02 , H01F41/041 , H01L21/76838 , H01L21/7688 , H01L23/498 , H01L23/49811 , H01L23/5227 , H01L24/11 , H01L24/16 , H01L24/48 , H01L28/10 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/13099 , H01L2224/4847 , H01L2224/8592 , H01L2924/0001 , H01L2924/00014 , H01L2924/00015 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01042 , H01L2924/01047 , H01L2924/01057 , H01L2924/01058 , H01L2924/01061 , H01L2924/01068 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/12034 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , Y10T29/4902 , Y10T29/49071 , Y10T29/49147 , Y10T29/49204 , Y10T29/49208 , Y10T29/4921 , Y10T29/49218 , H01L2924/00 , H01L2224/05599 , H01L2224/85399 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.
摘要翻译：可以用于高Q电感和变压器的片上集成的平面外微结构使得磁场方向平行于衬底平面而不需要高纵横比处理。光刻图案的线圈结构包括具有固有应力分布的弹性构件。固有的应力分布使形成环绕的基板远离基板偏移。锚固部分保持固定到基底上。自由部分端部成为可以通过焊接或电镀而连接到基板的第二锚固部分。一系列单独的线圈结构可以通过它们的锚定部分接合以形成电感器和变压器。

5. 发明授权

US06947291B2 Photolithographically-patterned out-of-plane coil structures and method of making 有权
公开(公告)号：US06947291B2
公开(公告)日：2005-09-20
申请号：US10154555
申请日：2002-05-23
申请人： Christopher L. Chua , Francesco Lemmi , Koenraad F. Van Schuylenbergh , Jeng Ping Lu , David K. Fork , Eric Peeters , Decai Sun , Donald L. Smith , Linda T. Romano
发明人： Christopher L. Chua , Francesco Lemmi , Koenraad F. Van Schuylenbergh , Jeng Ping Lu , David K. Fork , Eric Peeters , Decai Sun , Donald L. Smith , Linda T. Romano
IPC分类号： H01F41/04 , G01R1/067 , G01R3/00 , G03C5/00 , H01F17/00 , H01F17/02 , H01F27/29 , H01L21/02 , H01L21/60 , H01L21/768 , H01L23/485 , H01L23/49 , H01L23/498 , H01L23/522 , H01R9/03 , H05K7/02
CPC分类号： H01L24/13 , G01R1/06727 , G01R3/00 , H01F17/0033 , H01F17/02 , H01F41/041 , H01L21/76838 , H01L21/7688 , H01L23/498 , H01L23/49811 , H01L23/5227 , H01L24/11 , H01L24/16 , H01L24/48 , H01L28/10 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/13099 , H01L2224/4847 , H01L2224/8592 , H01L2924/0001 , H01L2924/00014 , H01L2924/00015 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01042 , H01L2924/01047 , H01L2924/01057 , H01L2924/01058 , H01L2924/01061 , H01L2924/01068 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/12034 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , Y10T29/4902 , Y10T29/49071 , Y10T29/49147 , Y10T29/49204 , Y10T29/49208 , Y10T29/4921 , Y10T29/49218 , H01L2924/00 , H01L2224/05599 , H01L2224/85399 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.

6. 发明申请

US20110271857A1 PRINTING SYSTEM EMPLOYING DEFORMABLE POLYMER PRINTING PLATES 有权
标题翻译：打印系统采用可变聚合物印刷板
公开(公告)号：US20110271857A1
公开(公告)日：2011-11-10
申请号：US13185188
申请日：2011-07-18
申请人： Jürgen H. Daniel , Dirk De Bruyker , David K. Fork , Christopher L. Chua
发明人： Jürgen H. Daniel , Dirk De Bruyker , David K. Fork , Christopher L. Chua
IPC分类号： B41C3/00
CPC分类号： B41C1/00 , B41C1/1041 , B41C1/186 , B41N1/12 , B41N1/22 , B41N3/00 , B41N3/003 , B41N3/006
摘要： A printing plate has a substrate, an array of cells on the substrate, wherein each cell corresponds to an element of a print image, a deformable polymer material localized into the cells such that each cell is at least partially formed from the deformable polymer material, a reservoir corresponding to each cell to collect the deformable polymer material as needed when the deformable polymer material is one of either melted or softened, and a heater to cause the deformable polymer material to either melt or soften. A method of forming a printing plate provides an array of cells, first heats the array of cells such that the deformable polymer material does one of either melts or softens, actuates the cells in the array to assume a deformed state, cools the array of cells to solidify the cells in the deformed state, second heats the cells such that the deformable polymer material in selected ones of the cells does one of either soften or melt and return to a less deformed state to form a printing pattern, and cools the surface to solidify the deformable polymer material in the printing pattern. A method of forming a printing plate provides an array of cells, heats the array of cells such that the deformable polymer material softens, actuates selected ones of the cells to deform surfaces of the selected ones to form a printing pattern, and cools the array of cells to solidify the printing pattern into a printing plate.
摘要翻译：印版具有衬底，衬底上的单元阵列，其中每个单元对应于印刷图像的元素，位于单元中的可变形聚合物材料，使得每个单元至少部分地由可变形聚合物材料形成，当可变形聚合物材料是熔化或软化之一时，根据需要收集可变形聚合物材料的储存器，以及使可变形聚合物材料熔融或软化的加热器。形成印版的方法提供了一个单元阵列，首先加热单元阵列，使得可变形的聚合物材料进行融化或软化之一，致动阵列中的单元以呈现变形状态，冷却单元阵列使细胞在变形状态下固化，第二加热细胞，使得选定细胞中的可变形聚合物材料进行软化或熔化，并恢复到较小的变形状态以形成印刷图案，并将表面冷却至使印刷图案中的可变形聚合物材料固化。形成印版的方法提供了一个单元阵列，加热单元阵列使得可变形的聚合物材料软化，致动所选择的单元格以使选定的单元的表面变形以形成印刷图案，并且冷却细胞将印刷图案固化成印版。

7. 发明授权

US07344906B2 Structure and method for releasing stressy metal films 有权
标题翻译：用于释放应力金属膜的结构和方法
公开(公告)号：US07344906B2
公开(公告)日：2008-03-18
申请号：US11300872
申请日：2005-12-15
申请人： Christopher L. Chua , David K. Fork , Koenraed F. Van Schuylenbergh
发明人： Christopher L. Chua , David K. Fork , Koenraed F. Van Schuylenbergh
IPC分类号： H01L21/00
CPC分类号： B81C1/0015 , Y10T428/24942
摘要： A method and structure for forming a spring structure that avoids undesirable kinks in the spring is described. The method converts a portion of a release layer such that the converted portion resists etching. The converted portion then serves as an anchor region for a spring structure deposited over the release layer. When the non-converted portions of the release layer are etched, the spring curls out of the plane of a plane.
摘要翻译：描述了形成弹簧结构的方法和结构，其避免了弹簧中不希望的扭结。该方法将释放层的一部分转换成转换部分抵抗蚀刻。转换的部分然后用作沉积在释放层上的弹簧结构的锚定区域。当剥离层的未转化部分被蚀刻时，弹簧卷曲在平面的平面之外。

8. 发明授权

US06439898B2 Method and apparatus for interconnecting devices using an adhesive 有权
标题翻译：使用粘合剂互连装置的方法和装置
公开(公告)号：US06439898B2
公开(公告)日：2002-08-27
申请号：US09794101
申请日：2001-02-28
申请人： Christopher L. Chua , David K. Fork , Patrick G. Kim , Linda Romano
发明人： Christopher L. Chua , David K. Fork , Patrick G. Kim , Linda Romano
IPC分类号： H05K100
CPC分类号： H05K3/325 , H01L21/563 , H01L24/10 , H01L24/13 , H01L24/72 , H01L2224/13 , H01L2224/13099 , H01L2224/73203 , H01L2924/01004 , H01L2924/01013 , H01L2924/01018 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01R4/04 , H01R12/52 , H01L2924/00
摘要： A method and apparatus for interconnecting at least two devices. Each of the interconnected devices includes a contact structure for electrically and/or physically interconnecting the devices. Preferably, the contact structure for at least one of the devices includes a spring contact. An adhesive, such as a UV-curable adhesive, is applied to at least a portion of one of the devices, and once the adhesive is applied, the devices are assembled, i.e., brought into sufficient proximity so that the contact structures interconnect the devices. The adhesive can be applied directly to contact structures of one of the devices and/or can be applied to other portions of the devices so that the adhesive flows around the contact structures during assembly. The adhesive is then cured to bond the devices together. Applying the adhesive before assembling the devices prevents interference with the interconnection between the contact structures, especially if the contact structures include spring contacts to be electrically connected with corresponding contact pads.
摘要翻译：一种用于互连至少两个装置的方法和装置。互连设备中的每一个包括用于电和/或物理互连设备的接触结构。优选地，用于至少一个装置的接触结构包括弹簧接触件。将诸如UV可固化粘合剂的粘合剂施加到装置中的一个的至少一部分，并且一旦施加了粘合剂，则将这些装置组装，即使其具有足够的接近性，使得接触结构将装置。粘合剂可以直接施加到装置中的一个的接触结构和/或可以施加到装置的其它部分，使得粘合剂在组装期间围绕接触结构流动。然后固化粘合剂以将装置粘合在一起。在组装设备之前应用粘合剂可以防止接触结构之间的互连干扰，特别是如果接触结构包括与相应接触垫电连接的弹簧触点。

9. 发明申请

US20080141884A1 PRINTING SYSTEM EMPLOYING DEFORMABLE POLYMER PRINTING PLATES 有权
标题翻译：打印系统采用可变聚合物印刷板
公开(公告)号：US20080141884A1
公开(公告)日：2008-06-19
申请号：US11613141
申请日：2006-12-19
申请人： Jurgen H. Daniel , Dirk De Bruyker , David K. Fork , Christopher L. Chua
发明人： Jurgen H. Daniel , Dirk De Bruyker , David K. Fork , Christopher L. Chua
IPC分类号： B41N1/12
CPC分类号： B41C1/00 , B41C1/1041 , B41C1/186 , B41N1/12 , B41N1/22 , B41N3/00 , B41N3/003 , B41N3/006
摘要： A printing plate has a substrate, an array of cells on the substrate, wherein each cell corresponds to an element of a print image, a deformable polymer material localized into the cells such that each cell is at least partially formed from the deformable polymer material, a reservoir corresponding to each cell to collect the deformable polymer material as needed when the deformable polymer material is one of either melted or softened, and a heater to cause the deformable polymer material to either melt or soften. A method of forming a printing plate provides an array of cells, first heats the array of cells such that the deformable polymer material does one of either melts or softens, actuates the cells in the array to assume a deformed state, cools the array of cells to solidify the cells in the deformed state, second heats the cells such that the deformable polymer material in selected ones of the cells does one of either soften or melt and return to a less deformed state to form a printing pattern, and cools the surface to solidify the deformable polymer material in the printing pattern. A method of forming a printing plate provides an array of cells, heats the array of cells such that the deformable polymer material softens, actuates selected ones of the cells to deform surfaces of the selected ones to form a printing pattern, and cools the array of cells to solidify the printing pattern into a printing plate.
摘要翻译：印版具有衬底，衬底上的单元阵列，其中每个单元对应于印刷图像的元素，位于单元中的可变形聚合物材料，使得每个单元至少部分地由可变形聚合物材料形成，当可变形聚合物材料是熔化或软化之一时，根据需要收集可变形聚合物材料的储存器，以及使可变形聚合物材料熔融或软化的加热器。形成印版的方法提供了一个单元阵列，首先加热单元阵列，使得可变形的聚合物材料进行融化或软化之一，致动阵列中的单元以呈现变形状态，冷却单元阵列使细胞在变形状态下固化，第二加热细胞，使得选定细胞中的可变形聚合物材料进行软化或熔化，并恢复到较小的变形状态以形成印刷图案，并将表面冷却至使印刷图案中的可变形聚合物材料固化。形成印版的方法提供了一个单元阵列，加热单元阵列使得可变形的聚合物材料软化，致动所选择的单元格以使选定的单元的表面变形以形成印刷图案，并且冷却细胞将印刷图案固化成印版。

10. 发明授权

US07293996B2 Transmission-line spring structure 失效
标题翻译：传动线弹簧结构
公开(公告)号：US07293996B2
公开(公告)日：2007-11-13
申请号：US11463283
申请日：2006-08-08
申请人： Koenraad F. Van Schuylenbergh , Christopher L. Chua , David K. Fork
发明人： Koenraad F. Van Schuylenbergh , Christopher L. Chua , David K. Fork
IPC分类号： H01R12/00
CPC分类号： H01L24/72 , G01R1/06716 , G01R1/06727 , G01R1/06761 , G01R1/06772 , H01L2924/01005 , H01L2924/01006 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/14 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01P3/081 , H01P3/085 , H01R12/718 , H01R13/24 , H01R13/6461 , H01R13/6477 , H05K1/0218 , H05K3/4092
摘要： A curved transmission-line spring structure formed by self-bending materials (e.g., stress-engineered materials, intermetallic compounds and/or bimorphs) that are layered to form a stripline or microstrip transmission line. A dielectric layer is sandwiched between two conductive layers, which form the signal and ground lines of the structure. The various layers are etched to form an elongated spring structure, and then one end of the spring structure is released from the underlying substrate, causing the tip of the released end to bend away from the substrate for contact with a second device. One or both of the conductive layers is fabricated using self-bending spring metals to facilitate the bending process, and plated metal is utilized for conductivity. Alternatively, or in addition, the dielectric layer is formed using a stress-engineered dielectric material. Two-tip and three-tip structures are used to facilitate connection of both the ground and signal lines.
摘要翻译：通过层叠以形成带状线或微带传输线的自弯曲材料（例如，应力工程材料，金属间化合物和/或双压电晶片）形成的弯曲传输线弹簧结构。介电层夹在两个导电层之间，形成结构的信号和接地线。蚀刻各种层以形成细长的弹簧结构，然后弹簧结构的一端从下面的基底释放，使得释放端的尖端远离基板弯曲以与第二装置接触。使用自弯曲弹簧金属制造一个或两个导电层以促进弯曲过程，并且将电镀金属用于导电性。或者或另外，使用应力工程介电材料形成电介质层。两端和三端结构用于促进接地和信号线的连接。

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