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1. 发明授权

US5981310A Multi-chip heat-sink cap assembly 失效
标题翻译：多芯片散热帽组件
公开(公告)号：US5981310A
公开(公告)日：1999-11-09
申请号：US12071
申请日：1998-01-22
申请人： Giulio DiGiacomo , Stephen S. Drofitz, Jr. , David L. Edwards , Larry D. Gross , Sushumna Iruvanti , Raed A. Sherif , Subhash L. Shinde , David J. Womac , David B. Goland , Lester W. Herron
发明人： Giulio DiGiacomo , Stephen S. Drofitz, Jr. , David L. Edwards , Larry D. Gross , Sushumna Iruvanti , Raed A. Sherif , Subhash L. Shinde , David J. Womac , David B. Goland , Lester W. Herron
IPC分类号： H01L23/433 , H01L25/065 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L23/433 , H01L24/83 , H01L25/0655 , H01L2224/16225 , H01L2224/29111 , H01L2224/32245 , H01L2224/73253 , H01L2224/83193 , H01L2224/83801 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/157 , H01L2924/15724 , H01L2924/15788 , H01L2924/16152 , H01L2924/16251
摘要： A multi-chip module and heat-sink cap assembly and method of fabrication, which provides sufficient cooling for higher power density chips. The heat-sink cap has heat-sink columns disposed over each chip on a substrate. The heat-sink columns are interconnected by flexible members to provide a unitary cover. Thin film metallization of at least a portion of the mating surfaces of the substrate, chips and heat-sink column permits soldering of the cap to the chips and substrate to form the package which is a mechanically stable structure with no degradation of interconnection fatigue life due to thermal cycling of the assembly when in use.
摘要翻译：一种多芯片模块和散热帽组件及其制造方法，为更高功率密度的芯片提供足够的冷却。散热器盖具有设置在基板上的每个芯片上的散热柱。散热柱通过柔性构件相互连接，以提供整体盖。衬底，芯片和散热柱的配合表面的至少一部分的薄膜金属化允许将帽焊接到芯片和衬底以形成封装，其是机械稳定的结构，而不会降低互连疲劳寿命在使用时对组件进行热循环。

2. 发明授权

US06373133B1 Multi-chip module and heat-sink cap combination 失效
标题翻译：多芯片模块和散热帽组合
公开(公告)号：US06373133B1
公开(公告)日：2002-04-16
申请号：US09353467
申请日：1999-07-13
申请人： Giulio DiGiacomo , Stephen S. Drofitz, Jr. , David L. Edwards , Larry D. Gross , Sushumna Iruvanti , Raed A. Sherif , Subhash L. Shinde , David J. Womac , David B. Goland , Lester W. Herron
发明人： Giulio DiGiacomo , Stephen S. Drofitz, Jr. , David L. Edwards , Larry D. Gross , Sushumna Iruvanti , Raed A. Sherif , Subhash L. Shinde , David J. Womac , David B. Goland , Lester W. Herron
IPC分类号： H01L2334
CPC分类号： H01L23/433 , H01L24/83 , H01L25/0655 , H01L2224/16225 , H01L2224/29111 , H01L2224/32245 , H01L2224/73253 , H01L2224/83193 , H01L2224/83801 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/157 , H01L2924/15724 , H01L2924/15788 , H01L2924/16152 , H01L2924/16251 , H01L2924/01014
摘要： A multi-chip module and heat-sink cap assembly and method of fabrication, which provides sufficient cooling for higher power density chips. The heat-sink cap has heat-sink columns disposed over each chip on a substrate. The heat-sink columns are interconnected by flexible members to provide a unitary cover. Thin film metallization of at least a portion of the mating surfaces of the substrate, chips and heat-sink column permits soldering of the cap to the chips and substrate to form the package which is a mechanically stable structure with no degradation of interconnection fatigue life due to thermal cycling of the assembly when in use.
摘要翻译：一种多芯片模块和散热帽组件及其制造方法，为更高功率密度的芯片提供足够的冷却。散热器盖具有设置在基板上的每个芯片上的散热柱。散热柱通过柔性构件相互连接，以提供整体盖。衬底，芯片和散热柱的配合表面的至少一部分的薄膜金属化允许将帽焊接到芯片和衬底以形成封装，其是机械稳定的结构，而不会降低互连疲劳寿命在使用时对组件进行热循环。

3. 发明授权

US06214647B1 Method for bonding heatsink to multiple-height chip 失效
标题翻译：将散热片连接到多芯片芯片的方法
公开(公告)号：US06214647B1
公开(公告)日：2001-04-10
申请号：US09159239
申请日：1998-09-23
申请人： Giulio Di Giacomo , Stephen S. Drofitz, Jr. , David L. Edwards , Sushumna Iruvanti , David J. Womac
发明人： Giulio Di Giacomo , Stephen S. Drofitz, Jr. , David L. Edwards , Sushumna Iruvanti , David J. Womac
IPC分类号： H01L2144
CPC分类号： H01L23/4338 , H01L2224/16 , H01L2224/73253 , H01L2924/09701
摘要： A method and structure for thermally connecting a thermal conductor to at least one chip, the thermal conductor including a lower surface and at least one piston extending from the lower surface corresponding to each of the chips, each of the chips having an upper surface opposing each of the pistons, the chips being mounted on a substrate, the method comprising steps of metalizing the lower surface of the thermal conductor and the pistons, applying a solder to the lower surface of the thermal conductor, applying a thermal paste between the upper surface of the chips and the pistons, positioning the substrate and the thermal conductor such that the substrate is aligned with the thermal conductor, biasing the thermal conductor toward the substrate, biasing the pistons toward the chips such that the thermal paste has a consistent thickness between each of the chips and the pistons, reflowing the solder, such that the solder bonds the substrate to the thermal conductor and the pistons form a metallurgical bond with the thermal conductor, wherein after the reflowing step, the pistons and the thermal conductor form a unitary structure for maintaining the consistent thickness of the thermal paste between each of the chips and the pistons which achieves a considerably thinner thermal paste layer and greater thermal conduction.
摘要翻译：一种用于将热导体热连接到至少一个芯片的方法和结构，所述热导体包括下表面和从与每个芯片对应的下表面延伸的至少一个活塞，每个芯片具有与每个芯片相对的上表面的活塞，所述芯片安装在基板上，所述方法包括以下步骤：使所述导热体和所述活塞的下表面金属化，向所述导热体的下表面施加焊料，在所述导热体的上表面芯片和活塞，定位衬底和热导体，使得衬底与热导体对准，将热导体偏压朝向衬底，将活塞偏压到芯片，使得热膏在每个之间具有一致的厚度芯片和活塞，回流焊料，使得焊料将基板粘合到热导体和活塞上与热导体进行冶金结合，其中在回流步骤之后，活塞和热导体形成整体结构，用于保持每个芯片和活塞之间的热粘合剂的厚度一致，其实现相当薄的热糊层，并且更大的热传导。

4. 发明授权

US6085831A Direct chip-cooling through liquid vaporization heat exchange 失效
标题翻译：通过液体蒸发热交换直接芯片冷却
公开(公告)号：US6085831A
公开(公告)日：2000-07-11
申请号：US261345
申请日：1999-03-03
申请人： Giulio DiGiacomo , Sushumna Iruvanti , David J. Womac
发明人： Giulio DiGiacomo , Sushumna Iruvanti , David J. Womac
IPC分类号： F28D15/02 , F28D15/04 , H01L23/427 , F28D15/00
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/046 , H01L2924/0002
摘要： An apparatus for and method of cooling an electronic module comprising a heat sink enclosure placed directly over a chip or substrate in a flip chip package. The heat sink enclosure has a plurality of cooling fins extending from within the cavity of the enclosure. A liquid sealed inside the enclosure is trapped within a thermal transfer means, preferably a metal wick, which sits directly on a chip or substrate. As the chip or substrate heats up, heat is transferred to the thermal transfer means which in turn heats the liquid to its heat of vaporization. The vapors of the liquid rise and condense on the cooling fins and the heat is absorbed by the enclosure and conducted to an outside surface of the enclosure and dissipated. Cooling fins on an exterior surface of the enclosure further reduces the thermal resistance to enhance cooling.
摘要翻译：一种用于冷却电子模块的装置和方法，包括在倒装芯片封装中直接放置在芯片或衬底上的散热器外壳。散热器外壳具有从外壳的空腔内延伸的多个散热片。密封在外壳内部的液体被捕获在热传递装置内，优选地直接位于芯片或基底上的金属芯。当芯片或基板加热时，热量传递到热传递装置，热传递装置又将液体加热至其蒸发热。液体上升和冷凝在冷却片和热上的蒸汽被外壳吸收并传导到外壳的外表面并消散。外壳外表面上的散热片进一步降低了热阻，增强了冷却。

5. 发明授权

US06333460B1 Structural support for direct lid attach 失效
标题翻译：结构支持直接盖附件
公开(公告)号：US06333460B1
公开(公告)日：2001-12-25
申请号：US09549911
申请日：2000-04-14
申请人： Hilton T. Toy , Raed A. sherif , David J. Womac
发明人： Hilton T. Toy , Raed A. sherif , David J. Womac
IPC分类号： H01L2302
CPC分类号： H01L23/10 , H01L21/50 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/01019 , H01L2924/09701 , H01L2924/16152 , H01L2924/16315 , H01L2924/3511 , H01L2924/00
摘要： An electronic chip assembly having the following components: a substrate having electrical conductors therein; an electronic circuit chip affixed face down to the substrate so as to make electrical connection to the conductors; a male framing member, compliantly adhered to the substrate; a lid having a female channel, the channel having sidewalls, the channel being disposed on or within said lid for receiving said male framing member; and sealant material disposed within the channel between the sidewalls of said channel and the female lid sealing member.
摘要翻译：一种具有以下部件的电子芯片组件：具有电导体的基板;电子电路芯片，其朝下固定到基板，以便与导体电连接;阳型框架构件，柔性地粘合到基板上;盖子，其具有阴通道，通道具有侧壁，通道设置在所述盖中或内部，用于接收所述阳框架构件; 设置在所述通道的侧壁和阴盖密封构件之间的通道内的密封材料。

6. 发明申请

US20080233858A1 APPARATUS, SYSTEM, AND METHOD FOR VENTING A CHASSIS 有权
标题翻译：装置，系统和方法，用于展示底盘
公开(公告)号：US20080233858A1
公开(公告)日：2008-09-25
申请号：US12036029
申请日：2008-02-22
申请人： David J. Womac , Kimon Papakos , Scott A. Blakemore
发明人： David J. Womac , Kimon Papakos , Scott A. Blakemore
IPC分类号： H05K5/02
CPC分类号： H05K7/1425 , G06F1/20 , H05K5/0213 , H05K7/18
摘要： An apparatus, system, and method are provided for venting an enclosure, such as a chassis housing electronic equipment. The method includes receiving, at least one air directing surface, airflow moving in a first direction, the at least one air directing surface being disposed externally from the chassis at a predetermined placement relative to the at least one ventilation surface in a path of the airflow. The at least one air directing surface has a configuration to alter the direction of the airflow between the air directing surface and the at least one ventilation surface. The method also includes redirecting the airflow between the at least one air directing surface and the at least one ventilation surface to at least a second direction using the air directing surface. The predetermined placement and configuration of the at least one air directing surface determine the second direction in which the airflow is discharged, and the second direction is either towards or away from the at least one ventilation surface. Also in the receiving, the airflow is received at least one air directing surface of a bracket configured to attach the chassis to a mounting structure.
摘要翻译：提供了一种用于对外壳进行排气的装置，系统和方法，例如容纳电子设备的底盘。该方法包括：接收至少一个空气引导表面，沿第一方向移动的气流，所述至少一个空气引导表面在气流的路径中相对于至少一个通风表面以预定的位置布置在底盘的外部。所述至少一个空气引导表面具有改变空气引导表面和至少一个通风表面之间的气流的方向的构造。该方法还包括使用空气引导表面将至少一个空气引导表面和至少一个通气表面之间的气流重定向到至少第二方向。至少一个空气引导表面的预定放置和构造决定了气流被排出的第二方向，并且第二方向朝向或远离至少一个通风表面。此外，在接收中，气流被容纳至少一个配置成将底盘附接到安装结构的托架的空气引导表面。

7. 发明授权

US08944896B2 Apparatus, system, and method for venting a chassis 有权
标题翻译：用于排放底盘的装置，系统和方法
公开(公告)号：US08944896B2
公开(公告)日：2015-02-03
申请号：US12036029
申请日：2008-02-22
申请人： David J. Womac , Kimon Papakos , Scott A. Blakemore
发明人： David J. Womac , Kimon Papakos , Scott A. Blakemore
IPC分类号： H05K7/20 , H05K7/14 , H05K5/02 , G06F1/20 , H05K7/18
CPC分类号： H05K7/1425 , G06F1/20 , H05K5/0213 , H05K7/18
摘要： An apparatus, system, and method are provided for venting an enclosure, such as a chassis housing electronic equipment. The method includes receiving, at least one air directing surface, airflow moving in a first direction, the at least one air directing surface being disposed externally from the chassis at a predetermined placement relative to the at least one ventilation surface in a path of the airflow. The at least one air directing surface has a configuration to alter the direction of the airflow between the air directing surface and the at least one ventilation surface. The method also includes redirecting the airflow between the at least one air directing surface and the at least one ventilation surface to at least a second direction using the air directing surface. The predetermined placement and configuration of the at least one air directing surface determine the second direction in which the airflow is discharged, and the second direction is either towards or away from the at least one ventilation surface. Also in the receiving, the airflow is received at least one air directing surface of a bracket configured to attach the chassis to a mounting structure.
摘要翻译：提供了一种用于对外壳进行排气的装置，系统和方法，例如容纳电子设备的底盘。该方法包括：接收至少一个空气引导表面，沿第一方向移动的气流，所述至少一个空气引导表面在气流的路径中相对于至少一个通风表面以预定的位置布置在离开底盘的外部。所述至少一个空气引导表面具有改变空气引导表面和至少一个通风表面之间的气流的方向的构造。该方法还包括使用空气引导表面将至少一个空气引导表面和至少一个通气表面之间的气流重定向到至少第二方向。至少一个空气引导表面的预定放置和构造决定了气流被排出的第二方向，并且第二方向朝向或远离至少一个通风表面。此外，在接收中，气流被容纳至少一个配置成将底盘附接到安装结构的托架的空气引导表面。

8. 发明授权

US08328026B2 Apparatus and method for configuring a dual rack-mountable chassis 有权
标题翻译：用于配置双机架式机架的装置和方法
公开(公告)号：US08328026B2
公开(公告)日：2012-12-11
申请号：US12036041
申请日：2008-02-22
申请人： Mark E. Boduch , Kimon Papakos , Scott A. Blakemore , David J. Womac
发明人： Mark E. Boduch , Kimon Papakos , Scott A. Blakemore , David J. Womac
IPC分类号： A47F7/00
CPC分类号： H05K7/1425 , G06F1/20 , H05K5/0213 , H05K7/18
摘要： A chassis having a housing in which at least one card module can be arrange is provided. The chassis is arranged in a first rack horizontally or a second rack vertically wherein the second rack opening width is an integer multiple of the predetermined chassis width. A fan slot and ventilation openings are provided in the chassis to allow for airflow across the card modules. Mounting mechanisms facilitate coupling of the chassis to the first and second rack and include ventilation openings through which air passes.
摘要翻译：一种具有壳体的底盘，其中可设置至少一个卡模块。所述底盘在垂直方向上布置在第一机架中或第二机架中，其中所述第二机架开口宽度是所述预定机架宽度的整数倍。机箱中设有一个风扇插槽和通风口，以便通过卡模块的气流。安装机构便于机架与第一和第二机架的联接，并且包括空气通过的通风开口。

9. 发明授权

US06222263B1 Chip assembly with load-bearing lid in thermal contact with the chip 失效
标题翻译：带有承载盖的芯片组件与芯片热接触
公开(公告)号：US06222263B1
公开(公告)日：2001-04-24
申请号：US09420765
申请日：1999-10-19
申请人： Raed Sherif , Hilton T. Toy , David J. Womac
发明人： Raed Sherif , Hilton T. Toy , David J. Womac
IPC分类号： H01L2334
CPC分类号： H01L23/36 , H01L2224/73253 , H01L2924/01078 , H01L2924/09701
摘要： In a direct lid attach structure incorporating thermally conductive material between a lid and an electronic circuit chip, there are provided a number of apertures in the lid. These apertures are provided directly opposite disks or pads disposed on the substrate to which the chip is attached. A hardenable adhesive such as an epoxy is disposed through the apertures and hardened in place so as to provide a bond between the lid and the underlying pad which has been previously affixed to the substrate to which the chip is attached with a compliant adhesive. There is thus provided an electronic chip assembly which allows bonded chip-to-lid thermal interfaces to be used with LGA interconnection techniques. The support structure mitigates the mechanical loads associated with LGA socketing which could otherwise damage the substrate and affect the integrity of the bonded thermal interface.
摘要翻译：在盖和电子电路芯片之间结合有导热材料的直接盖附接结构中，在盖中设有多个孔。这些孔直接设置在与芯片附接到的基板上相对的盘或垫上。诸如环氧树脂的可硬化粘合剂通过孔设置并固化就位，以便在先前通过柔性粘合剂粘附到芯片附着的基底上的盖和下垫之间提供粘结。因此，提供了一种电子芯片组件，其允许粘合的芯片到盖子热接口与LGA互连技术一起使用。支撑结构减轻了与LGA浸入相关的机械载荷，否则可能损坏基板并影响粘结的热界面的完整性。

10. 发明申请

US20080217962A1 APPARATUS AND METHOD FOR CONFIGURING A DUAL RACK-MOUNTABLE CHASSIS 有权
标题翻译：用于配置双机架式机箱的装置和方法
公开(公告)号：US20080217962A1
公开(公告)日：2008-09-11
申请号：US12036041
申请日：2008-02-22
申请人： Mark E. Boduch , Kimon Papakos , Scott A. Blakemore , David J. Womac
发明人： Mark E. Boduch , Kimon Papakos , Scott A. Blakemore , David J. Womac
IPC分类号： B62D21/00
CPC分类号： H05K7/1425 , G06F1/20 , H05K5/0213 , H05K7/18
摘要： A method of configuring a rack-mountable chassis is provided. The method includes measuring a length and width of a card module slot of the chassis, a first opening width of a first rack for housing the chassis, and a second opening width of a second rack for housing the chassis, where the first opening width is greater than the second opening width. The method also includes verifying whether the first opening width is sufficiently wide to allow enough clearance between at least one side of the chassis and the first rack when the chassis is disposed in the first rack, to allow for the adequate cooling of housed components. If the first opening width is sufficiently wide, a dimension of at least one parameter related to the configuration of the chassis is determined so that the second opening width is a multiple of a total chassis width of the chassis. A chassis configured according to the method is provided.
摘要翻译：提供了一种配置机架式机架的方法。该方法包括测量底盘的卡模块槽的长度和宽度，用于容纳底架的第一机架的第一开口宽度和用于容纳底架的第二开口宽度，其中第一开口宽度为大于第二开口宽度。该方法还包括验证第一开口宽度是否足够宽，以便当底盘设置在第一机架中时，在底架的至少一侧和第一机架之间留出足够的间隙，以允许对容纳部件进行适当的冷却。如果第一开口宽度足够宽，则确定与底盘的配置相关的至少一个参数的尺寸，使得第二开口宽度是底盘的总底盘宽度的倍数。提供了根据该方法配置的底盘。

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