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1. 发明授权

US06262390B1 Repair process for aluminum nitride substrates 失效
标题翻译：氮化铝基板的修复工艺
公开(公告)号：US06262390B1
公开(公告)日：2001-07-17
申请号：US09211595
申请日：1998-12-14
申请人： David B. Goland , Mark J. LaPlante , David C. Long , Dale C. McHerron , Krishna G. Sachdev , Subhash L. Shinde
发明人： David B. Goland , Mark J. LaPlante , David C. Long , Dale C. McHerron , Krishna G. Sachdev , Subhash L. Shinde
IPC分类号： B23K2600
CPC分类号： C04B41/009 , B23K26/1224 , C04B41/488 , C04B2111/00844 , C04B41/0036 , C04B41/53 , C04B35/581
摘要： A method to repair Aluminum Nitride (AlN) substrates is disclosed wherein a frequency doubled Q-switched Nd:YAG laser is used to remove unwanted metallurgy. The substrate is place in a liquid filled work chamber which acts to prevent metallic species of AlN from forming. The repair site can be sealed with a novel polymer coating to prevent contamination or corrosion. Repairs can be made to buried or surface metallurgy.
摘要翻译：公开了一种修复氮化铝（AlN）衬底的方法，其中使用频率倍增的Q开关Nd：YAG激光器来去除不想要的冶金。衬底位于液体填充的工作室中，其用于防止AlN的金属物质的形成。修复部位可以用新颖的聚合物涂层密封，以防止污染或腐蚀。维修可以进行埋地或表面冶金。

2. 发明授权

US06352014B1 Method for making punches using multi-layer ceramic technology 失效
标题翻译：使用多层陶瓷技术制作冲孔的方法
公开(公告)号：US06352014B1
公开(公告)日：2002-03-05
申请号：US09464510
申请日：1999-12-15
申请人： David B. Goland , David C. Long , John U. Knickerbocker , Subhash L. Shinde
发明人： David B. Goland , David C. Long , John U. Knickerbocker , Subhash L. Shinde
IPC分类号： B26F114
CPC分类号： B26F1/14 , B23P15/24 , B26F2210/08 , H05K1/0306 , H05K3/005 , Y10T83/9423
摘要： A method for making small punches by employing multi-layer ceramic (MLC) technology includes the steps of preparing a sublaminate matrix of a high or low sintering temperature material, drilling holes in the sublaminate using a mask as a guide, filling the holes with punch material paste by a solupor process, laminating the sublaminate to a base plate or as a freestanding substrate, firing a laminate at an appropriate sintering temperature and removing the matrix material by a chemical or mechanical method. In accordance with the present invention, a large number of small punches are made in parallel to precise dimensions of two to ten mils in diameter and approximately 100 mils in length. This method allows that a punch plate array can also be used to simultaneously punch an array of vias in a greensheet and eliminates the additional step of loading individual punches into a punch plate, offering cost and time savings.
摘要翻译：通过采用多层陶瓷（MLC）技术制造小冲孔的方法包括以下步骤：制备高或低烧结温度材料的层压基质，使用掩模作为导向孔在该层压板上钻孔，用冲孔通过溶剂法处理材料糊料，将层压材料层压到基板或独立的基材上，在适当的烧结温度下焙烧层压材料，并通过化学或机械方法除去基体材料。根据本发明，大量的小冲头与直径为2至10密耳，长度为大约100密耳的精确尺寸并联制成。该方法允许冲压板阵列也可以用于同时冲切毛坯中的通孔阵列，并且消除了将单个冲头加载到冲压板中的额外步骤，从而节约了成本和时间。

3. 发明授权

US5635000A Method for screening using electrostatic adhesion 失效
标题翻译：使用静电粘附进行筛选的方法
公开(公告)号：US5635000A
公开(公告)日：1997-06-03
申请号：US577180
申请日：1995-12-22
申请人： Jon A. Casey , Cynthia J. Calli , Darren T. Cook , David B. Goland , John U. Knickerbocker , Mark J. LaPlante , David C. Long , Daniel S. Mackin , Kathleen M. McGuire , Keith C. O'Neil , Kevin M. Prettyman , Michael T. Puchalski , Joseph C. Saltarelli , Candace A. Sullivan
发明人： Jon A. Casey , Cynthia J. Calli , Darren T. Cook , David B. Goland , John U. Knickerbocker , Mark J. LaPlante , David C. Long , Daniel S. Mackin , Kathleen M. McGuire , Keith C. O'Neil , Kevin M. Prettyman , Michael T. Puchalski , Joseph C. Saltarelli , Candace A. Sullivan
IPC分类号： H01L21/48 , H01L21/683 , H05K1/03 , H05K3/40 , B32B31/04 , B32B31/28
CPC分类号： H05K3/4061 , H01L21/4867 , H01L21/6833 , H05K1/0306 , H05K2203/105 , Y10T156/1056 , Y10T156/1158 , Y10T29/49126 , Y10T29/49128 , Y10T29/49139 , Y10T428/239 , Y10T428/31 , Y10T428/31786
摘要： The present invention relates generally to a new apparatus and method for screening using electrostatic adhesion. More particularly, the invention encompasses an apparatus that uses an electrostatic charge during the screening process for a semiconductor substrate. Basically, a backing layer is adhered to a green ceramic sheet using an electrostatic charge, while the green ceramic sheet is processed.
摘要翻译：本发明一般涉及使用静电粘附进行筛选的新装置和方法。更具体地，本发明包括在半导体衬底的筛选过程中使用静电电荷的装置。基本上，使用静电荷将背衬层附着在生坯陶瓷片上，同时处理生坯陶瓷片。

4. 发明授权

US5552232A Aluminum nitride body having graded metallurgy 失效
公开(公告)号：US5552232A
公开(公告)日：1996-09-03
申请号：US361351
申请日：1994-12-21
申请人： Jon A. Casey , Carla N. Cordero , Benjamin V. Fasano , David B. Goland , Robert Hannon , Jonathan H. Harris , Lester W. Herron , Gregory M. Johnson , Niranjan M. Patel , Andrew M. Reitter , Subhash L. Shinde , Rao V. Vallabhaneni , Robert A. Youngman
发明人： Jon A. Casey , Carla N. Cordero , Benjamin V. Fasano , David B. Goland , Robert Hannon , Jonathan H. Harris , Lester W. Herron , Gregory M. Johnson , Niranjan M. Patel , Andrew M. Reitter , Subhash L. Shinde , Rao V. Vallabhaneni , Robert A. Youngman
IPC分类号： B32B18/00 , B22F7/02 , C04B35/581 , C04B37/02 , C04B41/51 , C04B41/52 , C04B41/88 , C04B41/89 , C22C29/16 , H01L21/48 , H01L23/373 , H05K1/03 , H05K3/24 , H05K3/40 , H05K3/46 , B22F3/00
CPC分类号： C04B41/009 , B22F7/02 , C04B41/5133 , C04B41/52 , C04B41/88 , C04B41/89 , C22C29/16 , H01L21/4846 , H01L21/486 , H01L23/3731 , H05K3/4061 , B22F2998/00 , C04B2111/00405 , C04B2111/00844 , H01L2924/0002 , H05K1/0306 , H05K2201/035 , H05K2201/09981 , H05K3/248 , H05K3/4611 , H05K3/4629 , Y10S428/901 , Y10T428/12021 , Y10T428/12028 , Y10T428/12056 , Y10T428/31678
摘要： Disclosed is an aluminum nitride body having graded metallurgy and a method for making such a body. The aluminum nitride body has at least one via and includes a first layer in direct contact with the aluminum nitride body and a second layer in direct contact with, and that completely encapsulates, the first layer. The first layer includes 30 to 60 volume percent aluminum nitride and 40 to 70 volume percent tungsten and/or molybdenum while the second layer includes 90 to 100 volume percent of tungsten and/or molybdenum and 0 to 10 volume percent of aluminum nitride.

5. 发明授权

US06652956B2 X-ray printing personalization technique 失效
公开(公告)号：US06652956B2
公开(公告)日：2003-11-25
申请号：US09910763
申请日：2001-07-24
申请人： Lawrence A. Clevenger , David B. Goland , Louis L. Hsu , Joseph F. Shepard, Jr. , Subhash L. Shinde
发明人： Lawrence A. Clevenger , David B. Goland , Louis L. Hsu , Joseph F. Shepard, Jr. , Subhash L. Shinde
IPC分类号： B32B300
CPC分类号： H05K3/02 , B32B2310/085 , B32B2311/04 , B32B2311/12 , B32B2311/22 , C04B2237/40 , C04B2237/403 , C04B2237/405 , G03F7/2039 , H05K1/0306 , H05K1/092 , H05K3/207 , H05K2203/0514 , Y10S430/168 , Y10T428/24926
摘要： A method and structure to form a conductive pattern on a ceramic sheet deposits a photosensitive conductive material on a carrier and exposes a pattern of x-ray energy on the material and sinters the carrier and the material to the ceramic sheet so that only the conductive pattern of the material remains on the ceramic sheet. The structure has a conductive patterned material which includes a photosensitive agent.

6. 发明授权

US06002951A Multi-layer ceramic substrate having high TC superconductor circuitry 失效
标题翻译：具有高TC超导体电路的多层陶瓷基板
公开(公告)号：US06002951A
公开(公告)日：1999-12-14
申请号：US968191
申请日：1997-11-12
申请人： David B. Goland , Richard A. Shelleman , Subhash L. Shinde , Lisa M. Studzinski , Rao V. Vallabhaneni
发明人： David B. Goland , Richard A. Shelleman , Subhash L. Shinde , Lisa M. Studzinski , Rao V. Vallabhaneni
IPC分类号： H01L21/48 , H01L23/498 , H01L23/538 , H01L39/00
CPC分类号： H01L21/4857 , H01L23/49888 , H01L23/5383 , H01L23/5384 , H01L2924/0002 , H01L2924/09701 , Y10S428/93
摘要： A multilayer ceramic substrate electronic component is provided having high temperature superconductor material circuitry. The high temperature superconductor material is preferably yttrium-barium-copper-oxide and is encased within a noble metal such as silver or gold when forming the surface circuitry or filling of the vias. The noble metal layers preferably have through-openings to enable direct connection of circuitry to the encased superconductor layer. A method is also provided for fabricating such multilayer ceramic substrate electronic components.
摘要翻译：提供具有高温超导体材料电路的多层陶瓷基板电子部件。高温超导体材料优选为钇钡钡氧化物，并且当形成表面电路或填充通孔时被包裹在贵金属如银或金中。贵金属层优选具有通孔以使得电路能够直接连接到被封装的超导体层。还提供了一种用于制造这种多层陶瓷衬底电子部件的方法。

7. 发明授权

US06306528B1 Method for the controlling of certain second phases in aluminum nitride 失效
标题翻译：用于控制氮化铝中某些第二相的方法
公开(公告)号：US06306528B1
公开(公告)日：2001-10-23
申请号：US09311812
申请日：1999-05-13
申请人： Richard A. Bates , Carla N. Cordero , Benjamin V. Fasano , David B. Goland , Robert Hannon , Lester W. Herron , Gregory M. Johnson , Andrew Reitter , Subhash L. Shinde , Lisa Studzinski
发明人： Richard A. Bates , Carla N. Cordero , Benjamin V. Fasano , David B. Goland , Robert Hannon , Lester W. Herron , Gregory M. Johnson , Andrew Reitter , Subhash L. Shinde , Lisa Studzinski
IPC分类号： B32B1800
CPC分类号： C04B41/009 , C04B41/5133 , C04B41/88 , C04B2111/00844 , H01L23/15 , H01L2924/0002 , H05K1/0306 , H05K1/092 , Y10T428/265 , C04B41/4539 , C04B41/4556 , C04B41/4578 , C04B41/5032 , C04B41/526 , C04B35/581 , H01L2924/00
摘要： Electronic packages made with a high area percent coverage of blanket metal may be prone to certain kinds of ceramic defects. In aluminum nitride, these defects may be related to decomposition of the liquid sintering aid. In this experiment, unique additions to the metallization prevented the formation of certain ceramic defects. Our approach involves a unique composition used in an existing process.
摘要翻译：用橡皮布金属覆盖面积百分比高的电子封装可能容易产生某些种类的陶瓷缺陷。在氮化铝中，这些缺陷可能与液体烧结助剂的分解有关。在该实验中，金属化的独特添加防止了某些陶瓷缺陷的形成。我们的方法涉及在现有过程中使用的独特组合。

8. 发明授权

US06200373B1 Method for controlling of certain second phases in aluminum nitride 失效
标题翻译：用于控制氮化铝中某些第二相的方法
公开(公告)号：US06200373B1
公开(公告)日：2001-03-13
申请号：US09311811
申请日：1999-05-13
申请人： Richard A. Bates , Carla N. Cordero , Benjamin V. Fasano , David B. Goland , Robert Hannon , Lester W. Herron , Gregory M. Johnson , Andrew Reitter , Subhash L. Shinde , Lisa Studzinski
发明人： Richard A. Bates , Carla N. Cordero , Benjamin V. Fasano , David B. Goland , Robert Hannon , Lester W. Herron , Gregory M. Johnson , Andrew Reitter , Subhash L. Shinde , Lisa Studzinski
IPC分类号： B32B1700
CPC分类号： C04B41/009 , C04B41/5133 , C04B41/88 , C04B2111/00844 , H01L23/15 , H01L2924/0002 , H05K1/0306 , H05K1/092 , Y10T428/265 , C04B41/4539 , C04B41/4556 , C04B41/4578 , C04B41/5032 , C04B41/526 , C04B35/581 , H01L2924/00
摘要： Electronic packages made with a high area percent coverage of blanket metal may be prone to certain kinds of ceramic defects. In aluminum nitride, these defects may be related to decomposition of the liquid sintering aid. In this experiment, unique additions to the metallization prevented the formation of certain ceramic defects. Our approach involves a unique composition used in an existing process.
摘要翻译：用橡皮布金属覆盖面积百分比高的电子封装可能容易产生某些种类的陶瓷缺陷。在氮化铝中，这些缺陷可能与液体烧结助剂的分解有关。在该实验中，金属化的独特添加防止了某些陶瓷缺陷的形成。我们的方法涉及在现有过程中使用的独特组合。

9. 发明授权

US06638681B2 X-ray printing personalization technique 失效
标题翻译： X射线印刷个性化技术
公开(公告)号：US06638681B2
公开(公告)日：2003-10-28
申请号：US10281677
申请日：2002-10-28
申请人： Lawrence A. Clevenger , David B. Goland , Louis L. Hsu , Joseph F. Shepard, Jr. , Subhash L. Shinde
发明人： Lawrence A. Clevenger , David B. Goland , Louis L. Hsu , Joseph F. Shepard, Jr. , Subhash L. Shinde
IPC分类号： G03F700
CPC分类号： H05K3/02 , B32B2310/085 , B32B2311/04 , B32B2311/12 , B32B2311/22 , C04B2237/40 , C04B2237/403 , C04B2237/405 , G03F7/2039 , H05K1/0306 , H05K1/092 , H05K3/207 , H05K2203/0514 , Y10S430/168 , Y10T428/24926
摘要： A method and structure to form a conductive pattern on a ceramic sheet deposits a photosensitive conductive material on a carrier and exposes a pattern of x-ray energy on the material and sinters the carrier and the material to the ceramic sheet so that only the conductive pattern of the material remains on the ceramic sheet. The structure has a conductive patterned material which includes a photosensitive agent.
摘要翻译：在陶瓷片上形成导电图案的方法和结构将感光导电材料沉积在载体上并在材料上暴露出x射线能量的图案，并将载体和材料烧结到陶瓷片上，使得只有导电图案的材料残留在陶瓷片上。该结构具有包括感光剂的导电图案化材料。

10. 发明授权

US06373133B1 Multi-chip module and heat-sink cap combination 失效
标题翻译：多芯片模块和散热帽组合
公开(公告)号：US06373133B1
公开(公告)日：2002-04-16
申请号：US09353467
申请日：1999-07-13
申请人： Giulio DiGiacomo , Stephen S. Drofitz, Jr. , David L. Edwards , Larry D. Gross , Sushumna Iruvanti , Raed A. Sherif , Subhash L. Shinde , David J. Womac , David B. Goland , Lester W. Herron
发明人： Giulio DiGiacomo , Stephen S. Drofitz, Jr. , David L. Edwards , Larry D. Gross , Sushumna Iruvanti , Raed A. Sherif , Subhash L. Shinde , David J. Womac , David B. Goland , Lester W. Herron
IPC分类号： H01L2334
CPC分类号： H01L23/433 , H01L24/83 , H01L25/0655 , H01L2224/16225 , H01L2224/29111 , H01L2224/32245 , H01L2224/73253 , H01L2224/83193 , H01L2224/83801 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/157 , H01L2924/15724 , H01L2924/15788 , H01L2924/16152 , H01L2924/16251 , H01L2924/01014
摘要： A multi-chip module and heat-sink cap assembly and method of fabrication, which provides sufficient cooling for higher power density chips. The heat-sink cap has heat-sink columns disposed over each chip on a substrate. The heat-sink columns are interconnected by flexible members to provide a unitary cover. Thin film metallization of at least a portion of the mating surfaces of the substrate, chips and heat-sink column permits soldering of the cap to the chips and substrate to form the package which is a mechanically stable structure with no degradation of interconnection fatigue life due to thermal cycling of the assembly when in use.
摘要翻译：一种多芯片模块和散热帽组件及其制造方法，为更高功率密度的芯片提供足够的冷却。散热器盖具有设置在基板上的每个芯片上的散热柱。散热柱通过柔性构件相互连接，以提供整体盖。衬底，芯片和散热柱的配合表面的至少一部分的薄膜金属化允许将帽焊接到芯片和衬底以形成封装，其是机械稳定的结构，而不会降低互连疲劳寿命在使用时对组件进行热循环。

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