专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2005042135A Reducing agent solution, method of producing metal powder by using the same, and method of forming metal film 有权
标题翻译：还原剂溶液，使用该金属粉末的方法生产金属粉末及形成金属膜的方法
公开(公告)号：JP2005042135A
公开(公告)日：2005-02-17
申请号：JP2003200655
申请日：2003-07-23
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , Sumitomo Electric Ind Ltd , 住友電気工業株式会社 , 株式会社大和化成研究所
发明人： MASHIMA MASATOSHI , SHIMODA KOHEI , KOYAMA KEIJI , OKADA KAZUMASA , OBATA KEIGO , YOSHIMOTO MASAKAZU , NAKAO SEIICHIRO , NAMIKAWA KAZUTOSHI
IPC分类号： C02F1/461 , B22F9/24 , C23C18/16 , C23C18/31
摘要： PROBLEM TO BE SOLVED: To provide a reducing agent solution with which metal powder or a metal film capable of exhibiting the satisfactory characteristics of the metal itself to the full can be produced since it does not comprise any halogen, and in which the re-regulation of pH is not needed in the case it is regenerated by electrolytic treatment and is repeatedly used, and to provide methods of forming metal powder and a metallic film using the same.
SOLUTION: The reducing agent solution comprises the ions of transition metal for reducing the ions of metal in a reaction system so as to be precipitated and methansulfonate ions, and is substantially free from halogen. As for the method of producing metal powder, the ions of metal are reduced by the reducing action of the ions of transition metal in a reaction system of a liquid phase including the reducing agent solution so as to be precipitated. As for the method of forming a metal film, in a state where the object to be plated is dipped into a reaction system including the reducing agent solution, the ions of metal are reduced by the reducing action of the ions of transition metal so as to be precipitated over the surface of the object to be plated.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：待解决的问题：提供一种还原剂溶液，由于它不包含任何卤素，因此可以制备能够充分显示出金属本身的令人满意的特性的金属粉末或金属膜的还原剂溶液，其中在通过电解处理再生并重复使用时，不需要重新调节pH，并且提供使用其形成金属粉末和金属膜的方法。解决方案：还原剂溶液包含过渡金属的离子，用于还原反应体系中的金属离子以沉淀和甲磺酸根离子，并且基本上不含卤素。对于金属粉末的制造方法，通过在包含还原剂溶液的液相的反应体系中的过渡金属的离子的还原作用使金属的离子析出而析出。对于形成金属膜的方法，在将待镀物体浸入包括还原剂溶液的反应体系的状态下，通过过渡金属的离子的还原作用使金属的离子减少，从而沉淀在待镀物体的表面上。版权所有（C）2005，JPO＆NCIPI

2. 发明专利

JP2013044001A Tin and tin alloy plating bath, and electronic part with electrodeposited film formed with the bath 有权
标题翻译： TIN和TIN合金涂层浴和电子部件与电泳膜形成与浴
公开(公告)号：JP2013044001A
公开(公告)日：2013-03-04
申请号：JP2011180987
申请日：2011-08-22
申请人： Ishihara Chem Co Ltd , 石原薬品株式会社 , Daiwa Fine Chemicals Co Ltd (Laboratory) , 株式会社大和化成研究所
发明人： NISHIKAWA TETSUJI , YOSHIMOTO MASAKAZU
IPC分类号： C25D3/32
摘要： PROBLEM TO BE SOLVED: To improve the appearance of an electrodeposited film and the uniformity of electrodeposition in a wide range of current density region and stabilize the composition ratio of a tin alloy film in a tin or tin alloy plating bath.SOLUTION: The tin or tin alloy plating bath contains (A) a soluble salt composed of any of a tin salt and a mixture of a tin salt and a salt of a predetermined metal such as silver, copper, bismuth, and lead, (B) an acid or a salt thereof, and (C) a specific phenanthroline-dione compound. The film has excellent electrodeposition uniformity and good film appearance in a wide range of current density region because the phenanthroline-dione compound is contained. In the tin alloy plating, a uniform alloy composition can be obtained in a wide range of current density region.
摘要翻译：要解决的问题：为了改善电沉积膜的外观和在电流密度范围宽的电沉积的均匀性，并稳定锡或锡合金电镀浴中锡合金膜的组成比。锡或锡合金电镀液含有（A）由锡盐和锡盐与预定金属的盐（如银，铜，铋和铅）的盐的混合物组成的可溶性盐，（B）酸或其盐，和（C）特殊的菲咯啉二酮化合物。由于含有菲咯啉二酮化合物，该膜在电流密度范围宽的范围内具有优异的电沉积均匀性和良好的膜外观。在锡合金镀层中，可以在宽的电流密度范围内获得均匀的合金组成。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2013023693A Imidazole ring-bonded type oxyalkylene compound and plating bath containing the compound 有权
标题翻译：咪唑环键合型氧化亚烷基化合物和包含化合物的包衣浴
公开(公告)号：JP2013023693A
公开(公告)日：2013-02-04
申请号：JP2011155990
申请日：2011-07-14
申请人： Ishihara Chem Co Ltd , 石原薬品株式会社 , Daiwa Fine Chemicals Co Ltd (Laboratory) , 株式会社大和化成研究所
发明人： NISHIKAWA TETSUJI , SAKAEGAWA MASAHIRO , YOSHIMOTO MASAKAZU
IPC分类号： C25D3/30 , C08G65/333 , C23C18/31 , C23C18/48 , C25D3/12 , C25D3/22 , C25D3/34 , C25D3/38 , C25D3/46 , C25D3/48 , C25D3/50 , C25D3/56
摘要： PROBLEM TO BE SOLVED: To satisfy both of solubility in water and defoaming property and to make the management of plating solutions easy, in various kinds of plating baths.SOLUTION: A new imidazole ring-bonded type oxyalkylene compound includes an oxyalkylene chain selected from 2 to 4C alkylene, wherein an imidazole ring is bonded to the oxyalkylene chain through nitrogen atom at the third position and located at the terminal. When the oxyalkylene compound is used for various kinds of plating baths, foaming property is dominantly reduced while satisfactorily maintaining water solubility by introducing an imidazole ring group to the terminal in comparison with a conventional nonionic surfactant. When the oxyalkylene compound, in which an imidazole ring group exists in the molecule of a nonionic surfactant, is used for a copper plating bath for example, both of the action of the surfactant and leveling action are provided, and the plating solutions are easily managed.
摘要翻译：要解决的问题：为了满足在水中的溶解性和消泡性，并且能够在各种电镀浴中容易地进行电镀溶液的管理。解决方案：新的咪唑环键合氧化烯化合物包括选自2至4个亚烷基的氧化烯链，其中咪唑环通过位于末端的第三位的氮原子与氧化烯链结合。当将氧化烯化合物用于各种电镀浴时，与常规的非离子表面活性剂相比，通过将咪唑环引入末端，令人满意地保持水溶性，从而显着降低发泡性。当在非离子表面活性剂分子中存在咪唑环基的氧化烯化合物用于例如铜电镀浴时，提供表面活性剂的作用和流平作用，并且电镀溶液容易管理。版权所有（C）2013，JPO＆INPIT

4. 发明专利

JP2009191335A Plating solution and electronic parts 审中-公开
标题翻译：电镀解决方案和电子部件
公开(公告)号：JP2009191335A
公开(公告)日：2009-08-27
申请号：JP2008035092
申请日：2008-02-15
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , Ishihara Chem Co Ltd , 株式会社大和化成研究所 , 石原薬品株式会社
发明人： NISHIKAWA TETSUJI , SAKAEGAWA MASAHIRO , YOSHIMOTO MASAKAZU
IPC分类号： C25D3/02 , C23C18/31 , C25D3/32
摘要： PROBLEM TO BE SOLVED: To provide an electrolytic or electroless plating solution which has excellent temporal stability and a wide gloss range, shows uniform plating appearance, can effectively provide an intended coating film composition and contains no cyanide, and to provide electronic parts having a metal film which has been formed by using the same. SOLUTION: The plating solution includes a chemical compound shown by Formula (1) and one or more water-soluble salts of a metal selected from the group consisting of the Group VIII, IB, IIB, IIIA, IVA and VA in the fourth period to the sixth period. The water-soluble salt of the metal in the plating solution is that of tin, silver, gold, platinum, palladium or copper in particular. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有优异的时间稳定性和宽光泽范围的电解或化学镀溶液，显示出均匀的电镀外观，可以有效地提供预期的涂膜组合物并且不含氰化物，并且提供电子部件具有通过使用其形成的金属膜。解决方案：电镀液包含式（1）所示的化合物和一种或多种选自第VIII，IB，IIB，IIIA，IVA和VA族的金属的水溶性盐，其中第四期至第六期。镀液中金属的水溶性盐特别是锡，银，金，铂，钯或铜的金属盐。版权所有（C）2009，JPO＆INPIT

5. 发明专利

JP2009149965A Silver-plating method 有权
标题翻译：镀银方法
公开(公告)号：JP2009149965A
公开(公告)日：2009-07-09
申请号：JP2007341848
申请日：2007-12-19
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , 株式会社大和化成研究所
发明人： YOSHIMOTO MASAKAZU , KITAMURA SHINGO , OMORI SATOSHI , KADOKAWA SOJI
IPC分类号： C25D3/46 , C25D5/24
CPC分类号： C25D3/46 , C25D5/34
摘要： PROBLEM TO BE SOLVED: To provide a silver-plating method, which does not need to form an unnecessary layer of a nickel layer inbetween a substrate which is difficult to be plated and a silver-plated film, and can form the silver-plated film having sufficient adhesiveness directly on the substrate which is difficult to be plated with the use of a halide-free plating bath under a satisfactory working environment.
SOLUTION: The silver-plating method is used for forming the silver-plated film on the substrate on which an oxide film is easily formed and the oxide film hinders the adhesiveness of a plated film, and comprises at least the steps of: (A) degreasing the substrate; (B) removing the oxide film with a strongly acidic solution; and subsequently to the step (B), (C) plating the substrate with silver by using a phosphine-containing acidic silver-plating bath which essentially does not contain a halide ion and a cyanide ion while skipping a step of nickel strike plating or nickel-alloy strike plating.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种镀银方法，其不需要在难以镀覆的基板和镀银膜之间形成不需要的镍层的层，并且可以形成银在基板上直接具有足够的粘合性的薄膜，其难以在令人满意的工作环境下使用不含卤化物的电镀液进行电镀。解决方案：使用镀银方法在容易形成氧化膜的基板上形成镀银膜，并且氧化膜阻碍电镀膜的粘附性，并且至少包括以下步骤：（A）脱脂基材; （B）用强酸溶液除去氧化膜; 然后在步骤（B）中，（C）通过使用基本上不含有卤离子和氰离子的含磷酸性镀银浴，同时跳过镍触镀或镍的步骤合金打击电镀。版权所有（C）2009，JPO＆INPIT

6. 发明专利

JP2006265572A Tin-silver alloy plating bath of non-cyanide system 有权
标题翻译：不含氰化物系统的锡银合金镀层
公开(公告)号：JP2006265572A
公开(公告)日：2006-10-05
申请号：JP2005081043
申请日：2005-03-22
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , Ishihara Chem Co Ltd , 株式会社大和化成研究所 , 石原薬品株式会社
发明人： TANAKA SEICHU , YOSHIMOTO MASAKAZU
IPC分类号： C25D3/60
摘要： PROBLEM TO BE SOLVED: To improve solderability and appearance of an electrodeposition film obtainable from a tin-silver alloy plating bath of a non-cyanide system. SOLUTION: The tin-silver alloy electroplating bath contains (a) at least one aliphatic amino acids and nitrogenous aromatic carboxylic acids and (b) at least one aliphatic sulfides and aliphatic mercaptans. Glycines etc., are exemplified as the aliphatic amino acids of (a), picolic acid, 3-amino pyran-2-carboxylic acid, etc., as the nitrogenous aromatic carboxylic acids of (a), 4, 7-dithia decane-1, 10-diol, etc., as the aliphatic sulfides of (b), and thioglycol etc., as the aliphatic mercaptans. A sulfur compound of the component (b) is used as a stabilizer of the silver and further, the components (a), such as the glycines and picolic acids are used in combination, thereby satisfactorily improving the solder wettability and appearance of the tin-silver alloy film. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提高由非氰化物体系的锡 - 银合金电镀液得到的电沉积膜的可焊性和外观。解决方案：锡 - 银合金电镀浴含有（a）至少一种脂族氨基酸和含氮芳族羧酸，和（b）至少一种脂族硫化物和脂族硫醇。甘氨酸等作为（a）中的脂肪族氨基酸，苦味酸，3-氨基吡喃-2-羧酸等作为（a）的4-芳香族羧酸，作为（b）的脂族硫化物，和硫代乙二醇等作为脂肪族硫醇，可以使用1,10-二醇等。使用组分（b）的硫化合物作为银的稳定剂，并且组合使用诸如甘氨酸和苦味酸的组分（a），从而令人满意地改善焊料润湿性和锡 - 银合金膜。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2004137530A Compound alloy metal ball used as connector of electrical/ electronic circuit component and method for manufacturing the same 有权
标题翻译：用作电气/电子电路部件的连接器的化合物金属球及其制造方法
公开(公告)号：JP2004137530A
公开(公告)日：2004-05-13
申请号：JP2002301753
申请日：2002-10-16
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , Fukuda Metal Foil & Powder Co Ltd , 株式会社大和化成研究所 , 福田金属箔粉工業株式会社
发明人： IMAE SHINYA , NISHIDA MOTONORI , KAJITA OSAMU , YAKIDA YOSHINOBU , OKUHAMA YOSHIAKI , TAKEUCHI TAKAO , OBATA KEIGO , YOSHIMOTO MASAKAZU
IPC分类号： C25D3/56 , C22C5/06 , C22C9/00 , C25D3/64 , C25D5/10 , C25D7/00 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To comparatively inexpensively and stably provide compound alloy metal balls of a high melting point excellent as connectors of electrical/electronic circuit components.
SOLUTION: The metal ball surfaces are provided with electroplating silver-copper alloy film layers and the silver content of the silver-copper alloy films is specified 5 to 97wt% and the film thickness to ≥0.5 μm. In addition, the metal balls are composed of single metal or alloy having the melting point higher than the melting point of the silver-copper alloy film layers. The metal balls which are minute, are excellent in sphericity and have uniform dimensional accuracy are produced by an equal liquid droplet spray process, plasma rotating electrode process or flushing process and thereafter the silver-copper alloy film layers of a uniform film thickness are formed by an electroplating process on the resultant metal ball surfaces. The compound alloy metal ball of the high melting point having excellent joining characteristics can thus be provided by taking advantage of the sphericity and dimensional accuracy of the workpiece metal balls.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：为了相对便宜且稳定地提供具有优异的电气/电子电路部件的连接器的高熔点的复合合金金属球。解决方案：金属球表面设有电镀银 - 铜合金膜层，银 - 铜合金膜的银含量为5-97重量％，膜厚为≥0.5μm。此外，金属球由熔点高于银 - 铜合金膜层的熔点的单一金属或合金构成。通过相等的液滴喷雾法，等离子体旋转电极法或冲洗法制造细小的球状，均匀的尺寸精度的金属球，其后通过以下方法形成均匀膜厚的银 - 铜合金膜层：在所得金属球表面上进行电镀工艺。因此，通过利用工件金属球的球形度和尺寸精度，可以提供具有优异接合特性的高熔点复合合金金属球。版权所有（C）2004，JPO

8. 发明专利

JP2012172190A Sealing agent solution, and sealing method using the same 有权
标题翻译：密封剂溶液和使用其的密封方法
公开(公告)号：JP2012172190A
公开(公告)日：2012-09-10
申请号：JP2011034739
申请日：2011-02-21
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , 株式会社大和化成研究所
发明人： SOGAWA AKIHIRO , NISHIMOTO YOSHIHIRO , YOSHIMOTO MASAKAZU
IPC分类号： C23C26/00
摘要： PROBLEM TO BE SOLVED: To provide a water-based sealing agent solution which does not contain organic solvents causing environmental pollution, is capable of carrying out a treatment without energization so as to respond to the treatment of a recent device with a small size and a high density, and is capable of carrying out the sealing treatment selectively and quantitatively to parts to be treated; and to provide a sealing method using the same.SOLUTION: The sealing agent solution for plating materials of noble metals or noble metal alloys includes: a nitrogen-containing five-membered cyclic compound having a mercapto group and not containing a benzene ring, as a first component; a linear alkane thiol having a carbon number of 10 or more and 20 or less, as a second component; and a nonionic surfactant, as a third component.
摘要翻译：要解决的问题：为了提供不含有引起环境污染的有机溶剂的水性密封剂溶液，能够在不通电的情况下进行处理，以便对具有小的尺寸和高密度，并且能够对待处理的部件选择性和定量地进行密封处理; 并提供使用该密封方法的密封方法。解决方案：贵金属或贵金属合金电镀材料的密封剂溶液包括：具有巯基并且不含苯环的含氮五元环化合物作为第一组分; 碳数为10以上且20以下的直链烷烃硫醇作为第二成分; 和非离子表面活性剂，作为第三组分。版权所有（C）2012，JPO＆INPIT

9. 发明专利

JP2010265491A Bath for tin or tin-alloy plating, and barrel-plating process using the plating bath 有权
标题翻译：用于镀锡或锡合金镀层的浴槽，以及使用镀锌浴的棒材工艺
公开(公告)号：JP2010265491A
公开(公告)日：2010-11-25
申请号：JP2009115600
申请日：2009-05-12
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , Ishihara Chem Co Ltd , 株式会社大和化成研究所 , 石原薬品株式会社
发明人： NISHIKAWA TETSUJI , TSUJI SEIKI , SASAYAMA HIROAKI , YOSHIMOTO MASAKAZU
IPC分类号： C25D3/32 , C25D3/56
摘要： PROBLEM TO BE SOLVED: To provide a plating bath which can enhance the uniformity and the like of a plated film in a wide range of current density, impart an adequate appearance and soldering characteristics to the plated film, and prevent the aggregation among electroconductive media and among articles to be plated, in a barrel-plating process. SOLUTION: A bath for tin or tin-alloy plating includes: (A) a soluble salt formed of either a stannous salt or a mixture of the stannous salt and a salt of a metal selected from the group consisting of silver, copper, bismuth, indium, zinc, antimony, nickel and lead; (B) an acid or a salt thereof; and (C) a dibenzazole disulfide sulfonate compound specifically such as dibenzothiazolyl disulphide disodium disulfonate. Because of including the compound (C), the plating bath can enhance the uniformity and smoothness of the film in the wide range of the current density, impart the superior appearance and soldering characteristics to the film, and prevent the aggregation among the electroconductive media, when having applied to a barrel-plating process. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供能够在宽的电流密度范围内提高电镀膜的均匀性等的镀液，赋予镀膜足够的外观和焊接特性，并且防止电镀膜之间的聚集导电介质和要镀覆的物品之间的电镀工艺。解决方案：用于锡或锡合金镀层的浴包括：（A）由亚锡盐或亚锡盐和选自银，铜的金属盐的混合物形成的可溶性盐，铋，铟，锌，锑，镍和铅; （B）酸或其盐; 和（C）二苯并唑二硫化物磺酸盐化合物，特别是二苯并噻唑基二硫化二磺酸二钠二钠。由于含有化合物（C），电镀液可以在电流密度的宽范围内提高膜的均匀性和平滑性，赋予膜优异的外观和焊接特性，并且防止导电介质之间的聚集，当应用于滚镀工艺时。版权所有（C）2011，JPO＆INPIT

10. 发明专利

JP2009185358A Tin and tin alloy plating bath, and electronic component formed with the plating film 有权
标题翻译：镀锌合金镀层和电镀元件与镀膜成膜
公开(公告)号：JP2009185358A
公开(公告)日：2009-08-20
申请号：JP2008028078
申请日：2008-02-07
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , Ishihara Chem Co Ltd , 株式会社大和化成研究所 , 石原薬品株式会社
发明人： NISHIKAWA TETSUJI , YOSHIMOTO MASAKAZU
IPC分类号： C25D3/32 , C23C18/48 , C23C18/52 , C25D3/60
摘要： PROBLEM TO BE SOLVED: To impart satisfactory film appearance stably with lapse of time to a grain refining agent of a film crystal to be added to a tin or tin alloy plating bath. SOLUTION: The tin or tin alloy plating bath includes (A) a stannous salt or a soluble salt comprised of a mixture composed of the stannous salt and a salt of a metal (for example, silver, copper, bismuth, etc.) selected from the groups VIII, IB, IIB, IIIA, IVA, VA from the fourth to the sixth period, (B) an acid or its salt, (C) a specific 2-mercaptobenzoazole derivative bonded with 3-6C alkylene with a mercapto group on the position 2 of benzoazole ring. Oxidation or cleavage is made to hardly arise by bonding of the 3-6C alkylene, and therefore, even if plating work progresses, the grain refining function lasts without declining, and the satisfactory film appearance can be of obtained stably with lapse of time. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了将待加入到锡或锡合金电镀液的膜晶体的晶粒细化剂经时地赋予令人满意的膜外观。锡或锡合金电镀浴包括（A）由亚锡盐和金属盐（例如银，铜，铋等）组成的混合物的亚锡盐或可溶性盐）选自第四至第六期的VIII，IB，IIB，IIIA，IVA，VA族，（B）酸或其盐，（C）与3-6C亚烷基键合的特异性2-巯基苯并恶唑衍生物与巯基在苯扎环2位上。通过3-6C亚烷基的键合几乎不发生氧化或裂解，因此即使电镀工作进行，晶粒细化功能也不会下降，可以随时间稳定地获得令人满意的膜外观。版权所有（C）2009，JPO＆INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式